Patents Assigned to OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
  • Patent number: 12084745
    Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: September 10, 2024
    Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke Tsubota, Yohei Oka, Akira Okamoto, Takayuki Nakamoto, Takahiro Sugahara, Naruaki Shinomiya, Mamoru Takemura, Sohei Uchida
  • Patent number: 12037507
    Abstract: This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: July 16, 2024
    Assignees: Osaka Research Institute of Industrial Science and Technology, KOA Corporation
    Inventors: Keiko Ohtsuka, Morio Yonekawa, Hajime Kimura, Ken Yoshioka, Nobuhiro Kanamaru, Masaki Suwa, Kazumi Machida
  • Publication number: 20240222633
    Abstract: One of the purposes of the present invention is to provide: a compound which can be used as a binder having ion conductivity; and a battery which contains the compound. One aspect of the present invention is a compound comprising P and S as constituent elements, a group comprising one or more elements selected from the group consisting of O, N and halogen, the group bonding to the P, and a disulfide bond.
    Type: Application
    Filed: April 22, 2022
    Publication date: July 4, 2024
    Applicants: IDEMITSU KOSAN CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Atsutaka KATO, Mari YAMAMOTO, Masanari TAKAHASHI, Futoshi UTSUNO, Hiroyuki HIGUCHI
  • Publication number: 20240194462
    Abstract: A sputtering apparatus includes: target holders holding targets facing each other; a substrate holder on a side of a plasma generation region between the targets; main magnetic field generation units on the back surface sides of the target holders to generate main magnetic fields on surfaces of the targets in which magnets are disposed such that opposite poles face each other; a power supply to generate an electric field in a plasma generation region; a radio-frequency electromagnetic field generation unit to generate a radio-frequency electromagnetic field on a side of the plasma generation region facing the substrate holder with the plasma generation region between them; and a plasma source gas introduction unit to introduce a plasma source gas into the plasma generation region, wherein a device for generating a magnetic field does not exist at the ends of the target holders on a side of radio-frequency electromagnetic field generation unit.
    Type: Application
    Filed: April 26, 2022
    Publication date: June 13, 2024
    Applicants: EMD CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Akinori EBE, Yusuke KONDO, Yoshiharu KAKEHI, Kazuo SATOH, Shiro IKUHARA, Shinichi IWASAKI, Soichi OGAWA
  • Publication number: 20240035209
    Abstract: Provided is a sensing fiber member which can be processed in long lengths, which excels in mass production, which is supple and has an excellent texture, and which is much less costly than a contact sensing fiber member (a piezoelectric yarn) for which a conventional piezoelectric material is used. This sensing fiber member has at least two covering yarns for which covering is achieved by wrapping an insulating fiber serving as a covering material in one direction around a linear conductor constituting a core material, two of the covering yarns being arranged close to each other. The sensing fiber member is characterized by reading changes in resistance and/or changes in capacitance between the linear conductors of the two covering yarns arranged close to each other.
    Type: Application
    Filed: December 23, 2021
    Publication date: February 1, 2024
    Applicants: Asahi Kasei Advance Corporation, Osaka Research Institute of Industrial Science and Technology, Kaji Nylon .Inc
    Inventors: Mayumi Uno, Mariko Omori, Shigeru Morita, Kansei Yoshimura
  • Publication number: 20240010813
    Abstract: A resin composition containing a compound including phosphorus and sulfur as constituent elements and having a disulfide bond, and a thermoplastic resin.
    Type: Application
    Filed: November 5, 2021
    Publication date: January 11, 2024
    Applicants: IDEMITSU KOSAN CO.,LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Atsutaka KATO, Mari YAMAMOTO, Masanari TAKAHASHI, Futoshi UTSUNO, Hiroyuki HIGUCHI
  • Patent number: 11864314
    Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: January 2, 2024
    Assignees: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Kohei Hayashi, Soichi Obata, Yasuhiro Shirotani, Masashi Nitani, Mayumi Uno, Kazuki Maeda
  • Patent number: 11835426
    Abstract: A vibration control system calculates a Kurtosis Response Spectrum (KRS) of a response waveform which characterizes non-Gaussianity in a random vibration test and is utilized for vibration control. The system compares a target KRS and the response KRS, and controls a characteristic of a phase used to generate a waveform for control such that the response KRS becomes equal to the target KRS. The waveform for control is generated by applying a random phase to each frequency component of an amplitude corresponding to Power Spectral Density (PSD). The system controls a characteristic of this phase (e.g., standard deviation) per frequency, controls the KRS, deforms the waveform for control on the basis of an equalization characteristic, and calculates a drive waveform. The system sequentially updates the equalization characteristic on the basis of the response waveform and the drive waveform. The calculated drive waveform is provided to a vibration generator.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: December 5, 2023
    Assignees: Osaka Research Institute of Industrial Science and Technology, IMV CORPORATION
    Inventors: Akira Hosoyama, Yuji Nakaura, Yoshikado Yamauchi
  • Patent number: 11786951
    Abstract: The manufacturing apparatus for a metal component includes: a preheating portion configured to locally induction-heat a metal plate; and a stamping portion configured to stamp the metal plate. The preheating portion includes a heating coil. The heating coil is arranged such that an axial direction of the heating coil is along a movement direction of the pressing portion and the heating coil faces, in the axial direction, an area where an amount of deformation is relatively large in a processing region of the metal plate to be stamped by the stamping portion. The heating coil is configured such that at least a part of the area where the amount of deformation is relatively large in the processing region of the metal plate is heated to a higher temperature than an area where the amount of deformation is relatively small in the processing region.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: October 17, 2023
    Assignees: ISHIZAKI PRESS INDUSTRIAL CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Taizo Ishizaki, Naruaki Shinomiya, Nobuhiko Shirakawa
  • Publication number: 20220376291
    Abstract: A compound comprising phosphorus atoms and sulfur atoms as constituent elements and having a peak in Raman spectroscopy, the peak being attributable to a disulfide bond bonding between two phosphorus atoms.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 24, 2022
    Applicants: IDEMITSU KOSAN CO.,LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Atsutaka KATO, Mari YAMAMOTO, Masanari TAKAHASHI, Futoshi UTSUNO, Hiroyuki HIGUCHI
  • Publication number: 20220117083
    Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 ?m.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 14, 2022
    Applicants: KURARAY CO., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Kohei HAYASHI, Soichi OBATA, Yasuhiro SHIROTANI, Masashi NITANI, Mayumi UNO, Kazuki MAEDA
  • Publication number: 20210387255
    Abstract: The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 ?m or more and 150 ?m or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.
    Type: Application
    Filed: November 29, 2019
    Publication date: December 16, 2021
    Applicants: MEC COMPANY., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Daisuke KATAYAMA, Masato NAKAZAWA, Kaori IGAMI, Takahiro SUGAHARA, Takayuki NAKAMOTO, Takao MIKI, Sohei UCHIDA
  • Patent number: 11178764
    Abstract: A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: November 16, 2021
    Assignees: Pi-Crystal Incorporation, Osaka Research Institute of Industrial Science and Technology
    Inventors: Mayumi Uno, Kazuki Maeda, Masashi Nitani, Busang Cha, Junichi Takeya
  • Patent number: 11147162
    Abstract: A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: October 12, 2021
    Assignees: Pi-Crystal Incorporation, Osaka Research Institute of Industrial Science and Technology
    Inventors: Mayumi Uno, Kazuki Maeda, Masashi Nitani, Busang Cha, Junichi Takeya
  • Patent number: 11084915
    Abstract: Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: August 10, 2021
    Assignees: Sumitomo Seika Chemicals Co., Ltd., Osaka Research Institute of Industrial Science and Technology
    Inventors: Kiyoshi Nishioka, Hiroki Maeda, Kei Ishikura, Kimihiro Matsukawa, Yukiyasu Kashiwagi, Masashi Saitoh
  • Patent number: 11077495
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: August 3, 2021
    Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Takayuki Nakamoto, Takahiro Sugahara, Mamoru Takemura, Sohei Uchida
  • Patent number: 11046787
    Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: June 29, 2021
    Assignees: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATION
    Inventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
  • Publication number: 20210187902
    Abstract: The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 24, 2021
    Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
  • Publication number: 20210187614
    Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.
    Type: Application
    Filed: March 4, 2021
    Publication date: June 24, 2021
    Applicants: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke TSUBOTA, Yohei OKA, Akira OKAMOTO, Takayuki NAKAMOTO, Takahiro SUGAHARA, Naruaki SHINOMIYA, Mamoru TAKEMURA, Sohei UCHIDA
  • Patent number: 10981226
    Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: April 20, 2021
    Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke Tsubota, Yohei Oka, Akira Okamoto, Takayuki Nakamoto, Takahiro Sugahara, Naruaki Shinomiya, Mamoru Takemura, Sohei Uchida