Abstract: A method for measuring such parameters as height, position, shape, colinearity, and coplanarity of arrays of minute objects on the surface of integrated circuits, such as Ball Grid Arrays (BGA), all in one simple and straight forward procedure during the manufacturing process of integrated circuits. Shadows of the objects are created on the substrate through the use of x-rays or other light sources placed at predetermined distances and angles from the objects. An imaging device obtains images from the shadows cast onto the substrate and the images are then analyzed to determine if they meet predefined parameters. Multiple sources of illumination can be used to illuminate the array in order to create a more precise image for analysis and three dimensional images of the BGA can be created for analysis.