Patents Assigned to Sentrex Company, Inc.
  • Multilayer product for printed circuit boards
    Patent number: 6280851
    Abstract: Copper foil used in printed circuit boards is protected from contamination both prior to laying up the circuit board components and during processing by a multilayer protective film structure having a silicone adhesive disposed on one entire surface and a silicone release composition on the other entire surface.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: August 28, 2001
    Assignee: Sentrex Company, Inc.
    Inventors: Melvin Pasternack, Jurgen Matthes