Abstract: A transportation system of a cassette according to an embodiment of the present invention comprises a port and a system controller. The port accommodates a cassette carrying a glass substrate. The port includes a plurality of displacement sensors for sensing a position of a cassette. The system controller calculates a distortion amount of the cassette using a plurality of sensed values of the cassette and a misplaced amount of the displacement sensors to determine whether the cassette is in a normal settlement status. Therefore, the position of the cassette can be automatically taught without clamping operation of a clamping device clamping the cassette disposed in the port, so that it is possible to prevent defects of the glass substrate by removing various defect-causing factors such as particles and static electricity that may occur during a conventional clamping operation.

Abstract: A transportation system of a cassette comprises a port and a system controller. The port accommodates a cassette carrying a glass substrate, and the port includes displacement sensors for sensing a position of a cassette. The system controller calculates a distortion amount of the cassette using sensed values of the cassette and determines if the cassette is in a normal settlement status by comparing the distortion amount with a tolerance value. Therefore, the position of the cassette can be automatically taught without clamping operation of a clamping device clamping the cassette disposed in the port, thereby preventing defects of the glass substrate by removing various defect-causing factors such as particles and static electricity that may occur during a conventional clamping operation. In particular, quality defects of OLED can be eliminated by preventing particles and static electricity that affect product quality defects in the OLED manufacturing process.

Abstract: A substrate transferring apparatus capable of reducing a nitrogen gas for purging and a shutdown time thereof. The Substrate transferring apparatus includes a ventilation driving room, a FOUP receiving room, a driving equipment room and a ventilation duct. The ventilation driving room is equipped with a main fan for blowing air downward. The FOUP receiving room is disposed under the ventilation driving room and accommodates a FOUP for storing a substrate. The driving equipment room is disposed under the FOUP receiving room. The ventilation duct connects the FOUP receiving room and the ventilation driving room.

Abstract: A purge module jig and a purge module including the purge module jig are provided. The purge module jig and the purge module include a plate having a recessed groove and an opening formed therein, a gas transfer pipe having an elliptical cross section, and a fixing part fixing the plate and the gas transfer pipe with each other, so that leakage of cleaning gas is prevented, thickness thereof is reduced, the interference between the jig and a wafer cassette is reduced, the purge module jig and the purge module can be applied to various load ports of various manufactures, and performance thereof can be improved.

Abstract: A purge module which can provide a conventional load port without a gas purging function with the gas purging function, and a load port having the purge module are disclosed. The purge module comprises a jig, a gas control box and pipes. The jig is detachably attached to an upper side of a stage of a load port. The jig comprises a gas inlet for providing a wafer carrier with gas and a gas outlet for receiving gas from the wafer carrier. The gas control box is detachably attached to the load port to control gas flow. The pipes connect the jig and the gas control box.

Abstract: A purge module jig and a purge module including the purge module jig are provided. The purge module jig and the purge module include a plate having a recessed groove and an opening formed therein, a gas transfer pipe having an elliptical cross section, and a fixing part fixing the plate and the gas transfer pipe with each other, so that leakage of cleaning gas is prevented, thickness thereof is reduced, the interference between the jig and a wafer cassette is reduced, the purge module jig and the purge module can be applied to various load ports of various manufactures, and performance thereof can be improved.

Abstract: A purge module which can provide a conventional load port without a gas purging function with the gas purging function, and a load port having the purge module are disclosed. The purge module comprises a jig, a gas control box and pipes. The jig is detachably attached to an upper side of a stage of a load port. The jig comprises a gas inlet for providing a wafer carrier with gas and a gas outlet for receiving gas from the wafer carrier. The gas control box is detachably attached to the load port to control gas flow. The pipes connect the jig and the gas control box.

Abstract: A wafer etching apparatus and a wafer etching method using the wafer etching apparatus, which are capable of etching Si wafer in a dry etching method, are disclosed. According to the wafer etching apparatus and the wafer etching method, the capacitively coupled plasma unit or the inductively coupled plasma unit and the remote plasma unit are included together to etch wafer in a high speed and to reduce etching operation time. Additionally, the chuck has an upper surface with roughness so that the wafer can be cooled down through a helium gas provided to the wafer through a minute space between the upper surface and the wafer. Therefore, unwanted plasma which is generated in the groove in the conventional wafer etching apparatus is prevented to prevent damage of the wafer.

Abstract: A method of cutting a tempered glass substrate, which is capable of cut a tempered glass substrate without mechanical breaking process and cooling process , is disclosed. The method of cutting a tempered glass substrate, includes, forming an initial crack at a cut-starting point of the tempered glass substrate; forming a heated line at the tempered glass substrate by irradiating laser beam from a point different from the cut-starting point with the initial crack to the cut-starting point with the initial crack through optical heater; and automatically propagating the intimal crack along the heated line to cut the tempered glass substrate.

Abstract: A glass plate cutting machine using a laser beam is provided to solve problems, such as uneven glass section and slanting cutting. By using the glass plate cutting machine of the current invention, the glass plate is irradiated with a first carbon dioxide laser beam of 0.05-2 joule/mm2 on a long oval shaped area of 20-200 mm2 according to an expected cutting line thereof, and immediately cooled with water, to generate a scribe line, which is then further irradiated with a second carbon dioxide laser beam of 0.1-0.5 joule/mm? on the area of 20-200 mm2 thus obtaining a superior glass section.

Abstract: Disclosed herein is an apparatus for cutting a glass plate. The apparatus comprises a cracking means for forming a minute crack at a point on the glass plate where the cutting is started, at least one scribing means using a laser beam absorbed by the glass plate, at least one quenching means using a quenching fluid after irradiation of the laser beam, a breaking means using the laser beam. The breaking means comprises a laser oscillator, a reflection mirror and a focusing lens. The focusing lens has at least two or more focal lengths. The apparatus may further apparatus further comprise a photo mask formed with light transmission openings for transmitting a part of the laser beam to be irradiated on the glass plate instead of the focusing lens. With the apparatus of the present invention, the problems caused by the conventional lens, such as a reduced straightness of a cutting line or a rough cutting plane, can be prevented, thereby providing a clean cutting plane.