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Patents
Patents Assigned to Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd
Patents Assigned to Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd
Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof
Patent number:
12159179
Abstract:
The present disclosure discloses a three-dimensional integration system of an RFID chip and a supercapacitor and a manufacturing method thereof.
Type:
Grant
Filed:
July 2, 2020
Date of Patent:
December 3, 2024
Assignees:
Fudan University, Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd
Inventors:
Bao Zhu, Lin Chen, Qingqing Sun, Wei Zhang