Abstract: Certain examples described herein relate to a surface-emitting semiconductor-laser which includes an oxide window, a light emitting cavity, and at least one phase matching window. The oxide window, the light emitting cavity, and the at least one phase matching layer are arranged so that a predetermined phase relationship is satisfied. The phase relationship facilitates high performance and stable multimode operations of the surface-emitting semiconductor laser designed to emit between 850-1060 nm wavelength for applications such as long distance optical communications in high performance computing and data servers.

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: A thin-film piezoelectric material element includes a piezoelectric part having a laminated structure which a lower electrode film, a piezoelectric material film and an upper electrode film are laminated sequentially, and electrode pads connected with the piezoelectric part. The thin-film piezoelectric material element has solder regulating parts formed on pad surfaces being surfaces of the electrode pads. The solder regulating parts have peripheral edge parts and crossing edge parts connected with the two outer edge parts, and formed to cross the pad surfaces. The crossing edge parts are formed in a bow like curve-shape having curved parts, being gradually distant from the shortest line as they are distant more from the outer edge parts.

Abstract: A PCB includes a PCB body at least including a first metal layer, a second metal layer, and a first ground layer sandwiched therebetween; and a pair of transmission lines including a first transmission line conductor and a second transmission line conductor. The first transmission line conductor is located in the first metal layer which has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends which are located in the first metal layer and a cross-via structure at the middle which has a buried trace buried in the second metal layer, and the curved line section and the buried trace are isolated by the first ground layer. Skew effect of the differential transmission circuit is reduced, thereby improving the signal transmission quality and improve signal transmission speed.

Abstract: A lens assembly includes a lens holder and a lens barrel that are coaxial and integrated in a unity, a cavity is defined therein to receive at least one lens, at least three guiding legs are extended from a bottom of the lens holder, and the guiding legs define a plane that is parallel to an installation plane of the lens. It can achieve an accurate optical axis alignment between the lens and the image sensor, reduce total assembly tolerances of the camera module thereby improving imaging quality, and reduce manufacturing cost to benefit the popularization in industries.

Abstract: A two-part optical coupling subassembly includes a main lens formed with a cavity, the main lens including two surfaces formed in the cavity and oppositely inclined at an off-vertical angle from a central vertical plane of the cavity such that the two surfaces are symmetric with respect to the central vertical plane; a beam router embedded in the cavity, the beam router including first and second beam router surfaces lying on the two surfaces of the main lens respectively, and a partially reflective coating on at least one of the beam router surfaces; and a transparent adhesive provided between the two lens surfaces and the first and second beam router surfaces.

Abstract: A method of testing anti-high temperature performance of a magnetic head comprises applying a plurality of second magnetic fields with different intensities in a second direction to the magnetic head, and measuring a second output parameter curve, and judging whether a variation that is beyond an allowable value is presented on the second output parameter curve, therein the second direction passes through the ABS and at an angle whose absolute value is an acute angle to the ABS. The present invention can screen out defective magnetic heads that possess poor anti-high temperature performance without heating the magnetic head.

Abstract: A method of making an article coated with DLC, includes providing a substrate; depositing a transition layer on the substrate by means of magnetron sputter deposition (MSD); depositing a DLC layer without hydrogen (H) on the transition layer by means of filtered cathodic vacuum arc (FCVA); and doping a fluorine-doping (F-doping) layer on the DLC layer. The article has good film bonding force, high hardness, good wear resistance, good hydrophobicity and oleophobicity and high light transmittance, and the DLC layer has no H included.

Abstract: A slider design for a hard disk drive (HDD) features an air-bearing surface (ABS) topography with soft bumper pads (SBP) formed proximally to corners of the leading edge and the trailing edge. The bumper pads are formed by a process that combines the use of a first photomask for subtractive etching of the ABS to form pedestals, followed by additive depositions onto the pedestals using a second lift-off photomask. The additive process deposits sequences of Si layers and diamond-like carbon (DLC) layers to produce a soft bumper pad that is energy absorbing and heat conducting, thereby protecting the recording media from surface damage and thermal erasures.

Abstract: A micro optical engine assembly including a printed circuit board, a frame mounted on the printed circuit board, a micro optical engine mounted on the printed circuit board within a central space of the frame, a jumper having a lens-carrying end placed on top of the micro optical engine and aligned therewith by alignment members to thereby limit horizontal movement of the jumper, and a latch having a snap mechanism releasably snapped onto the frame, and at least one spring plate resiliently pressing against an upper surface of the jumper when the latch is snapped onto the frame to thereby limit vertical movement of the jumper.

Abstract: This thin film magnetic head includes a magnetic pole including an end surface exposed on an air bearing surface, and a contact detection section including a magnetic material layer provided near the air bearing surface, and a magnetic-domain stabilizing structure stabilizing a magnetic domain structure of the magnetic material layer.

Abstract: An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof. It obtains improved electromagnetic wave shielding effect and improved manufacturing efficiency.

Abstract: An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.

Abstract: A manufacturing method for a head slider coated with Diamond-like Carbon (DLC) includes: providing a substrate that is to be finally made into a head slider; depositing a DLC layer on a surface of the substrate, with carbon plasma source being sputtered in a direction that is vertical to the surface of the substrate; and doping a fluorine-doping (F-doping) layer on the DLC layer. Whereby the head slider has good film adhesion performance, higher hardness, better wear resistance, lower surface energy to obtain good hydrophobicity and oleophobicity, and lower fly height in HDD.

Abstract: This thin film magnetic head includes a magnetic pole including an end surface exposed on an air bearing surface, and a contact detection section including a magnetic material layer provided near the air bearing surface, and a magnetic-domain stabilizing structure stabilizing a magnetic domain structure of the magnetic material layer.

Abstract: A multi-layer printed circuit board includes an insertion end, two edge fingers provided on the insertion end, two chamfers formed at two opposite inner corners at two trailing edges of the two edge fingers, and two single-ended transmission lines extending from the two trailing edges of the two edge fingers and converging towards each other to form a differential pair. A first ground reference plane is disposed underneath the two single-ended transmission lines and the differential pair with a leading edge terminates at the trailing edges of the two edge fingers and a first cut-out portion formed at the leading edge. Other ground reference planes are disposed underneath the first ground reference plane with leading edges terminate at the trailing edges of the edge fingers and second cut-out portions are formed at the leading edges, wherein the second cut-out portions are larger than the first cut-out portion.

Abstract: An optical finger navigation module includes a light source mounted below a window plate formed on a housing of the module, a driver for outputting a current to the light source, an environmental sensor for sensing an environmental condition and providing a signal, and a sensor integrated circuit including a processor coupled with the environmental sensor for reading the signal and generating a compensated current that corresponds to the signal based on a compensation curve tailor-made for the light source and derived from a compensation algorithm using compensation factors. A method for increasing lifetime of the module is also disclosed.

Abstract: A magnetic head for perpendicular magnetic recording includes a read head unit, a write head unit disposed forward of the read head unit along the direction of travel of a recording medium, a heater that generates heat for causing the medium facing surface to protrude in part, an expansion layer that makes part of the medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with the recording medium. The write head unit includes a main pole, a write shield, and a return path section. The return path section includes a yoke layer located backward of the main pole along the direction of travel of the recording medium, a first coupling part that couples the yoke layer and the write shield to each other, and a second coupling part that is located away from the medium facing surface and couples the yoke layer and the main pole to each other.

Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: An optical connector includes a lens block mounted in a MPO housing and optically coupled between an optical light guide and an external coupling light guide. A first lens formed on a first surface of the lens block to totally reflect and collimate light emitting from the optical light guide to a second surface. The second surface is coated with a partial transmission coating on a transmitter side and a total reflective coating on a receiver side. A second lens formed on a third or fourth surface on the lens block for focusing light from the second surface onto the external coupling light guide.