Patents Assigned to Seoul Laser Dieboard System Co., Ltd.
  • Patent number: 11478951
    Abstract: A rule to be inserted into a die-board that is pressed onto a plate matter, the rule including: a multi-edge cutting blade having a cutting blade edge, the cutting blade edge divided into multiple sections with multiple spacings between the multiple sections; and a plurality of connecting pieces configured to fit into the multiple spacings and to provide support for the multiple sections of the cutting blade edge when the rule is pressed onto the plate matter.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: October 25, 2022
    Assignee: Seoul Laser Dieboard System Co., Ltd.
    Inventor: Kyong Chan Lim
  • Patent number: 11247255
    Abstract: An apparatus to produce a letterbox using a strip of material includes: a bender to receive and bend the strip of material into a desired shape of a letterbox including flanges and notches, and the bender to bend at least one end of the strip of material slightly to produce a slight bent; a processor to measure a first plurality of hole positions on a first end of the strip of material and a second plurality of hole positions on flanges of the strip of material, wherein the first plurality of hole positions on the first end are measured to match a first plurality of holes on a second end of the strip of material, wherein the second plurality of hole positions on the flanges are measured to match a second plurality of holes on a base plate; and a puncher to punch the first plurality of holes on at least one of the first end and the second end of the strip of material according to the first plurality of hole positions, and the puncher to punch the second plurality of holes on the flanges according to the second
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: February 15, 2022
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
    Inventor: Kyong Chan Lim
  • Patent number: 11235488
    Abstract: Applying padding material around shaped cutting blades includes: receiving a blade shape diagram and a rule of blade; bending the rule of blade according to the blade shape diagram to produce the shaped cutting blades; and applying the padding material around the shaped cutting blades using the blade shape diagram to produce a padded shaped cutting blade, wherein the padding material provides a spring action to quickly detach the shaped cutting blades from a plate matter.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: February 1, 2022
    Assignee: Seoul Laser Dieboard System Co., Ltd.
    Inventor: Kyong Chan Lim
  • Patent number: 10898977
    Abstract: A system for generating rules inserted into at least one pattern board including: a controller configured to generate at least one shape diagram, the controller also configured to determine number and measurement of crease rules to be generated based on the at least one shape diagram; a cutting station configured to receive and cut a first crease rule into the number and measurement of the crease rules; and a sorter configured to receive the crease rules from the cutting station and sort the crease rules according to the measurement of the crease rules, wherein the sorted crease rules are inserted into each of the at least one pattern board along with a cutting rule shaped by each of at least one bender.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: January 26, 2021
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
    Inventor: Kyong Chan Lim
  • Patent number: 10562113
    Abstract: A channel bender including: a feeding unit configured to feed and guide a channel material into the channel bender; at least one broaching unit configured to perform at least one of bite broaching and wheeled broaching on the channel material to make at least one broaching mark; and a bending unit configured to bend the channel material that include the at least one broaching mark.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: February 18, 2020
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
    Inventor: Sang Moo Lee
  • Patent number: 10537969
    Abstract: Methods, devices, and apparatus for processing a strip of material including: measuring and feeding the strip of material to a predetermined length; and making broaching cuts on the strip of material using a plurality of cutting tools configured to make a plurality of angled cuts.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: January 21, 2020
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
    Inventor: Kyong Chan Lim
  • Patent number: 10371184
    Abstract: Methods and devices for making a plate clip for securing a plate to a channel letter including: selecting a size of the plate clip and cutting a clip form; selecting a plurality of fold positions of the plate clip based on a panel size, the panel size being based on a plate thickness and a width of a rib; cutting the clip form to form a plurality of barbs; and folding the clip form at the plurality of fold positions to form the plate clip and expose the plurality of barbs.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: August 6, 2019
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
    Inventor: Sang Moo Lee
  • Patent number: 10265786
    Abstract: An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: April 23, 2019
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO., LTD.
    Inventor: Sang Moo Lee
  • Patent number: 10220426
    Abstract: The disclosure provides a method and apparatus for forming a channel letter box using a profile. The method can include determining an incision position on one surface of the profile where at least one surface incision is to be made. The profile can be surface incised at the determined position. The profile can be folded at the incision position to form the channel letter box. The profile can have at least one rib on one surface. The method can also include cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: March 5, 2019
    Assignees: SEOUL LASER DIEBOARD SYSTEM CO., LTD, SEOUL LASER DIEBOARD SYSTEM CO., LTD LLP
    Inventor: Kyong-Chan Lim
  • Patent number: 9721486
    Abstract: A frame panel for a three-dimensional sign board, a three-dimensional sign board including the panel, and a manufacturing method therefor. The frame panel includes a band-shaped frame panel which is cut into a predetermined length and wound in the form of a coil so that the frame panel can be bent and shaped into a desired pattern such as a character; and hitch units on which an upper panel is fixated, which are formed along the longitudinal direction of the frame panel and which are spaced apart from each other on two ends of one side of the frame panel. The hitch units are made of a soft synthetic resin material, which is the same material as used for the upper panel.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: August 1, 2017
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD.
    Inventors: Kwang Yrul Yoon, Sang Moo Lee
  • Patent number: 9262946
    Abstract: A profile for making channel letters is disclosed. The profile can have a rule having a top edge, a bottom edge, a first surface, and a protective coating. The top edge and the bottom edge can be separated by a profile height. The first surface can describe an interior surface of a completed channel letter. The profile can also have a first rib bonded to the first surface with an adhesive. The first rib can be disposed parallel to a profile axis and separated from the top edge by a face plate thickness. The first rib can be configured to receive one or more cuts allowing the profile to bend and form the channel letter. The profile can be made by bonding the first rib to the rule using an adhesive.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: February 16, 2016
    Assignee: SEOUL LASER DIEBOARD SYSTEM CO. LTD
    Inventor: Kyong-Chan Lim
  • Patent number: 9126252
    Abstract: Forming a channel letter box using a profile, including: determining an incision position on one surface of the profile where at least one surface incision is to be made; surface incising at the determined position; folding the profile at the incision position to form the channel letter box, wherein the profile comprises at least one protruding rib on one surface of the profile; and cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: September 8, 2015
    Assignee: Seoul Laser Dieboard System Co., Ltd.
    Inventors: Kyong-Chan Lim, Mike Adams
  • Publication number: 20140338416
    Abstract: A bending apparatus including: a transferring unit for transferring a metallic rule through a passage formed by a guide, said passage defining a longitudinal axis; a folding unit having first and second rotary bodies spaced to receive said metallic rule therebetween; and a pair of bending fingers including a first bending finger and a second bending finger, said pair of bending fingers supported to revolve and move in a direction substantially transverse to the longitudinal axis for applying force against the metallic rule passing through the guide, said pair of bending fingers positioned adjacent to the guide, and for bending the metallic rule to desired angles, wherein each finger of said pair of bending fingers is each configured for arcuate rotational motion relative to said guide from a first position toward at least one second position to bend a portion of said metallic rule, and wherein said pair of bending fingers rotate about a single rotational axis relative to said guide.
    Type: Application
    Filed: April 14, 2014
    Publication date: November 20, 2014
    Applicant: Seoul Laser Dieboard System Co., Ltd.
    Inventor: Byung-Jun Song
  • Publication number: 20130074573
    Abstract: A bending apparatus including: a transferring unit for transferring a metallic rule through a passage formed by a guide, said passage defining a longitudinal axis; a folding unit having first and second rotary bodies spaced to receive said metallic rule therebetween; and a pair of bending fingers including a first bending finger and a second bending finger, said pair of bending fingers supported to revolve and move in a direction substantially transverse to the longitudinal axis for applying force against the metallic rule passing through the guide, said pair of bending fingers positioned adjacent to the guide, and for bending the metallic rule to desired angles, wherein each finger of said pair of bending fingers is each configured for arcuate rotational motion relative to said guide from a first position toward at least one second position to bend a portion of said metallic rule, and wherein said pair of bending fingers rotate about a single rotational axis relative to said guide.
    Type: Application
    Filed: November 16, 2012
    Publication date: March 28, 2013
    Applicants: SEOUL LASER DIEBOARD CO., LTD., SEOUL LASER DIEBOARD SYSTEM CO., LTD.
    Inventors: Seoul Laser Dieboard System Co., Ltd., Seoul Laser Dieboard Co., Ltd.
  • Publication number: 20120324705
    Abstract: Forming a channel letter box using a profile, including: determining an incision position on one surface of the profile where at least one surface incision is to be made; surface incising at the determined position; folding the profile at the incision position to form the channel letter box, wherein the profile comprises at least one protruding rib on one surface of the profile; and cutting and attaching a top plate to the channel letter box, wherein a thickness of the top plate is substantially close to a distance from the top of the profile to the top of a top rib of the at least one rib.
    Type: Application
    Filed: April 27, 2012
    Publication date: December 27, 2012
    Applicants: SEOUL LASER DIEBOARD SYSTEM CO., LTD., SEOUL LASER DIEBOARD SYSTEM CO., LTD.
    Inventors: Kyong-Chan Lim, Mike Adams
  • Patent number: 8327679
    Abstract: A bending apparatus including: a transferring unit for transferring a metallic rule through a passage formed by a guide, the passage defining a longitudinal axis; a folding unit having first and second rotary bodies spaced to receive the metallic rule; and a pair of bending fingers including a first bending finger and a second bending finger, the pair of bending fingers supported to revolve and move in a direction substantially transverse to the longitudinal axis for applying force against the metallic rule passing through the guide, the pair of bending fingers positioned adjacent to the guide, and for bending the metallic rule to desired angles, wherein the first bending finger is revolved by the first rotary body and the second bending finger is revolved by the second rotary body, wherein each finger of the pair of bending fingers is each configured for arcuate motion relative to the guide from a first position toward at least one second position to bend a portion of the metallic rule.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: December 11, 2012
    Assignees: Seoul Laser Dieboard System Co., Ltd., Seoul Laser Dieboard Co., Ltd.
    Inventor: Byung-Jun Song
  • Publication number: 20120103155
    Abstract: A device, comprising: a base plate configured to be moveable toward and back from a metal rule having at least one flanged side, wherein the metal rule is fed into the device along a metal rule feeding path; a first plate coupled to the base plate, the first plate including a plurality of cutter holes formed on its surface; a plurality of cutting elements configured to engage the corresponding plurality of cutter holes on the first plate to make cuts on the at least one flanged side of the metal rule.
    Type: Application
    Filed: October 10, 2008
    Publication date: May 3, 2012
    Applicant: Seoul Laser Dieboard System Co., Ltd
    Inventor: Sang Moo Lee
  • Publication number: 20120103050
    Abstract: An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.
    Type: Application
    Filed: November 4, 2008
    Publication date: May 3, 2012
    Applicants: Seoul Laser Dieboard System Co., Ltd., Seoul Laser Dieboard System Co., Ltd.
    Inventor: Sang Moo Lee