Abstract: A method of manufacturing a thermoelectric device comprising initially preparing thin coherent films of P and N type thermoelectric materials by evaporating the solvent from a suspension previously drawn over a surface, the suspension comprising the solvent, a binder and the thermoelectric material in powdered form. A coherent film of insulative material is similarly prepared. The coherent films are stacked in a hot press die with alternate P and N type thermoelectric films separated by the insulative film and subjected to heating and pressure during which the binders are volatilized so that the thermoelectric films are converted to solid, high density layers and the insulative films each become a cohesive layer which binds to the adjacent thermoelectric layers to form a monolithic laminate. Contacts electrically connecting the P and N type thermoelectric layers may be provided prior or subsequent to the pressing step.