Abstract: Methods of monitoring critical dimensions in a semiconductor fabrication process include capturing at least one image of a first structure that has an effect on the polarization state of light reflected therefrom. For at least some of the first structure images, a value is calculated indicative of intensity of light reflected from the first structure. A critical dimension of the first structure is obtained and correlated with the calculated value. At least one image of a subsequent structure is captured. A determination is made, based at least in part on the calculated value, of a critical dimension of the subsequent structure.

Abstract: A method of identifying discontinuities in the surface of a substrate is herein disclosed. An object plane of an imaging system is positioned at a focal position associated with a discontinuity and an image is captured, the discontinuity having a relatively higher contrast with respect to the remainder of the surface of the substrate. The discontinuity is thereby more readily discernable than when the focal plane is positioned at the surface of the substrate. Analysis of discontinuities may include the extraction of discontinuity characteristics.

Abstract: A BOLTS compatible module includes a support mechanism for gripping a wafer. The support mechanism is coupled to a rotary mechanism for rotating the support mechanism with a wafer grip therein. The rotary mechanism is coupled to the module and capable of at least 180° of rotation.

Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.

Abstract: A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.

Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.

Abstract: A system and method of non-linear grid fitting and coordinate system mapping may employ data processing techniques for fitting a set of measured fiducial data to an ideal set of fiducials; the fiducials may be arranged in a known (e.g., Cartesian grid) pattern on a substrate imaged by an imaging apparatus. Exemplary embodiments may model the non-linear transformation to and from imaged coordinates (i.e., coordinates derived from acquired image data) and artifact coordinates on the fiducial plate (i.e., actual coordinates of the fiducial relative to a reference point on the fiducial plate).

Abstract: Projection systems and methods with mechanically decoupled metrology plates according to embodiments of the present invention can be used to characterize and compensate for misalignment and aberration in production images due to thermal and mechanical effects. Sensors on the metrology plate measure the position of the metrology plate relative to the image and to the substrate during exposure of the substrate to the production image. Data from the sensors are used to adjust the projection optics and/or substrate dynamically to correct or compensate for alignment errors and aberration-induced errors. Compared to prior art systems and methods, the projection systems and methods described herein offer greater design flexibility and relaxed constraints on mechanical stability and thermally induced expansion. In addition, decoupled metrology plates can be used to align two or more objectives simultaneously and independently.

Abstract: A system and method for yield management are disclosed wherein a data set containing one or more prediction variable values and one or more response variable values is input into the system. The system can process the input data set to remove prediction variables with missing values and data sets with missing values based on a tiered splitting method to maximize usage of all valid data points. The processed data can then be used to generate a model that may be a decision tree. The system can accept user input to modify the generated model. Once the model is complete, one or more statistical analysis tools can be used to analyze the data and generate a list of the key yield factors for the particular data set.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: Probe mark inspection involves a recipe based on unique image characteristics or combinations of unique image characteristics. Result images are correlated with a reference created to determine which image characteristic or combination of image characteristics provides an improved contrast.

Abstract: A method for evaluating a manufacturing process is described. The method includes generating an optical pump beam pulse and directing the optical pump beam pulse to a surface of a sample. A probe pulse is generated and directed the probe pulse to the surface of the sample. A probe pulse response signal is detected. A change in the probe pulse varying in response to the acoustic signal forms the probe pulse response signal. An evaluation of one or more manufacturing process steps used to create the sample is made based upon the probe pulse response signal. Additionally the method may be used for process control of a CMP process. Apparatus are also described.

Abstract: A method and apparatus for obtaining inspection information is described. A standard CCD or CMOS camera is used to obtain images in the near infrared region. Background and noise components of the obtained image are removed and the signal to noise ratio is increased to provide information that is suitable for use in inspection.

Abstract: A loadport for handling film frames is disclosed. The loadport is modular and substantially compatible with applicable standards regarding modular equipment. In particular, the load port is substantially interchangeable with loadports not adapted for handling film frames. The loadport has a compact shuttle for moving film frames and flexible alignment mechanisms for aligning film frames and cassettes of different configurations.

Abstract: A method of optimizing an optical inspection and fabrication process is herein disclosed. Images, preferably color digital images, of an object are obtained and multiple filter space representations of these images are created. Each of the representations and the channels or data that define them are analyzed separately or in combination with one another to determine which representations, combination of representations, channels, combinations of channels, data or combinations of data provide the most optimal data for analysis by optical inspection algorithms. The process may be automated in terms of the creation of image representations and/or single or multivariate analysis.

Abstract: Methods and apparatus for placing wafers axially in an optical inspection system. A “best worst” focus method includes a series of through-focus images of a test wafer acquired using full field of view of the inspection optics. The value of the worst quality in each image is associated with the respective axial location, forming a locus of “worst” values as a function of axial location. The axial location is chosen which optimizes the locus, giving an axial location that provides the “best-worst” image quality. A “video focus” method includes a series of through-focus images generated using reduced field of view. A figure of merit is associated with each image, providing through-focus information. The “video focus” can be calibrated against the “best worst” focus. Further, a point sensor can be used to generate a single z-value for one (x,y) location that can be calibrated with “video focus”.

Abstract: A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and method combine non-bussed electrical planarity measurements with fast optical planarity measurements to produce “effectively loaded” planarity measurements.

Abstract: By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.

Abstract: A system and method for defect analysis are disclosed wherein a defect data set is input into the system. A radius value is selected by a user, which is the maximum number of bits that bit failures can be separated from one another to be considered a bit cluster. When a defect data set is received, the system and method start with a fail bit and search for neighboring fail bits. The specified radius is used to qualify the found fail bits to be part of the bit cluster or not. If a minimum count of fail bits is not met, the system and method will stop searching and move to the next fail bit. If a minimum count of fail bits is met, the search continues for the next fail bit until the maximum fail bit count specified by the user is reached. Aggregation is provided such that once bit clusters have been classified, the number of clusters that have the exact match or partial match to each other is counted. The user may set the partial match as a threshold count to establish a match.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.