Abstract: Methods of forming a structural color metal-dielectric-metal (MDM) component via a solution-based process are provided. First, a first metal layer is formed over a treated surface of a substrate by a first electroless deposition process. A surface of the treated substrate is contacted with a first plating bath that comprises a metal selected from the group consisting of: copper, aluminum, silver, alloys, and combinations thereof. A dielectric layer, for example, comprising silicon dioxide, is then deposited over the first metal layer by a sol-gel process. Next, the method comprises forming a second metal layer over the dielectric layer by a second electroless deposition process by contacting the dielectric layer with a second plating bath having a neutral pH and comprising a metal selected from the group consisting of: copper, aluminum, silver, alloys, and combinations thereof.

Abstract: Methods of forming a structural color metal-dielectric-metal (MDM) component via a solution-based process are provided. First, a first metal layer is formed over a treated surface of a substrate by a first electroless deposition process. A surface of the treated substrate is contacted with a first plating bath that comprises a metal selected from the group consisting of: copper, aluminum, silver, alloys, and combinations thereof. A dielectric layer, for example, comprising silicon dioxide, is then deposited over the first metal layer by a sol-gel process. Next, the method comprises forming a second metal layer over the dielectric layer by a second electroless deposition process by contacting the dielectric layer with a second plating bath having a neutral pH and comprising a metal selected from the group consisting of: copper, aluminum, silver, alloys, and combinations thereof.

Abstract: A method of forming a structural color filter includes: depositing a first metal layer on a surface of a substrate by applying an electric potential to the substrate; depositing a first dielectric layer on the first metal layer by contacting the first metal layer with a second electrolyte; and depositing a second metal layer on the first dielectric layer. The surface of the substrate is in contact with a first electrolyte; the first electrolyte comprises a first precursor, an electrochemical reaction of the first precursor at the surface of the substrate is driven by the electric potential; the depositing the first metal layer on the surface of the substrate is performed at a temperature of less than or equal to 50° C. The second electrolyte comprises a second precursor of a first dielectric material of the first dielectric layer.