Patents Assigned to Shenzhen Wivision Technology Co., Ltd.
  • Publication number: 20250014216
    Abstract: A method for deformation measurement is provided. When the mobile platform moves to a first monitoring position in an area to-be-measured, a first image is obtained by photographing J1 monitoring points in a first area to-be-measured in the area to-be-measured, and a second image is obtained by J2 monitoring points in a second area to-be-measured in the area to-be-measured. When the mobile platform moves to a second monitoring position, a third image is obtained by photographing the J1 monitoring points, and a fourth image is obtained by photographing the J2 monitoring points. J1 first monitoring points are determined according to the first image and the third image, and J2 second monitoring points are determined according to the second image and the fourth image. A horizontal displacement amount and a vertical subsidence amount of each of the J1 first monitoring points and the J2 second monitoring points are obtained.
    Type: Application
    Filed: September 20, 2024
    Publication date: January 9, 2025
    Applicants: SHENZHEN UNIVERSITY, Shenzhen Wivision Technology Co., Ltd.
    Inventors: Yihe YIN, Qifeng YU, Xiaolin LIU, Yueqiang ZHANG, Biao HU