Patents Assigned to Samsung Electroncs Co., LTD
  • Publication number: 20080118060
    Abstract: A method of decoding/encoding a content file is provided. The method of decoding a content file includes dividing an encoded content file into a plurality of data blocks, grouping the plurality of data blocks into a plurality of groups, generating a group content key for each of the plurality of groups, generating a plurality of block keys for the data blocks in each of the plurality of groups from the group content key generated for each of the plurality of groups, and decoding the plurality of data blocks using the plurality of block keys.
    Type: Application
    Filed: January 18, 2007
    Publication date: May 22, 2008
    Applicant: SAMSUNG ELECTRONCS CO., LTD.
    Inventors: Myung-Sun Kim, Hak-soo Ju, Ji-young Moon, Ju-hee Seo, Mi-hwa Park
  • Patent number: 6838754
    Abstract: A multi-chip package (MCP) that incorporates a leadframe pad arranged and configured to allow the active surface of a first chip to be mounted on a lower surface of the leadframe pad and a second chip to be mounted on an upper surface of the leadframe pad whereby the first and second chips may be mounted and wire bonded to inner leads without inverting the leadframe, thereby reducing the likelihood of damage during manufacturing and allowing for a reduction in package thickness. The first and second chips, as well as the bonding wires that connect the chips to inner leads of the leadframe may be sealed in a package body. Outer leads extending from the package body and integrally formed with the inner leads may be formed to provide finished packages having a variety of mounting configurations for attachment to circuit boards or other applications.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: January 4, 2005
    Assignee: Samsung Electroncs Co., LTD
    Inventor: Tae-Hun Kim
  • Patent number: 6053013
    Abstract: There are provided an optical fiber rod overcladding apparatus and method, and an optical fiber drawing method. In the preform rod overcladding method, a preform rod is clamped in a top chuck and leveled, and a glass tube is mounted in a bottom chuck and leveled. The preform rod is coaxially inserted into a glass tube. Then, the glass tube is preheated by the furnace and heated by the burner until the glass tube reaches a softening point. The preform rod is completely sealed in the glass tube by sucking air in a clearance between the preform rod and the glass tube by application of a negative vacuum pressure. Thus, a preform is completed.
    Type: Grant
    Filed: March 27, 1998
    Date of Patent: April 25, 2000
    Assignee: SamSung Electroncs Co., Ltd.
    Inventors: Seung-Hun Oh, Ki-Un Namkoong, Man-Seok Seo, Un-Chul Paek, Kyung-Hwan Oh, Ghie-Hugh Song, Mun-Hyun Do, Young-Joo Chung