Patents Assigned to Seoul Laser Dieboard System Co., Ltd.
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Patent number: 11478951Abstract: A rule to be inserted into a die-board that is pressed onto a plate matter, the rule including: a multi-edge cutting blade having a cutting blade edge, the cutting blade edge divided into multiple sections with multiple spacings between the multiple sections; and a plurality of connecting pieces configured to fit into the multiple spacings and to provide support for the multiple sections of the cutting blade edge when the rule is pressed onto the plate matter.Type: GrantFiled: December 20, 2017Date of Patent: October 25, 2022Assignee: Seoul Laser Dieboard System Co., Ltd.Inventor: Kyong Chan Lim
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Patent number: 11247255Abstract: An apparatus to produce a letterbox using a strip of material includes: a bender to receive and bend the strip of material into a desired shape of a letterbox including flanges and notches, and the bender to bend at least one end of the strip of material slightly to produce a slight bent; a processor to measure a first plurality of hole positions on a first end of the strip of material and a second plurality of hole positions on flanges of the strip of material, wherein the first plurality of hole positions on the first end are measured to match a first plurality of holes on a second end of the strip of material, wherein the second plurality of hole positions on the flanges are measured to match a second plurality of holes on a base plate; and a puncher to punch the first plurality of holes on at least one of the first end and the second end of the strip of material according to the first plurality of hole positions, and the puncher to punch the second plurality of holes on the flanges according to the secondType: GrantFiled: October 26, 2018Date of Patent: February 15, 2022Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.Inventor: Kyong Chan Lim
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Patent number: 11235488Abstract: Applying padding material around shaped cutting blades includes: receiving a blade shape diagram and a rule of blade; bending the rule of blade according to the blade shape diagram to produce the shaped cutting blades; and applying the padding material around the shaped cutting blades using the blade shape diagram to produce a padded shaped cutting blade, wherein the padding material provides a spring action to quickly detach the shaped cutting blades from a plate matter.Type: GrantFiled: February 23, 2018Date of Patent: February 1, 2022Assignee: Seoul Laser Dieboard System Co., Ltd.Inventor: Kyong Chan Lim
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Patent number: 10898977Abstract: A system for generating rules inserted into at least one pattern board including: a controller configured to generate at least one shape diagram, the controller also configured to determine number and measurement of crease rules to be generated based on the at least one shape diagram; a cutting station configured to receive and cut a first crease rule into the number and measurement of the crease rules; and a sorter configured to receive the crease rules from the cutting station and sort the crease rules according to the measurement of the crease rules, wherein the sorted crease rules are inserted into each of the at least one pattern board along with a cutting rule shaped by each of at least one bender.Type: GrantFiled: February 27, 2018Date of Patent: January 26, 2021Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.Inventor: Kyong Chan Lim
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Patent number: 10562113Abstract: A channel bender including: a feeding unit configured to feed and guide a channel material into the channel bender; at least one broaching unit configured to perform at least one of bite broaching and wheeled broaching on the channel material to make at least one broaching mark; and a bending unit configured to bend the channel material that include the at least one broaching mark.Type: GrantFiled: April 8, 2016Date of Patent: February 18, 2020Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.Inventor: Sang Moo Lee
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Patent number: 10537969Abstract: Methods, devices, and apparatus for processing a strip of material including: measuring and feeding the strip of material to a predetermined length; and making broaching cuts on the strip of material using a plurality of cutting tools configured to make a plurality of angled cuts.Type: GrantFiled: May 12, 2016Date of Patent: January 21, 2020Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.Inventor: Kyong Chan Lim
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Patent number: 10371184Abstract: Methods and devices for making a plate clip for securing a plate to a channel letter including: selecting a size of the plate clip and cutting a clip form; selecting a plurality of fold positions of the plate clip based on a panel size, the panel size being based on a plate thickness and a width of a rib; cutting the clip form to form a plurality of barbs; and folding the clip form at the plurality of fold positions to form the plate clip and expose the plurality of barbs.Type: GrantFiled: April 7, 2016Date of Patent: August 6, 2019Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.Inventor: Sang Moo Lee
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Patent number: 10265786Abstract: An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.Type: GrantFiled: May 31, 2016Date of Patent: April 23, 2019Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.Inventor: Sang Moo Lee
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Patent number: 10220426Abstract: The disclosure provides a method and apparatus for forming a channel letter box using a profile. The method can include determining an incision position on one surface of the profile where at least one surface incision is to be made. The profile can be surface incised at the determined position. The profile can be folded at the incision position to form the channel letter box. The profile can have at least one rib on one surface. The method can also include cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.Type: GrantFiled: April 21, 2015Date of Patent: March 5, 2019Assignees: SEOUL LASER DIEBOARD SYSTEM CO., LTD, SEOUL LASER DIEBOARD SYSTEM CO., LTD LLPInventor: Kyong-Chan Lim
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Patent number: 9721486Abstract: A frame panel for a three-dimensional sign board, a three-dimensional sign board including the panel, and a manufacturing method therefor. The frame panel includes a band-shaped frame panel which is cut into a predetermined length and wound in the form of a coil so that the frame panel can be bent and shaped into a desired pattern such as a character; and hitch units on which an upper panel is fixated, which are formed along the longitudinal direction of the frame panel and which are spaced apart from each other on two ends of one side of the frame panel. The hitch units are made of a soft synthetic resin material, which is the same material as used for the upper panel.Type: GrantFiled: May 15, 2014Date of Patent: August 1, 2017Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.Inventors: Kwang Yrul Yoon, Sang Moo Lee
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Patent number: 9262946Abstract: A profile for making channel letters is disclosed. The profile can have a rule having a top edge, a bottom edge, a first surface, and a protective coating. The top edge and the bottom edge can be separated by a profile height. The first surface can describe an interior surface of a completed channel letter. The profile can also have a first rib bonded to the first surface with an adhesive. The first rib can be disposed parallel to a profile axis and separated from the top edge by a face plate thickness. The first rib can be configured to receive one or more cuts allowing the profile to bend and form the channel letter. The profile can be made by bonding the first rib to the rule using an adhesive.Type: GrantFiled: February 26, 2015Date of Patent: February 16, 2016Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTDInventor: Kyong-Chan Lim
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Patent number: 9126252Abstract: Forming a channel letter box using a profile, including: determining an incision position on one surface of the profile where at least one surface incision is to be made; surface incising at the determined position; folding the profile at the incision position to form the channel letter box, wherein the profile comprises at least one protruding rib on one surface of the profile; and cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.Type: GrantFiled: April 27, 2012Date of Patent: September 8, 2015Assignee: Seoul Laser Dieboard System Co., Ltd.Inventors: Kyong-Chan Lim, Mike Adams
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Publication number: 20140338416Abstract: A bending apparatus including: a transferring unit for transferring a metallic rule through a passage formed by a guide, said passage defining a longitudinal axis; a folding unit having first and second rotary bodies spaced to receive said metallic rule therebetween; and a pair of bending fingers including a first bending finger and a second bending finger, said pair of bending fingers supported to revolve and move in a direction substantially transverse to the longitudinal axis for applying force against the metallic rule passing through the guide, said pair of bending fingers positioned adjacent to the guide, and for bending the metallic rule to desired angles, wherein each finger of said pair of bending fingers is each configured for arcuate rotational motion relative to said guide from a first position toward at least one second position to bend a portion of said metallic rule, and wherein said pair of bending fingers rotate about a single rotational axis relative to said guide.Type: ApplicationFiled: April 14, 2014Publication date: November 20, 2014Applicant: Seoul Laser Dieboard System Co., Ltd.Inventor: Byung-Jun Song
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Publication number: 20130074573Abstract: A bending apparatus including: a transferring unit for transferring a metallic rule through a passage formed by a guide, said passage defining a longitudinal axis; a folding unit having first and second rotary bodies spaced to receive said metallic rule therebetween; and a pair of bending fingers including a first bending finger and a second bending finger, said pair of bending fingers supported to revolve and move in a direction substantially transverse to the longitudinal axis for applying force against the metallic rule passing through the guide, said pair of bending fingers positioned adjacent to the guide, and for bending the metallic rule to desired angles, wherein each finger of said pair of bending fingers is each configured for arcuate rotational motion relative to said guide from a first position toward at least one second position to bend a portion of said metallic rule, and wherein said pair of bending fingers rotate about a single rotational axis relative to said guide.Type: ApplicationFiled: November 16, 2012Publication date: March 28, 2013Applicants: SEOUL LASER DIEBOARD CO., LTD., SEOUL LASER DIEBOARD SYSTEM CO., LTD.Inventors: Seoul Laser Dieboard System Co., Ltd., Seoul Laser Dieboard Co., Ltd.
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Publication number: 20120324705Abstract: Forming a channel letter box using a profile, including: determining an incision position on one surface of the profile where at least one surface incision is to be made; surface incising at the determined position; folding the profile at the incision position to form the channel letter box, wherein the profile comprises at least one protruding rib on one surface of the profile; and cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.Type: ApplicationFiled: April 27, 2012Publication date: December 27, 2012Applicants: SEOUL LASER DIEBOARD SYSTEM CO., LTD., SEOUL LASER DIEBOARD SYSTEM CO., LTD.Inventors: Kyong-Chan Lim, Mike Adams
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Patent number: 8327679Abstract: A bending apparatus including: a transferring unit for transferring a metallic rule through a passage formed by a guide, the passage defining a longitudinal axis; a folding unit having first and second rotary bodies spaced to receive the metallic rule; and a pair of bending fingers including a first bending finger and a second bending finger, the pair of bending fingers supported to revolve and move in a direction substantially transverse to the longitudinal axis for applying force against the metallic rule passing through the guide, the pair of bending fingers positioned adjacent to the guide, and for bending the metallic rule to desired angles, wherein the first bending finger is revolved by the first rotary body and the second bending finger is revolved by the second rotary body, wherein each finger of the pair of bending fingers is each configured for arcuate motion relative to the guide from a first position toward at least one second position to bend a portion of the metallic rule.Type: GrantFiled: November 9, 2006Date of Patent: December 11, 2012Assignees: Seoul Laser Dieboard System Co., Ltd., Seoul Laser Dieboard Co., Ltd.Inventor: Byung-Jun Song
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Publication number: 20120103155Abstract: A device, comprising: a base plate configured to be moveable toward and back from a metal rule having at least one flanged side, wherein the metal rule is fed into the device along a metal rule feeding path; a first plate coupled to the base plate, the first plate including a plurality of cutter holes formed on its surface; a plurality of cutting elements configured to engage the corresponding plurality of cutter holes on the first plate to make cuts on the at least one flanged side of the metal rule.Type: ApplicationFiled: October 10, 2008Publication date: May 3, 2012Applicant: Seoul Laser Dieboard System Co., LtdInventor: Sang Moo Lee
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Publication number: 20120103050Abstract: An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.Type: ApplicationFiled: November 4, 2008Publication date: May 3, 2012Applicants: Seoul Laser Dieboard System Co., Ltd., Seoul Laser Dieboard System Co., Ltd.Inventor: Sang Moo Lee