Patents Assigned to Seoul Semiconductor Co., Ltd.
  • Patent number: 10018325
    Abstract: Disclosed herein is a light device of a vehicle including: a light emitting diode module emitting light; and a light guide plate having a side on which the light emitted from the light emitting diode module is incident and emitting the light incident on the side to perform surface emission upwardly, in which the light guide plate has a plane shape including at least one concave portion and the light emitting diode module is installed in the at least one concave portion. According to the exemplary embodiments of the present invention, when the light guide plate used in the light device installed at the rear of the vehicle to perform the surface emission is formed in a horseshoe shape or a ring shape, the light emitting diode module may be installed at a concave position of the horseshoe shape or the light emitting diode module may be installed along a ring-shaped inner side, thereby uniformly performing the surface emission over the whole of the light guide plate.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: July 10, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Kwang Kim, Young Jun Song, Lae Hyun Kim, Yeoun Chul Shon
  • Patent number: 10020425
    Abstract: A light-emitting diode includes, a semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer. The light-emitting diode also includes a transparent conductive layer including a first transparent conductive layer disposed on the second semiconductor layer and a second transparent conductive layer disposed on the first transparent conductive layer. The second transparent conductive layer has a conductivity different than the first transparent conductive layer.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: July 10, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Chan Seob Shin, Hyoung Jin Lim, Kyoung Wan Kim, Yeo Jin Yoon, Jacob J Richardson, Daniel Estrada, Evan C. O'Hara, Haoran Shi
  • Patent number: 9995453
    Abstract: An LED illumination apparatus includes a substrate, a light source disposed on a top side of the substrate, a cover unit configured to cover the light source, and a reflector configured to extend from inside the cover unit towards the upper substrate, such that light generated by the light source illuminates an area below a bottom side of the substrate.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: June 12, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Ki Tae Kang
  • Patent number: 9978919
    Abstract: Disclosed is a light emitting device. The light emitting device comprises: a first lead and a second lead which are spaced apart from each other; a body part comprising a base, a reflector, and a cavity; and a light emitting diode which is disposed in the cavity, wherein the first lead includes a first bottom lead and a first top lead located on the first bottom lead, and the second lead includes a second bottom lead and a second top lead located on the second bottom lead, and wherein a separation region between the first top lead and the second top lead has a different shape than the separation region between the first bottom lead and the second bottom lead, the separation region between the first top lead and the second top lead having a shape bent at least once.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: May 22, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Tae Chang Lee
  • Patent number: 9978727
    Abstract: A display apparatus including a light emitting diode part including a plurality of regularly arranged light emitting diodes, and a thin-film transistor (TFT) panel part including a plurality of TFTs configured to drive the light emitting diodes disposed on the TFT panel part. The light emitting diode part further includes a transparent substrate disposed on the light emitting diodes, and a phosphor layer disposed on the transparent substrate and configured to emit at least one of blue light, green light, and red light by converting at least a portion of a wavelength of light emitted from the light emitting diodes, in which a thickness of the transparent substrate is less than a thickness of the phosphor layer.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: May 22, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim, Jong Ik Lee
  • Patent number: 9960324
    Abstract: A light-emitting device including a substrate, a first light-emitting diode disposed on the substrate, a molding member encapsulating the first light-emitting diode, and luminophores dispersed in the molding member and including a surface-modified luminophore, in which the surface-modified luminophore includes a fluorinated coating and a fluoride luminophore including a manganese activator. The fluoride luminophore is selected from the group consisting of K2SiF6, Na2SiF6, Rb2SiF6, K2GeF6, Na2GeF6, and Rb2GeF6.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: May 1, 2018
    Assignees: Seoul Semiconductor Co., Ltd., LITEC-LP GmbH
    Inventors: Chung Hoon Lee, Walter Tews, Gundula Roth, Detlef Starick
  • Patent number: 9951924
    Abstract: An LED illumination apparatus includes a substrate, a light source disposed on the substrate, a cover unit covering the light source, and a reflector extending from the inside of the cover unit to the upper surface of the substrate, such that light generated by the light source illuminates an area below a bottom surface of the substrate.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: April 24, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Ki Tae Kang
  • Patent number: 9947717
    Abstract: A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: April 17, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Shiro Sakai, Jin-Ping Ao, Yasuo Ono
  • Patent number: 9929330
    Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: March 27, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Bang Hyun Kim
  • Patent number: 9918360
    Abstract: A lighting apparatus using light emitting diodes is disclosed. A plurality of light-emitting groups are connected to each other in series at an output terminal of a rectification unit. Current diodes as current sources are branched from a node between the light-emitting groups. Current values set in the current diodes are set according to the amount of current flowing into the light-emitting groups. Therethrough, the amount of current flowing in each light-emitting group can be determined.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: March 13, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Chung Hoon Lee, Keon Young Lee
  • Patent number: 9910203
    Abstract: A light source including a circuit board, at least one light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), and a reflective portion formed on the circuit board and enclosing the light emitting device. The reflective portion formed on the circuit board reflects light emitted from the light emitting device in one direction, to reduce light loss while focusing light in a desired direction.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: March 6, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seoung Ho Jung, Jung Hwa Jung, Ki Bum Nam
  • Patent number: 9899573
    Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: February 20, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Eun Jung Seo
  • Patent number: 9885457
    Abstract: An LED illumination apparatus includes a substrate, a light source disposed on a top side of the substrate, a cover unit configured to cover the light source, and a reflector configured to extend from inside the cover unit towards the upper substrate, such that light generated by the light source illuminates an area below a bottom side of the substrate.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: February 6, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Ki Tae Kang
  • Patent number: 9887184
    Abstract: A display apparatus and a method of manufacturing the same are disclosed. The display apparatus includes: a first substrate including a light emitting diode part including a plurality of light emitting diodes regularly arranged on the first substrate; and a second substrate including a TFT panel unit including a plurality of TFTs driving the light emitting diodes. The first substrate and the second substrate are coupled to each other so as to face each other such that the light emitting diodes are electrically connected to the TFTs, respectively. The display apparatus is implemented using micro-light emitting diodes formed of nitride semiconductors and thus can provide high efficiency and high resolution to be applicable to a wearable apparatus while reducing power consumption.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: February 6, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Young Hyun Kim
  • Patent number: 9880417
    Abstract: A light-emitting apparatus having a 16:9 geometry includes light-emitting elements disposed on a first substrate or a second substrate, light flux control members respectively disposed on the light-emitting elements and on the first or second substrate, and a film stack disposed above the light flux control members. Each light flux control member includes a bottom surface section disposed on the first or second substrate, a non-rotationally symmetric input surface section having an inward recess disposed in the bottom surface section at a position directly above one of the light-emitting elements, and a non-rotationally symmetric output surface configured to refract light passing through the input surface section, and to transmit light outside. The light flux control members disposed on the first substrate are spaced 100 mm apart from each other in a first direction, and the light-emitting elements are spaced 23 mm away from the film stack.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: January 30, 2018
    Assignees: Seoul Semiconductor Co., Ltd., InteLED Corp.
    Inventors: Mark Jongewaard, William A. Parkyn, David Pelka
  • Patent number: 9882102
    Abstract: A light-emitting diode including a semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first and second semiconductor layers, wherein the second semiconductor layer and the active layer provide a contact region exposing the first semiconductor layer, a first bump arranged on a first side of the semiconductor stack and being electrically connected to the first semiconductor layer via the contact region, a second bump arranged on the first side of the semiconductor stack and being electrically connected to the second semiconductor layer, a first insulation layer disposed covering a side surface of the first bump, and a wavelength converter disposed on a second side of the semiconductor stack. The wavelength converter laterally extends beyond the semiconductor stack. The first insulation layer includes a side surface that is flush with a side surface of the wavelength converter.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: January 30, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Won Cheol Seo, Dae Sung Cho
  • Patent number: 9857526
    Abstract: A backlight unit includes: a light guide plate of an entirely flat structure; a light emitting element disposed on at least one side of the light guide plate; a first reflection part disposed under the light guide plate and having one side thereof extended to a region where the light emitting element is positioned; a second reflection part disposed on the light emitting element; and a housing for accommodating the light guide plate, the light emitting element, and the first and second reflection parts, wherein the housing has a second side which is vertically extended upwards with respect to a first side which defines a lateral cross section of the housing in which the light emitting element is accommodated as the lower side, and a third side which is vertically extended inwards with respect to the second side.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: January 2, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Young Jun Song
  • Patent number: 9859259
    Abstract: The present invention provides a light emitting apparatus comprising a three-color light emitting device unit including at least three light emitting diode (LED) chips for respectively emitting red, green and blue light; a white light emitting device unit including at least one blue LED chip with a fluorescent substance formed thereon; and a substrate provided with a first electrode connected in common to ends of the LED chips and second electrodes formed to correspond respectively to the LED chips.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: January 2, 2018
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Jae Hong Lee
  • Patent number: 9853189
    Abstract: Embodiments of the disclosure provide a backlight module using MJT LEDs and a backlight unit including the same. More specifically, embodiments of the disclosure provide a backlight module, which includes MJT LEDs configured to increase an effective light emitting area of each of light emitting cells and optical members capable of uniformly dispersing light emitted from the MJT LEDs. In addition, embodiments of the disclosure provide a backlight unit using the backlight module, thereby reducing the number of LEDs constituting the backlight unit while allowing operation at low current.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: December 26, 2017
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Young Jun Song, Hyuck Jung Choi, Il Kyung Suh
  • Patent number: 9851059
    Abstract: A light-emitting module including a circuit board, a light-emitting device disposed on the circuit board, and a lens disposed on the circuit board and configured to distribute light emitted from the light emitting device. The lens includes a concave portion having an incidence surface configured to receive incident light emitted from the light-emitting device, and the light emitting device is disposed within the concave portion of the lens.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: December 26, 2017
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Eun Ju Kim