Patents Assigned to Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd
  • Patent number: 12159179
    Abstract: The present disclosure discloses a three-dimensional integration system of an RFID chip and a supercapacitor and a manufacturing method thereof.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: December 3, 2024
    Assignees: Fudan University, Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd
    Inventors: Bao Zhu, Lin Chen, Qingqing Sun, Wei Zhang