Patents Assigned to O
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Publication number: 20190096871Abstract: To provide a field-effect transistor and a semiconductor device with improved ESD resistance.Type: ApplicationFiled: September 2, 2016Publication date: March 28, 2019Applicant: C/O SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventor: TAKAAKI TATSUMI
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Publication number: 20190095003Abstract: A transparent conductive film includes a substrate having opposed first and second surfaces; a first optical adjustment layer formed on the first surface; a first transparent conductive layer formed on the first optical adjustment layer; a first metal layer formed on the first transparent conductive layer; a second optical adjustment layer formed on the second surface; a second transparent conductive layer formed on the second optical adjustment layer; and a second metal layer formed on the second transparent conductive layer. At least one of the first optical adjustment layer and the second optical adjustment layer comprises a plurality of particles therein, such that a plurality of protrusions corresponding to the plurality of particles are formed on a surface of at least one of the first metal layer and the second metal layer.Type: ApplicationFiled: July 27, 2018Publication date: March 28, 2019Applicant: NANCHAGN O-FILM DISPLAY TECHNOLOGY CO.,LTDInventors: Hongyan CHEN, Rongzhi GU, Weiting HUANG, Xiaowei HOU
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Patent number: 10239307Abstract: A printing system for printing on a substantially planar surface of a 3D-object includes a printer for printing on the planar surface of the 3D-object and a controller configured to control printing of the printer. The printing system further includes a mask generation module configured to generate a mask having the shape of the planar surface from a 3D-model of the 3D-object and to provide the controller with the mask to prevent printing outside the planar surface according to the mask.Type: GrantFiled: June 9, 2017Date of Patent: March 26, 2019Assignee: OĆE-HOLDING B.V.Inventor: Catherine M. H. A. Le Maître
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Patent number: 10240817Abstract: A water heating system includes a tank, one or more heating elements mounted on the water heating system, and a first controller mounted on the tank. The first controller is coupled to the one or more heating elements and includes logic to activate and deactivate the heating elements according to a first threshold value. The water heater also includes a second controller that is selectively coupled to the first controller and configured to communicate the first threshold value to the first controller, and perform an additional function related to the operation of the water heater. The first controller is configured to receive the first threshold value from the second controller and control the one or more heating elements based on the received threshold value, and to control the one or more heating elements mounted on the water heating system in a physical absence of the second controller.Type: GrantFiled: June 9, 2015Date of Patent: March 26, 2019Assignee: A. O. SMITH CORPORATIONInventors: Terry G. Phillips, Wade C. Patterson
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Patent number: 10239174Abstract: The present invention provides a machine tool provided with a cover body having a simple structure, excellent operability, and low manufacturing cost. A tool post movement region one-side-closing cover part (9) for closing a tool post movement region open part (8) is configured so as to be: capable of expanding and contracting in a horizontal movement direction of a tool post (3); arranged facing the tool post (3); elongated by urging means (10) to press against the tool post (3) in a relatively slidable manner and close the tool post movement region open part (8); expanded and contracted by movement of the tool post (3) to hold the tool post movement region open part (8) in a closed state; and provided unconnected to the tool post (3) so that the tool post (3) is relatively slidable with respect to the tool post movement region open part (8) is held in a closed state.Type: GrantFiled: July 21, 2017Date of Patent: March 26, 2019Assignee: O-M LTD.Inventors: Takio Nakamura, Masaki Negami, Hirofumi Nakakubo, Akihiro Goto
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Publication number: 20190089881Abstract: A camera module includes: a circuit board; a photosensitive chip located on and coupled to the circuit board; a package body packaged on the circuit board; and a bracket located on a side of the package body away from the circuit board; wherein the bracket is provided with a step away from the package body, a sidewall of the step is inclined with respect to an optical axis of the camera module, a distance between the sidewall of the step and the optical axis gradually increase along a direction from the circuit to the package body, and an angle between the sidewall of the step and the optical axis ranges from 0.5° to 30°.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicants: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) CO.,LTD., NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190089885Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190089884Abstract: The present disclosure relates do a camera module and a photosensitive assembly thereof The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite lo the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190085565Abstract: A universal wraparound cover for a step includes opposed ends with equivalent number of multiple tabs and fasteners engaging the tabs through holes in the opposed ends to secure the cover to the step. Rear tabs include multiple reinforced attachment points, and the forward tabs include a single attachment point each. The wraparound cover can therefore be fitted over numerous side supported step types.Type: ApplicationFiled: September 19, 2018Publication date: March 21, 2019Applicant: PREST-O-FIT MANUFACTURING, INC.Inventor: J. David Prest
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Publication number: 20190089882Abstract: A photosensitive assembly includes a circuit board, photosensitive chip coupled to the circuit board, the photosensitive chip includes a photosensitive area on an upper surface thereof and a non-photosensitive area surrounding the photosensitive area, and a package body packaged on the circuit board and covering a portion of the non-photosensitive area of the photosensitive chip, the package body includes an inner surface, and the inner surface has a curved surface on an edge thereof contacting the non-photosensitive area.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190082873Abstract: A rug mounting system and method includes an elongate fastening driven into a flooring surface. The elongate fastener is coupled with a fastening area and a complementary fastener. The underside of the rug is fitted with a complementary fastening area and fastener. A flat item that includes the fastening area is affixed to the flooring surface, and the elongate fastener is applied to the flooring surface therethrough, thus exposing the lower end fasteners. The rug is then placed over both fastening types and mounted on the ground. One, or more, mounting systems may be used to secure a rug to the ground.Type: ApplicationFiled: September 19, 2018Publication date: March 21, 2019Applicant: PREST-O-FIT MANUFACTURING, INC.Inventor: J. David Prest
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Publication number: 20190088699Abstract: A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190086771Abstract: A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190089883Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly includes a circuit board, a photosensitive chip and a packaging body. The photosensitive chip is connected to the circuit board, and includes a photosensitive region and a non-photosensitive region surrounding the photosensitive region. The packaging body is formed on the circuit board and a portion of the non-photosensitive region of the photosensitive chip. The packaging body includes a top surface away from the photosensitive chip and an inner side surface connecting the top surface to the non-photosensitive region. A portion of the inner side surface adjacent to the top surface is a cambered surface, and the cambered surface has a larger surface area than an inclined plane, thus the cambered surface can carry more adhesive. In this way, it is possible to effectively prevent the adhesive from flowing to the photosensitive region of the photosensitive chip.Type: ApplicationFiled: September 15, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Publication number: 20190088698Abstract: A camera module includes a circuit board, a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package body packaged on the circuit board, and a bracket located on a side of the package body away from the circuit board. The package body includes a bearing surface away from the circuit board, and the bracket includes a first surface adjacent to the package body. A ratio between an area of the first surface and an area of the bearing surface is about 0.5 to about 1.2.Type: ApplicationFiled: September 14, 2018Publication date: March 21, 2019Applicant: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.Inventors: Chengzhe SHEN, Jun FENG, Shumin ZHU, Shengyun ZHANG, Wenhua SHUAI, Dong TANG
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Patent number: 10231741Abstract: A coupling mechanism designed to removably attach a reamer to the distal end of a spindle or shaft is disclosed. The coupling comprises a collar having an annular sidewall that defines a collar throughbore, the collar annular sidewall comprising a plurality of spaced part first slots that at least partially extend through the sidewall and a shank disposed within the collar throughbore. The shank is constructed with a shank annular sidewall in which a plurality of spaced apart second slots at least partially extend therethrough. A bias member that provides a bias force in a distal direction that acts on the collar is incorporated within the mechanism. The collar is capable of sliding in an axial direction such that the first and second slots become aligned to secure the cross bar of a reamer therein.Type: GrantFiled: July 1, 2016Date of Patent: March 19, 2019Assignee: Viant AS&O Holdings, LLCInventors: Jonathan P. Crandall, Jia Li, Kenton A. Walz, Paul Alejandro
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Patent number: 10232225Abstract: Systems and methods for obtaining golf-related data involving the electronics in a golf ball, a golf club, a wearable device, and a smart device for obtaining golf-related data are disclosed. The golf ball includes one or more of a gyroscope, an accelerometer, and a magnetometer to measure data related to the golf ball. The golf club includes one or more of a gyroscope, an accelerometer, and a magnetometer to measure data related to the golf club. The wearable device includes one or more of a gyroscope, an accelerometer, and a magnetometer to measure data related to the wearable device. The smart device includes a processor that is configured to calculate additional data using at least one of the data related to the golf ball, the data related to the golf club, and the data related to the wearable device. Counterpart methods and computer-readable medium embodiments are also provided.Type: GrantFiled: May 24, 2016Date of Patent: March 19, 2019Assignee: Mitchell O Enterprises LLCInventors: Steve Oberc, Hare Patnaik, Subra Ganesan
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Patent number: 10237421Abstract: A printer is provided. The printer has a printer body enclosing an interior, a screen, a camera, and a processor communicatively coupled to the camera. The screen overlies an exterior of at least a portion of the printer body. The camera is disposed within the interior and is configured to capture an image hereof. The processor is configured, by an analytical diagnostic software program, to display the captured image on the screen, thereby simulating a see-through view into the interior. Methods are also provided for identifying a source of a problem in the printer.Type: GrantFiled: December 22, 2016Date of Patent: March 19, 2019Assignee: DATAMAX-O'NEIL CORPORATIONInventors: Scott Houle, Thomas Celinder
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Patent number: 10232628Abstract: A system for removably retaining a print head assembly includes a bracket holding a print head assembly and a shaft for receiving the bracket on the shaft. The shaft includes a retaining assembly, a first shaft section having a profile geometry to allow the bracket to be received onto the shaft, a second shaft section having a profile geometry preventing removal of the bracket from the shaft, and a positioning assembly configured to resiliently engage the bracket. When the bracket is received on the shaft at the first shaft section, the positioning assembly can engage and releasably reposition the bracket onto the second shaft section and against the retaining assembly.Type: GrantFiled: December 8, 2017Date of Patent: March 19, 2019Assignee: DATAMAX-O'NEIL CORPORATIONInventors: Yaw Horng Yap, Boon Kheng Lim, Florante Sumalinog Go
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Patent number: D843305Type: GrantFiled: April 25, 2017Date of Patent: March 19, 2019Assignee: AEROMOBIL R&D, S. R. O.Inventors: Kenneth Douglas Alexander MacAndrew, William Simon Rooms, Tomás Urík, Adam Danko, Alan Roach