Patents Assigned to OSRAM
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Publication number: 20220077067Abstract: In an embodiment a component includes a semiconductor chip, a connection member and a carrier, wherein the semiconductor chip is mechanically and electrically connected to the carrier via the connection member, wherein the connection member includes a contiguous metallic connecting layer and a plurality of metallic through-vias extending vertically through the connecting layer and being laterally spaced from the connecting layer by insulating regions, wherein the insulating regions are filled with a gaseous medium and are hermetically sealed, and wherein the gaseous medium contains an insulating gas having a higher breakdown field strength compared to nitrogen, or wherein a gas pressure is less than 1 mbar in the hermetically sealed insulating regions.Type: ApplicationFiled: January 10, 2020Publication date: March 10, 2022Applicant: OSRAM Opto Semiconductors GmbHInventor: Andreas Plößl
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Patent number: 11271140Abstract: A method for manufacturing a plurality of surface mounted optoelectronic devices and a surface mounted optoelectronic device are disclosed. In an embodiment, a surface mounted optoelectronic device includes a transparent base body having a mounting rear side, a radiation exit side opposite the mounting rear side, and mounting side surfaces which are each disposed transversely to the radiation exit side, a semiconductor layer sequence disposed laterally to at least one mounting side surface and a terminal contact extending from the at least one mounting side surface to the mounting rear side, wherein the semiconductor layer sequence includes an active region configured to emit radiation so that the radiation decouples from the surface mounted optoelectronic device via the radiation exit side of the base body.Type: GrantFiled: March 20, 2018Date of Patent: March 8, 2022Assignee: OSRAM OLED GMBHInventor: Siegfried Herrmann
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Patent number: 11271143Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.Type: GrantFiled: September 30, 2020Date of Patent: March 8, 2022Assignee: OSRAM Opto Semiconductors GmbHInventors: Laura Kreiner, Andreas Leber, Siegfried Herrmann, Christine Rafael, Eva-Maria Rummel, Nicole Heitzer, Marie Assmann
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Patent number: 11271141Abstract: A light-emitting device including a light-emitting semiconductor chip having a semiconductor layer sequence having at least one light-emitting semiconductor layer and a light-outcoupling surface, the light-emitting device further including a wavelength conversion layer arranged on the light-outcoupling surface, the wavelength conversion layer including quantum dots.Type: GrantFiled: November 26, 2018Date of Patent: March 8, 2022Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Maria J. Anc, Darshan Kundaliya, Madis Raukas, David O'Brien
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Patent number: 11259471Abstract: A cover member for an in-store greenhouse is disclosed, with which radiation exiting the in-store greenhouse can be influenced or modified, so that outgoing total radiation has a white color on the Planck curve.Type: GrantFiled: May 23, 2017Date of Patent: March 1, 2022Assignee: OSRAM GmbHInventors: Guido Angenendt, Timo Bongartz, Norbert Haas
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Patent number: 11262029Abstract: A lighting device includes at least one semiconductor light source, at least one incandescent filament configured to emit electromagnetic radiation when energized, and a carrier supporting both the semiconductor light source and the incandescent filament. A screen is defined by the carrier between the semiconductor light source and the incandescent filament, so as to shield the semiconductor light source from the electromagnetic radiation emitted by the incandescent filament. The incandescent filament connected in series with the at least one semiconductor light source.Type: GrantFiled: July 23, 2019Date of Patent: March 1, 2022Assignee: OSRAM Beteiligungsverwaltung GmbHInventor: Sebastian Jooss
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Patent number: 11264550Abstract: A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.Type: GrantFiled: April 18, 2018Date of Patent: March 1, 2022Assignee: OSRAM OLED GMBHInventors: Martin Rudolf Behringer, Alexander F. Pfeuffer, Andreas Plößl, Georg Bogner, Berthold Hahn, Frank Singer
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Patent number: 11257424Abstract: A display device is disclosed. In an embodiment a display device includes a plurality of image points, each image point comprising at least one active region configured to generate first radiation, a carrier including a drive circuit for the plurality of image points and a detector assigned to at least some image points, the detector configured to receive second radiation, wherein at least some image points are configured to act either as an emitter or as a detector during operation of the display device.Type: GrantFiled: February 19, 2019Date of Patent: February 22, 2022Assignee: OSRAM OLED GMBHInventors: Thorsten Frank Baumheinrich, Hubert Halbritter
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Patent number: 11254865Abstract: A method of manufacturing a conversion element is disclosed. A precursor material is selected from one or more of lutetium, aluminum and a rare-earth element. The precursor material is mixed with a binder and a solvent to obtain a slurry. A green body is formed from the slurry and the green body is sintered to obtain the conversion element. The sintering is performed at a temperature of more than 1720° C.Type: GrantFiled: August 10, 2018Date of Patent: February 22, 2022Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Darshan Kundaliya, Jeffery J. Serre, James Avallon, Kathleen A. Lawson
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Patent number: 11258020Abstract: A method produces cross-linked hole-conducting electric layers by converting functionalized p-dopants. The functionalized p-dopants are organic metal complexes containing at least one central atom and organic ligands, wherein the central atom is selected from a metal of the groups 6-15 of the periodic table, and at least one of the organic ligands is selected from the following formulas I-V, in which E independently of one another is oxygen, sulfur, selenium, or N(E1)x, and each Rv has at least one functionalizing group selected from the group RF including —OH, —COOH, —NH2, —NHR?, halogen, C2-C40-alkenyl, -dienyl, -alkinyl, -alkenyloxy, -dienyloxy, -alkinyloxy, acrylic acid, oxetan, oxiran, silane, acrylic acid, anhydride, and cyclobutane or consists of the groups, and G=C(RF)uHvFw where u+v+w=3 and n=1-4.Type: GrantFiled: June 14, 2017Date of Patent: February 22, 2022Assignees: OSRAM OLED GmbH, MERCK Patent GmbHInventors: Günter Schmid, Florian Kessler, Katja Stegmaier, Fabrice Eckes, Holger Heil, Beate Burkhart, Henning Seim
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Patent number: 11257705Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.Type: GrantFiled: January 24, 2018Date of Patent: February 22, 2022Assignee: OSRAM OLED GmbHInventors: Daniel Richter, Gunnar Petersen, Konrad Wagner
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Publication number: 20220053617Abstract: The systems and methods disclosed herein include a LED driver, including a current output module configured to generate a constant current output split between a plurality of output channels, each output channel connected to one or more LEDs having an associated CCT value, at least one switch encoding a plurality of lumen settings and a plurality of CCT settings, and at least one circuit coupled to the current output module and the switch, the at least one circuit configured to determine a first lumen setting from the plurality of lumen settings encoded by the at least one switch, adjust the constant current output of the current output module based on the first lumen setting, determine a first CCT setting from the plurality of CCT settings encoded by the at least one switch, and adjust the plurality of output channels of the current output module based on the first CCT setting.Type: ApplicationFiled: August 11, 2020Publication date: February 17, 2022Applicant: Osram Sylvania Inc.Inventors: Hang Zhang, Peng Xiao, Tiberiu Antohi
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Patent number: 11251081Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.Type: GrantFiled: October 25, 2018Date of Patent: February 15, 2022Assignee: OSRAM OLED GMBHInventors: Thomas Schwarz, Lutz Höppel, Thorsten Frank Baumheinrich, Jens Richter
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Patent number: 11251587Abstract: A laser diode and a method for manufacturing a laser diode are disclosed. In an embodiment a laser diode includes a surface emitting semiconductor laser configured to emit electromagnetic radiation and an optical element arranged downstream of the semiconductor laser in a radiation direction, wherein the optical element includes a diffractive structure or a meta-optical structure or a lens structure, and wherein the optical element and the semiconductor laser are cohesively connected to each other.Type: GrantFiled: May 30, 2018Date of Patent: February 15, 2022Assignee: OSRAM OLED GMBHInventors: Frank Singer, Hubert Halbritter
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Patent number: 11252802Abstract: A circuit arrangement for an LED luminaire comprises a plurality of LED strings, an anode terminal line, a cathode terminal line, a plurality of first switching elements, connected in series into the anode terminal line and subdivided into individual line sections, and a plurality of second switching elements, connected in series into the cathode terminal line and subdivided into individual line sections. Each of the LED strings may be connected to the anode terminal line via a first switching element and/or the second switching elements. Each of the first switching elements may be configured to feed an operating current to an LED string, to electrically connect line sections if the current flowing through the LED string exceeds a predetermined value, and to electrically isolate line sections if the current flowing through the LED string falls below a predetermined value.Type: GrantFiled: January 21, 2021Date of Patent: February 15, 2022Assignee: OSRAM GmbHInventors: Klaus Fischer, Felix Franck
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Patent number: 11251347Abstract: A semiconductor light source includes at least one first emission unit, at least one second emission unit, and an optics, wherein the optical system has an inner region that converges radiation from the first emission unit, the optical system has an outer region that expands radiation from the second emission unit, a first light emission region of the inner region completely covers the first emission unit when viewed in plan view, and at least partially covers the second emission unit, a second light emission region of the outer region is partially or completely beside the second emission unit when viewed in plan view, and the inner region and the outer region have differently shaped light entry regions.Type: GrantFiled: May 30, 2018Date of Patent: February 15, 2022Assignee: OSRAM OLED GmbHInventors: Ulrich Streppel, Désirée Queren
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Patent number: 11245246Abstract: A semiconductor laser diode includes a semiconductor body having an emitter region; and a first connection element that electrically contacts the semiconductor body in the emitter region, wherein the semiconductor body is in contact with the first connection element in the emitter region, and at least in places in the emitter region, the semiconductor body has a structuring that enlarges a contact area between the semiconductor body and the first connection element.Type: GrantFiled: May 31, 2017Date of Patent: February 8, 2022Assignee: OSRAM OLED GmbHInventor: Wolfgang Reill
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Publication number: 20220035338Abstract: The systems and methods disclosed herein include a handheld programmer for replacing LED drivers in the field. The handheld programmer includes a communications module configured to communicate with a first light emitting diode (LED) driver and a second LED driver, and a processor configured to read a plurality of settings from the first LED driver and program the second LED driver with the plurality of settings from the first LED driver.Type: ApplicationFiled: August 3, 2020Publication date: February 3, 2022Applicant: Osram Sylvania Inc.Inventors: Peng Xiao, Alex Oksengendler, Shashank Nalla, Naveen Tumula
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Patent number: 11239398Abstract: An optoelectronic semiconductor component may include at least one optoelectronic semiconductor chip, a reflector, a lens, and a connecting layer. The reflector may have a reflector recess where the semiconductor chip may be arranged. The lens may be fully located in the reflector recess, and the lens may have a lens recess. The connecting layer may fasten the lens on the reflector. The lens may have a lens outer side facing toward a reflector inner wall of the reflector recess. A gap may be between the reflector and the lens, and the gap may be filled only partially with the connecting layer. The semiconductor chip may not touch the lens. The optoelectronic semiconductor component may be incorporated into a biometric sensor.Type: GrantFiled: July 26, 2018Date of Patent: February 1, 2022Assignee: OSRAM OLED GMBHInventors: Thomas Kippes, Claus Jaeger, Jason Rajakumaran
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Patent number: 11239386Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.Type: GrantFiled: April 17, 2020Date of Patent: February 1, 2022Assignee: OSRAM Opto Semiconductors GmbHInventors: Karl Weidner, Ralph Wirth, Axel Kaltenbacher, Walter Wegleiter, Bernd Barchmann, Oliver Wutz, Jan Marfeld
