Patents Assigned to Rockwell International Corp.
  • Patent number: 5420464
    Abstract: An RF voltage/current sensor apparatus comprising a plurality of transmission lines coupled through resistive means to voltage sense circuitry. The voltage sense circuitry utilizes transistor technology thereby reducing the use of switching relays, transformers and diodes thereby providing an apparatus operational over a frequency range from approximately two megahertz to two gigahertz.
    Type: Grant
    Filed: October 30, 1992
    Date of Patent: May 30, 1995
    Assignee: Rockwell International Corp.
    Inventor: David L. Krett
  • Patent number: 5416385
    Abstract: An apparatus and method of controlling the light intensity in a light source of variable emission affected by a drive signal. Spatial optical integration based upon light summation is incorporated into the accompanying encasement device at a backlight source by means of a light source support structure that allows light not directed toward a viewed surface, such as an LCD, to serve as a control input to the light drive signal.
    Type: Grant
    Filed: September 2, 1993
    Date of Patent: May 16, 1995
    Assignee: Rockwell International Corp.
    Inventor: Ronald M. Hau
  • Patent number: 5415500
    Abstract: A method and apparatus for forming cleanly defined holes through reinforced metal matrix material includes a drill bit with a shank portion and flutes on said shank portion, the drill bit capable of withstanding a chip load of at least about 0.008 inch/rev/flute, and preferably in the range of from about 0.008 inch/rev/flute to about 0.012 inch/rev/flute, achieved through turning the bit at a speed within the range of about 18 surface feet per minute ("sfpm") to about 20 sfpm, and advancing the bit at an aggressive rate through the metal matrix material at a rate of from about 3 inches per minute to about 6 inches per minute.
    Type: Grant
    Filed: October 4, 1993
    Date of Patent: May 16, 1995
    Assignee: Rockwell International Corp.
    Inventors: Leo M. Delangis, Howard P. Stuart, Richard F. Vyhnal
  • Patent number: 5408616
    Abstract: An electronic library system cabinet having a ring bus architecture with a high reliability backplane wherein the electronic library system includes a plurality of slots for receiving a plurality of modules therein. The modules capability of determining whether the adjacent slot is occupied by a module and alternately directing output information from the module onto a return bus if the adjacent slot is unoccupied or onto an intermodule connection line if the adjacent slot is occupied by a module.
    Type: Grant
    Filed: March 4, 1992
    Date of Patent: April 18, 1995
    Assignee: Rockwell International Corp.
    Inventor: Robert L. Murr
  • Patent number: 5408404
    Abstract: An apparatus and method for accomplishing DC-to-AC power conversion that combine the AC outputs of n interleaved, time division multiplexed inverters and steer the secondary pulses positively or negatively, as commanded by the time varying reference signal, such that the effective switching, or sampled-data, frequency of any of the inverter or pulse-steering transistors. The n interleaved inverter system can, in turn, be paralleled such that, relative to a single inverter supplying all the power, the losses for any inverter transistor are 1/np, n due to time multiplexing and p due to paralleling.
    Type: Grant
    Filed: March 25, 1993
    Date of Patent: April 18, 1995
    Assignee: Rockwell International Corp.
    Inventor: Daniel M. Mitchell
  • Patent number: 5364293
    Abstract: An apparatus for use as a connector in certain electronic applications. The disclosed apparatus teaches a connector assembly suitable for use in applications requiring minimal height restrictions while simultaneously affording a solderless, stackable, shielded connector assembly that may include a variety of electronic filtering. A described embodiment of the present invention includes a multi-walled encasement structure of electroplated construction housing a "pi" filter sandwiched between matching layers of resilient conductive layers, each layer having contact pads for coupling to contact pads of adjacent circuit board circuitry.
    Type: Grant
    Filed: July 23, 1993
    Date of Patent: November 15, 1994
    Assignee: Rockwell International Corp.
    Inventor: Kevin T. Peterson
  • Patent number: 5365460
    Abstract: An apparatus and method using a neural network processor for target detection is described. An array of injection mode infrared detectors, whose output signals convey intensity change information of detected objects in a pulse train output form is combined with a frequency division multiplexer to apply the information to a minimum number of multiplexed channels, and transmit the detector output signals to the processor in a continuous mode. A multi-layer neural network processor is used to localize global information and concentrate on areas of interest through matrix transformation applied by the various neural layers.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: November 15, 1994
    Assignee: Rockwell International Corp.
    Inventor: Hwang Chung
  • Patent number: 5361483
    Abstract: A composite fastener, preferably in the form of a rivet, which comprises a shank having a first head integrally formed on one end thereof, the shank and head formed of a high temperature thermoplastic matrix material selected from the group consisting of a polyether ether ketone resin and a polyamide imide resin, and having continuous reinforcing fibers, such as graphite fibers, axially oriented in substantially parallel relation throughout the shank, the fibers being flared and extending continuously into the head and substantially evenly flared and swaged therein, thereby forming a fastener having high shear and high tensile characteristics.
    Type: Grant
    Filed: November 19, 1991
    Date of Patent: November 8, 1994
    Assignee: Rockwell International Corp.
    Inventors: Gilles A. Rainville, Leonardo Israeli
  • Patent number: 5363402
    Abstract: An HF radio transceiving apparatus that maintains communication integrity by employing a plurality of receivers, each capable of operating in separate and independent communication modes. One embodiment of the apparatus includes an antenna, a programmed controller having a plurality of control signals, first and second receivers and a transmitter section. The receivers receive and demodulate radio signals transmitted from external radios in common or mutually exclusive communication modes, and provide link-data information to the programmed controller. The transmitter, responsive to the programmed controller and coupled to the antenna, transmits modulated data in one of the common or mutually exclusive communication modes.
    Type: Grant
    Filed: September 8, 1993
    Date of Patent: November 8, 1994
    Assignee: Rockwell International Corp.
    Inventor: James V. Harmon
  • Patent number: 5359528
    Abstract: A system and method for monitoring and recording the mileage a truck travels within a particular state including a GPS receiver, an odometer, and a memory device which contains state boundary information and a processor for determining on a continual basis whether the positioned information received from the GPS receiver is in a particular state boundary and for recording mileage of the truck when the position and state boundary comparison determines that a change in state boundaries has occurred. Additionally, a storage device for storing the data output by the processor which includes the desired mileage within a particular state information is included.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: October 25, 1994
    Assignee: Rockwell International Corp.
    Inventors: Richard S. Haendel, James C. Neisch
  • Patent number: 5277045
    Abstract: A method and apparatus for effecting superplastic forming of metal workpieces at temperatures greater than 1000.degree. C., wherein both oxidation and creep deformation of the tooling are minimized. The process is achieved by heating forming surfaces of ceramic forming dies to temperatures in excess of 1000.degree. C., and using metal housings to impart high loading conditions to seal the workpiece within a chamber for superplastic forming. More specifically, the metal housings are used not only for load bearing purposes, but also for creating an evacuated chamber within which superplastic forming can take place. The ceramic dies, on the other hand, are positioned on opposing sides of the workpiece region to be superplastically formed, and are insulated from, while being contained within, the metallic dies.
    Type: Grant
    Filed: May 8, 1992
    Date of Patent: January 11, 1994
    Assignee: Rockwell International Corp.
    Inventors: Murray W. Mahoney, Clifford C. Bampton
  • Patent number: 5267708
    Abstract: A head support apparatus for protecting the head of a subject positioned in a vehicle against the detrimental effects of acceleration. Generally, the invention comprises a beam housing attachable to a support device for supporting a subject's upper body while positioned in the vehicle. The beam housing has a side opening on each side thereof and a channel formed in the interior of the housing, extending from one side opening to the opposite side opening. Beam housing support is provided for rigidly supporting the beam housing to the support device within a y-z plane defined by the intersection of a y-axis and a z-axis, but allowing rotation about an x-axis. The x, y and z axes define an orthogonal coordinate system wherein the x-axis extends through the subject's face to the back of the head, the y-axis extends laterally from ear-to-ear, and the z-axis extends vertically from the top of the head through the subject's chin.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: December 7, 1993
    Assignee: Rockwell International Corp.
    Inventors: Conrad B. Monson, Emily L. Howard, Steven L. Hecq, Curtis E. Thompson, William J. Adams
  • Patent number: 5242711
    Abstract: A high temperature resist process is combined with microlithographic patterning for the production of materials, such as diamond films, that require a high temperature deposition environment. A conventional polymeric resist process may be used to deposit a pattern of high temperature resist material. With the high temperature resist in place and the polymeric resist removed, a high temperature deposition process may proceed without degradation of the resist pattern. After a desired film of material has been deposited, the high temperature resist is removed to leave the film in the pattern defined by the resist. For diamond films, a high temperature silicon nitride resist can be used for microlithographic patterning of a silicon substrate to provide a uniform distribution of diamond nucleation sites and to improve diamond film adhesion to the substrate.
    Type: Grant
    Filed: August 16, 1991
    Date of Patent: September 7, 1993
    Assignee: Rockwell International Corp.
    Inventors: Jeffrey D. DeNatale, John F. Flintoff, Alan B. Harker, Patrick J. Hood, Gerald D. Robinson
  • Patent number: 5137852
    Abstract: Thermodynamically stable ceramic composites are provided for use in high temperature oxidizing environments. The composites comprise high strength alumina fibers (Al.sub.2 O.sub.3) in a ceramic matrix. The ceramic matrix comprises material similar to the fibers to improve compatibility of the composite materials. A material selected from the .beta.-alumina and magnetoplumbite family of materials is used to provide a weakly bonded interface between the fibers and the ceramic matrix. .beta.-aluminas and magnetoplumbites have weak layers as an intrinsic characteristic of their crystal structure, which comprise spinel layers (basically Al.sub.2 O.sub.3) separated by very weakly bonded planes containing the .beta.-forming ions. The weak planes of these materials allow preferential debonding and sliding, and thus inhibit crack growth across the interface between the fibers and the ceramic matrix. The alumina fibers can be coated with .beta.
    Type: Grant
    Filed: January 11, 1991
    Date of Patent: August 11, 1992
    Assignee: Rockwell International Corp.
    Inventors: Peter E. D. Morgan, David B. Marshall
  • Patent number: 5104494
    Abstract: A low-temperature, nondestructive method of electrochemical reduction is provided for restoring solderability of oxidized electronic component leads and solderable portions of printed wiring boards. The component or circuit board is immersed in an electrolyte solution. The electrolyte is chosen to be non-reactive with the circuit board and component materials. In one embodiment, the electrolyte comprises a benign borate buffer solution. The solderable portion of the component or circuit board is connected to the cathode of an electric power source to form a first electrode. A second, inert electrode is connected to the anode of the current source and immersed in the electrolyte. Current passing between the electrodes electrochemically reduces the metallic oxides on the solderable portions of the component or circuit board. In a second embodiment, the electrolyte comprises an active reducing agent.
    Type: Grant
    Filed: July 2, 1991
    Date of Patent: April 14, 1992
    Assignee: Rockwell International Corp.
    Inventors: D. Morgan Tench, Dennis P. Anderson
  • Patent number: 5097121
    Abstract: An impurity band conduction (IBC) detector having a substrate and a thin layer IR active region is provided with a beveled edge for increasing the quantum efficiency of the detector. The edge of the transparent detector substrate is beveled at an angle equal to or greater than the critical angle for total internal reflection of radiation in the material of the substrate and active region of the detector. The radiation is directed into the detector normal or nearly normal to the beveled edge. The radiation travels the length of the detector due to total internal reflection within the detector. As a result, the radiation passes through the IR active region of the detector a plurality of times, thereby increasing the probability that a photon will be absorbed by an impurity within the IR active region and sensed by the detector.
    Type: Grant
    Filed: January 24, 1991
    Date of Patent: March 17, 1992
    Assignee: Rockwell International Corp.
    Inventors: Michael G. Sherman, Craig S. Tindall
  • Patent number: 5081705
    Abstract: The present invention comprises a communication system including a number of independently operating equipment modules in which the operations of these modules are referenced to a common external signal and thereby phase synchronized in order to reduce intra-system interference. The system includes a number of phase lock loop type processing circuits one of which is associated with each equipment module for tracking the external reference signal and generating a base reference for use by module with which each processing circuit is associated. The system takes advantage of the inherent capabilities of phase lock loop circuits to provide a base reference for each equipment module which is characterized by a frequency spectrum having a reduced level of spurious signals and noise. The preferred embodiment includes components for automatically switching between internally and externally generated reference signals and for automatically converting an external reference signal to a standard frequency.
    Type: Grant
    Filed: June 29, 1989
    Date of Patent: January 14, 1992
    Assignee: Rockwell International Corp.
    Inventor: Christopher J. Swanke
  • Patent number: 4928387
    Abstract: Printed wiring boards using surface mount and other components are manufactured using a double-sided tape assembly. The tape assembly is composed of a soluble base layer coated on each side with an adhesive layer, and these layers are sandwiched between top and bottom protective release paper layers. Holes are formed in the tape assembly corresponding to the location of solder pads on the printed wiring board, and the tape assembly is adhered to the printed wiring board after removal of the bottom adhesive layer. Solder paste is applied to the top release layer, filling the holes in the tape assembly. The top release layer is removed, exposing the top adhesive layer, and the component is pressed onto the adhesive layer with its terminations in registry with the solder-filled holes. The board assembly is then soldered, and the remaining base and adhesive layers of the tape assembly are removed by action of a solvent during cleaning.
    Type: Grant
    Filed: September 7, 1989
    Date of Patent: May 29, 1990
    Assignee: Rockwell International Corp.
    Inventors: John C. Mather, Jerald A. Young
  • Patent number: 4888599
    Abstract: Method and apparatus for manipulating the gray scale voltage levels in liquid crystal displays, in order to provide for enhanced image quality, over temperature extremes by monitoring the actual transmittance through the liquid crystal over time and comparing the information with earlier information.
    Type: Grant
    Filed: October 22, 1987
    Date of Patent: December 19, 1989
    Assignee: Rockwell International Corp.
    Inventors: Craig E. Harwood, Lyle R. Strathman
  • Patent number: 4881195
    Abstract: A multi-requester arbitration circuit receives multiple asynchronous request signals and provides a first common timing signal from the request signals. A sample-and-hold circuit receives each of the request signals and produces corresponding output sample signals. The sample-and-hold circuit receives the first common timing signals. A time delay circuit produces a second timing signal from the first common timing signal. A storage circuit receives the output sample signals and produces corresponding output stored signals. The storage circuit receives the second timing signal. An arbitration circuit receives the output stored signals to select one of the request signals and provide at least an output control signal indicative thereof. The sample-and-hold circuit samples each of the request signals before the first common timing signals causes the sample-and-hold circuit to hold all request signals.
    Type: Grant
    Filed: November 26, 1986
    Date of Patent: November 14, 1989
    Assignee: Rockwell International Corp.
    Inventors: Steven T. DeLong, James E. Snook