Patents Assigned to OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
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Patent number: 12084745Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.Type: GrantFiled: March 4, 2021Date of Patent: September 10, 2024Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and TechnologyInventors: Ryusuke Tsubota, Yohei Oka, Akira Okamoto, Takayuki Nakamoto, Takahiro Sugahara, Naruaki Shinomiya, Mamoru Takemura, Sohei Uchida
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Patent number: 12037507Abstract: This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.Type: GrantFiled: November 5, 2019Date of Patent: July 16, 2024Assignees: Osaka Research Institute of Industrial Science and Technology, KOA CorporationInventors: Keiko Ohtsuka, Morio Yonekawa, Hajime Kimura, Ken Yoshioka, Nobuhiro Kanamaru, Masaki Suwa, Kazumi Machida
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Publication number: 20240222633Abstract: One of the purposes of the present invention is to provide: a compound which can be used as a binder having ion conductivity; and a battery which contains the compound. One aspect of the present invention is a compound comprising P and S as constituent elements, a group comprising one or more elements selected from the group consisting of O, N and halogen, the group bonding to the P, and a disulfide bond.Type: ApplicationFiled: April 22, 2022Publication date: July 4, 2024Applicants: IDEMITSU KOSAN CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Atsutaka KATO, Mari YAMAMOTO, Masanari TAKAHASHI, Futoshi UTSUNO, Hiroyuki HIGUCHI
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Publication number: 20240194462Abstract: A sputtering apparatus includes: target holders holding targets facing each other; a substrate holder on a side of a plasma generation region between the targets; main magnetic field generation units on the back surface sides of the target holders to generate main magnetic fields on surfaces of the targets in which magnets are disposed such that opposite poles face each other; a power supply to generate an electric field in a plasma generation region; a radio-frequency electromagnetic field generation unit to generate a radio-frequency electromagnetic field on a side of the plasma generation region facing the substrate holder with the plasma generation region between them; and a plasma source gas introduction unit to introduce a plasma source gas into the plasma generation region, wherein a device for generating a magnetic field does not exist at the ends of the target holders on a side of radio-frequency electromagnetic field generation unit.Type: ApplicationFiled: April 26, 2022Publication date: June 13, 2024Applicants: EMD CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Akinori EBE, Yusuke KONDO, Yoshiharu KAKEHI, Kazuo SATOH, Shiro IKUHARA, Shinichi IWASAKI, Soichi OGAWA
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Publication number: 20240035209Abstract: Provided is a sensing fiber member which can be processed in long lengths, which excels in mass production, which is supple and has an excellent texture, and which is much less costly than a contact sensing fiber member (a piezoelectric yarn) for which a conventional piezoelectric material is used. This sensing fiber member has at least two covering yarns for which covering is achieved by wrapping an insulating fiber serving as a covering material in one direction around a linear conductor constituting a core material, two of the covering yarns being arranged close to each other. The sensing fiber member is characterized by reading changes in resistance and/or changes in capacitance between the linear conductors of the two covering yarns arranged close to each other.Type: ApplicationFiled: December 23, 2021Publication date: February 1, 2024Applicants: Asahi Kasei Advance Corporation, Osaka Research Institute of Industrial Science and Technology, Kaji Nylon .IncInventors: Mayumi Uno, Mariko Omori, Shigeru Morita, Kansei Yoshimura
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Publication number: 20240010813Abstract: A resin composition containing a compound including phosphorus and sulfur as constituent elements and having a disulfide bond, and a thermoplastic resin.Type: ApplicationFiled: November 5, 2021Publication date: January 11, 2024Applicants: IDEMITSU KOSAN CO.,LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Atsutaka KATO, Mari YAMAMOTO, Masanari TAKAHASHI, Futoshi UTSUNO, Hiroyuki HIGUCHI
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Patent number: 11864314Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.Type: GrantFiled: December 18, 2019Date of Patent: January 2, 2024Assignees: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Kohei Hayashi, Soichi Obata, Yasuhiro Shirotani, Masashi Nitani, Mayumi Uno, Kazuki Maeda
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Patent number: 11835426Abstract: A vibration control system calculates a Kurtosis Response Spectrum (KRS) of a response waveform which characterizes non-Gaussianity in a random vibration test and is utilized for vibration control. The system compares a target KRS and the response KRS, and controls a characteristic of a phase used to generate a waveform for control such that the response KRS becomes equal to the target KRS. The waveform for control is generated by applying a random phase to each frequency component of an amplitude corresponding to Power Spectral Density (PSD). The system controls a characteristic of this phase (e.g., standard deviation) per frequency, controls the KRS, deforms the waveform for control on the basis of an equalization characteristic, and calculates a drive waveform. The system sequentially updates the equalization characteristic on the basis of the response waveform and the drive waveform. The calculated drive waveform is provided to a vibration generator.Type: GrantFiled: March 28, 2022Date of Patent: December 5, 2023Assignees: Osaka Research Institute of Industrial Science and Technology, IMV CORPORATIONInventors: Akira Hosoyama, Yuji Nakaura, Yoshikado Yamauchi
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Patent number: 11786951Abstract: The manufacturing apparatus for a metal component includes: a preheating portion configured to locally induction-heat a metal plate; and a stamping portion configured to stamp the metal plate. The preheating portion includes a heating coil. The heating coil is arranged such that an axial direction of the heating coil is along a movement direction of the pressing portion and the heating coil faces, in the axial direction, an area where an amount of deformation is relatively large in a processing region of the metal plate to be stamped by the stamping portion. The heating coil is configured such that at least a part of the area where the amount of deformation is relatively large in the processing region of the metal plate is heated to a higher temperature than an area where the amount of deformation is relatively small in the processing region.Type: GrantFiled: December 28, 2017Date of Patent: October 17, 2023Assignees: ISHIZAKI PRESS INDUSTRIAL CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Taizo Ishizaki, Naruaki Shinomiya, Nobuhiko Shirakawa
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Publication number: 20220376291Abstract: A compound comprising phosphorus atoms and sulfur atoms as constituent elements and having a peak in Raman spectroscopy, the peak being attributable to a disulfide bond bonding between two phosphorus atoms.Type: ApplicationFiled: July 17, 2020Publication date: November 24, 2022Applicants: IDEMITSU KOSAN CO.,LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Atsutaka KATO, Mari YAMAMOTO, Masanari TAKAHASHI, Futoshi UTSUNO, Hiroyuki HIGUCHI
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Publication number: 20220117083Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.Type: ApplicationFiled: December 18, 2019Publication date: April 14, 2022Applicants: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Kohei HAYASHI, Soichi OBATA, Yasuhiro SHIROTANI, Masashi NITANI, Mayumi UNO, Kazuki MAEDA
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Publication number: 20210387255Abstract: The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 ?m or more and 150 ?m or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.Type: ApplicationFiled: November 29, 2019Publication date: December 16, 2021Applicants: MEC COMPANY., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Daisuke KATAYAMA, Masato NAKAZAWA, Kaori IGAMI, Takahiro SUGAHARA, Takayuki NAKAMOTO, Takao MIKI, Sohei UCHIDA
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Patent number: 11178764Abstract: A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.Type: GrantFiled: December 25, 2018Date of Patent: November 16, 2021Assignees: Pi-Crystal Incorporation, Osaka Research Institute of Industrial Science and TechnologyInventors: Mayumi Uno, Kazuki Maeda, Masashi Nitani, Busang Cha, Junichi Takeya
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Patent number: 11147162Abstract: A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.Type: GrantFiled: December 25, 2018Date of Patent: October 12, 2021Assignees: Pi-Crystal Incorporation, Osaka Research Institute of Industrial Science and TechnologyInventors: Mayumi Uno, Kazuki Maeda, Masashi Nitani, Busang Cha, Junichi Takeya
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Patent number: 11084915Abstract: Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.Type: GrantFiled: December 26, 2016Date of Patent: August 10, 2021Assignees: Sumitomo Seika Chemicals Co., Ltd., Osaka Research Institute of Industrial Science and TechnologyInventors: Kiyoshi Nishioka, Hiroki Maeda, Kei Ishikura, Kimihiro Matsukawa, Yukiyasu Kashiwagi, Masashi Saitoh
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Patent number: 11077495Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.Type: GrantFiled: July 24, 2017Date of Patent: August 3, 2021Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and TechnologyInventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Takayuki Nakamoto, Takahiro Sugahara, Mamoru Takemura, Sohei Uchida
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Patent number: 11046787Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.Type: GrantFiled: May 9, 2018Date of Patent: June 29, 2021Assignees: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATIONInventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
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Publication number: 20210187902Abstract: The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.Type: ApplicationFiled: February 28, 2017Publication date: June 24, 2021Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
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Publication number: 20210187614Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.Type: ApplicationFiled: March 4, 2021Publication date: June 24, 2021Applicants: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and TechnologyInventors: Ryusuke TSUBOTA, Yohei OKA, Akira OKAMOTO, Takayuki NAKAMOTO, Takahiro SUGAHARA, Naruaki SHINOMIYA, Mamoru TAKEMURA, Sohei UCHIDA
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Patent number: 10981226Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.Type: GrantFiled: October 24, 2017Date of Patent: April 20, 2021Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and TechnologyInventors: Ryusuke Tsubota, Yohei Oka, Akira Okamoto, Takayuki Nakamoto, Takahiro Sugahara, Naruaki Shinomiya, Mamoru Takemura, Sohei Uchida