Patents Assigned to Seoul Semiconductor Co., Ltd.
  • Patent number: 11444223
    Abstract: A light emitting device including at least one first light emitting unit including an ultraviolet or violet light emitting diode chip and a first wavelength converter, at least one second light emitting unit including an ultraviolet or violet light emitting diode chip and a second wavelength converter, and at least one third light emitting unit including an ultraviolet or violet light emitting diode chip and a third wavelength converter, in which color coordinates of the first light emitting unit, the second light emitting unit, and the third light emitting unit define a triangular region in a CIE-1931 coordinate system, the triangular region including at least a portion of the Plankian locus, and a maximum color temperature of the Plankian locus included in the triangular region is 5000K or higher, and a minimum color temperature of the Plankian locus included in the triangular region is 3000K or lower.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 13, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Bo Yong Han
  • Publication number: 20220285599
    Abstract: A circuit board includes a base having a plurality of interconnections on an upper surface thereof, a first photosensitive solder resist (PSR) covering the interconnections and defining a pad open region exposing portions of the interconnections, a second PSR covering the first PSR and having an opening exposing the pad open region. The opening of the second PSR is larger than the pad open region of the first PSR.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 8, 2022
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Youngsik KI, Seung Sik HONG
  • Patent number: 11437453
    Abstract: Disclosed are a display apparatus and a method of manufacturing the same. The display apparatus includes a light emitting part including a plurality of light emitting diodes; and a thin film transistor (TFT) panel part configured to drive the plurality of light emitting diodes. The plurality of light emitting diodes are electrically connected to the plurality of TFTs, respectively, by a layer disposed between the light emitting diode part and the TFT panel part.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: September 6, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Jong Ik Lee, Young Hyun Kim
  • Patent number: 11430771
    Abstract: According to one embodiment, there is provided a white light source system. P(?), B(?) and V(?) satisfy an equation (1) below in a wavelength range of 380 nm to 780 nm. The white light source system satisfies an expression (2) below in a wavelength range of 400 nm to 495 nm: ? 380 780 ? P ? ( ? ) ? V ? ( ? ) ? d ? ? ? = ? 380 780 ? B ? ( ? ) ? V ? ( ? ) ? d ? ? ? ( 1 ) where P(?) is a light emission spectrum of white light, B(?) is a light emission spectrum of blackbody radiation of a color temperature correspond to a color temperature of the white light, and V(?) is a spectrum of a spectral luminous efficiency.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: August 30, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Masahiko Yamakawa, Noriaki Yagi, Kumpei Kobayashi
  • Patent number: 11424390
    Abstract: A light emitting device includes a light emitting diode chip, a light transmitting member, a white barrier member, and a conductive adhesive member. The light emitting diode chip has a bump pad formed on the lower surface thereof. The light transmitting member covers the side surfaces and the upper surface of the light emitting diode chip, and the upper surface of the light transmitting member has a rectangular shape having long sides and short sides. The conductive adhesive member is formed to extend through the white barrier member from the bottom of the light emitting diode chip. The upper surface of the conductive adhesive member is connected to the bump pad of the light emitting diode chip, and the lower surface of the conductive adhesive member is exposed at the lower surface of the white barrier member.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: August 23, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Ji Ho Kim
  • Patent number: 11417807
    Abstract: A light emitting device including at least one main light emitting unit including a light emitting diode chip and a wavelength converter, and configured to emit white light, in which the light emitting diode chip includes at least one of an ultraviolet chip, a violet chip, and a blue chip, and the light emitting device is configured to be adjustable to emit light corresponding to a spectral power distribution of morning sunlight, light corresponding to a spectral power distribution of afternoon sunlight, and light corresponding to a spectral power distribution of evening sunlight.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: August 16, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Hyuck Jun Kim, Chung Hoon Lee, Yo Cho
  • Patent number: 11417640
    Abstract: A display apparatus includes: a transparent substrate; a panel substrate; a light emitting diode disposed between the transparent substrate and the panel substrate; an insulation layer covering side surfaces of the light emitting diode; a first connection electrode electrically connected to the light emitting diode and disposed on the insulation layer between the insulation layer and the panel substrate; a second connection electrode on the panel substrate; and an electrode connector electrically connecting the first connection electrode to the second connection electrode, wherein the first connection electrode has an overlapping portion overlapping with the light emitting diode and a non-overlapping portion laterally extending from the overlapping portion on the insulation layer.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: August 16, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim
  • Publication number: 20220254761
    Abstract: A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 11, 2022
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jae Hyun PARK, Seong Jin LEE, Jong Kook LEE
  • Publication number: 20220246808
    Abstract: A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri CHOI, Hyuck Jun KIM, Se Min BANG, Do Choul WOO, Se Won TAE
  • Patent number: 11355686
    Abstract: A unit pixel including a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, an adhesive layer bonding the light emitting devices to the transparent substrate, a step adjusting layer covering the light emitting device and bonded to the adhesive layer, a plurality of connection layers disposed on the step adjustment layer and electrically connected to the light emitting devices, in which the step adjustment layer has a concave-convex pattern along an edge thereof.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: June 7, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Seung Sik Hong
  • Patent number: 11355685
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 7, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Li Choi, Se Min Bang, Se Won Tae
  • Patent number: 11350496
    Abstract: A lighting apparatus including a controller including a real time clock, an LED driver, and an LED luminaire including a first light emitting unit including a first LED to emit light having a peak wavelength between 300 to 470 nm and a wavelength converter, and at least one of a second light emitting unit to emit light having a peak wavelength between 286 to 304 nm to cause production of vitamin D, a third light emitting unit to emit light having a peak wavelength between 605 to 935 nm to cause production of a cell activating substance, and a fourth light emitting unit to emit light having a peak wavelength between 400 to 430 nm to sterilize pathogenic microorganisms, in which the controller controls the LED driver to change an irradiance of light emitted from at least one of the light emitting units according to time.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: May 31, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Jun Ho Song, Bo Yong Han
  • Patent number: 11348907
    Abstract: A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: May 31, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Jae Hyun Park, Seong Jin Lee, Jong Kook Lee
  • Patent number: 11335837
    Abstract: A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: May 17, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Ri Choi, Hyuck Jun Kim, Se Min Bang, Do Choul Woo, Se Won Tae
  • Patent number: 11322484
    Abstract: The present invention provides a light emitting device comprising a first light emitting portion that emits white light at a color temperature of 6000K or more and a second light emitting portion that emits white light at a color temperature of 3000K or less, which include light emitting diode chips and phosphors and are independently driven. The present invention has an advantage in that a light emitting device can be diversely applied in a desired atmosphere and use by realizing white light with different light spectrums and color temperatures. Particularly, the present invention has the effect on health by adjusting the wavelength of light or the color temperature according to the circadian rhythm of humans.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: May 3, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Gundula Roth, Walter Tews, Chung-Hoon Lee
  • Publication number: 20220130805
    Abstract: A light emitting module includes a circuit board, and light emitting diode chips arranged in a plurality of regions on the circuit board. The light emitting diode chips are divided into a plurality of light emitting diode groups connected in series. The plurality of light emitting diode groups is connected in parallel to one another, and at least one of the light emitting diode chips in at least one of the plurality of light emitting diode groups is disposed in a region different from that of at least one other light emitting diode chip.
    Type: Application
    Filed: January 4, 2022
    Publication date: April 28, 2022
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Seung Yong YEO, Tae Jin CHUNG, Jingxian WANG, Pengfei WANG
  • Patent number: 11316076
    Abstract: A light emitting diode package includes a body part having a cavity at the upper part thereof and having a long shape in one direction; and a first lead frame and a second lead frame which are coupled to the bottom of the body part and spaced apart from each other in a transverse direction. The first lead frame includes a first mounting part exposed in the cavity; a first terminal part exposed to one side surface of the body part; and a first connection part exposed to the lower surface of the body part. The second lead frame includes a second mounting part exposed in the cavity; a second terminal part exposed to the other side surface of the body part along a one-side direction; and a second connection part exposed to the lower surface of the body part.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: April 26, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Ji Ho Kim
  • Patent number: 11304376
    Abstract: A plant cultivation light source includes at least two light sources selected from first, second, and third light sources that emit first, second, and third lights, respectively. The first light has a first peak at a wavelength from about 400 nanometers to about 500 nanometers, the second light has a second peak appearing at a wavelength, which is longer than the first peak, from about 400 nanometers to about 500 nanometers, and the third light has a third peak appearing at a wavelength, which is shorter than the first peak, from about 400 nanometers to about 500 nanometers. The first light is a white light and has a first sub-peak having an intensity lower than an intensity of the first peak at a wavelength from about 500 nanometers to about 700 nanometers. The first sub-peak has a full-width at half-maximum greater than a full-width at half-maximum of the first peak.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: April 19, 2022
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Mark McClear
  • Patent number: 11309469
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: April 19, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Li Choi, Se Min Bang, Se Won Tae
  • Patent number: 11300830
    Abstract: A display apparatus including a frame, a plurality of LEDs regularly arranged on the frame, an optical part disposed on the LEDs and including a display panel and at least one of a phosphor sheet and an optical sheet, and a light guide plate disposed between the frame and the optical part to cover the LEDs, in which the LEDs are arranged in a matrix to be separated from each other at a constant interval, each of the LEDs includes a light emitting diode chip and a reflector disposed on an upper surface of the light emitting diode chip and contacting the upper surface of the light emitting diode chip, the reflector being configured to reflect at least part of light emitted from the light emitting diode chip.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: April 12, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Eun Ju Kim