Patents Assigned to SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
  • Patent number: 11941850
    Abstract: Disclosed herein is an image sensor with two radiation detectors, each having a planar surface for receiving radiation; and a calibration pattern. The planar surfaces of the radiation detectors are not coplanar. The image sensor can capture images of two portions of the calibration pattern, respectively using the radiation detectors. The image sensor can determine two transformations for the radiation detectors based on the images of the portions of the calibration pattern, respectively. The image sensor can capture images of two portions of a scene, respectively using the radiation detectors, determine projections of the images of the portions of the scene onto an image plane using the transformations, respectively, and form an image of the scene by stitching the projections.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: March 26, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Yurun Liu, Peiyan Cao
  • Patent number: 11921056
    Abstract: Disclosed herein is an apparatus comprising: a first radiation source configured to produce a first divergent beam of radiation toward an object; a second radiation source configured to produce a second divergent beam of radiation toward the object; and an image sensor. The image sensor, the first radiation source and the second radiation source are configured to rotate around the object, and relative positions among the image sensor, the first radiation source and the second radiation source are fixed during rotation around the object. The method of using the apparatus is also disclosed herein.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: March 5, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11918394
    Abstract: Disclosed herein is a detector, comprising: a radiation absorption layer comprising an electric contact; a filter electrically connected to the electric contact and configured to attenuate signals from the electric contact below a first cutoff frequency; an integrator electrically connected to the filter and configured to integrate signals from the filter over a period of time.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: March 5, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11906676
    Abstract: Disclosed herein is a radiation detector, comprising a first pixel; a first reflector; and a first scintillator, wherein the first reflector is configured to guide essentially all photons emitted by the first scintillator into the first pixel. The first reflector is configured to reflect photons emitted by the first scintillator toward the first reflector. The first scintillator is essentially completely enclosed by the first reflector and the first pixel.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: February 20, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11906677
    Abstract: Disclosed herein is a method of recovering performance of a radiation detector, the radiation detector comprising: a radiation absorption layer configured to absorb radiation particles incident thereon and generate an electrical signal based on the radiation particles; an electronic system configured to process the electrical signal, the electronic system comprising a transistor, the transistor comprising a gate insulator with positive charge carriers accumulated therein due to exposure of the gate insulator to radiation; the method comprising: removing the positive charge carriers from the gate insulator by establishing an electric field across the gate insulator.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: February 20, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11904187
    Abstract: Disclosed herein is a method comprising: generating multiple radiation beams respectively from multiple locations toward an object and an image sensor, wherein the image sensor comprises an array of multiple active areas, and gaps among the multiple active areas, and capturing multiple partial images of the object with the image sensor using respectively radiations of the multiple radiation beams that have passed through and interacted with the object, wherein each point of the object is captured in at least one partial image of the multiple partial images.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: February 20, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11901244
    Abstract: Disclosed herein is a method comprising: attaching a plurality of chips to a substrate, wherein each of the chips comprises only one pixel configured to detect radiation. Disclosed herein is a method comprising: attaching a wafer to a substrate, wherein the substrate comprises discrete electrodes, wherein the wafer comprises a radiation absorption layer and a plurality of electrical contacts, wherein each of the electrical contacts is connected to at least one of the discrete electrodes; identifying a defective area of the wafer; replacing a portion of the wafer with a chip configured to absorb radiation, the portion comprising the defective area.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 13, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11882378
    Abstract: Disclosed herein is a method, comprising sending radiation beam groups (i, j), i=1, . . . , M and j=1, . . . , Ni toward a same scene, wherein each radiation beam group comprises multiple parallel fan radiation beams sent simultaneously, wherein for each value of i, the radiation beam groups (i, j), j=1, . . . , Ni are parallel to each other and are sent one group at a time, and wherein no two radiation particle paths of two respective radiation beam groups with 2 different values of i are parallel to each other; for i=1, . . . , M and j=1, . . . , Ni, capturing with radiation of the radiation beam group (i, j) a partial image (i, j) of the scene; for each value of i, stitching the partial images (i, j), j=1, . . . , Ni; and reconstructing a 3-dimensional image of the scene from the stitched images (i), i=1, . . . , M.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: January 23, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Yurun Liu, Peiyan Cao
  • Patent number: 11860322
    Abstract: Disclosed herein is a radiation detector, comprising: an avalanche photodiode (APD) with a first side coupled to an electrode and configured to work in a linear mode; a capacitor module electrically connected to the electrode and comprising a capacitor, wherein the capacitor module is configured to collect charge carriers from the electrode onto the capacitor; a current sourcing module in parallel to the capacitor, the current sourcing module configured to compensate for a leakage current in the APD and comprising a current source and a modulator; wherein the current source is configured to output a first electrical current and a second electrical current; wherein the modulator is configured to control a ratio of a duration at which the current source outputs the first electrical current to a duration at which the current source outputs the second electrical current.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: January 2, 2024
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11852760
    Abstract: Disclosed herein is a method comprising: aligning a collimator and a plurality of radiation detectors of an image sensor by: moving the radiation detectors along a first direction; moving the collimator along a second direction perpendicular to the first direction; rotating the collimator about an axis perpendicular to the first direction and the second direction; wherein the plurality of radiation detectors are configured to capture images of portions of a scene at different image capturing positions, respectively, and to form an image of the scene by stitching the images of the portions.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: December 26, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11848347
    Abstract: Disclosed herein is an image sensor and a method of making the image sensor. The image sensor may comprise one or more packages of semiconductor radiation detectors. Each of the one or more packages may comprise a radiation detector that comprises a radiation absorption layer on a first strip of semiconductor wafer and an electronics layer on a second strip of semiconductor wafer. The radiation absorption layer may be continuous along the first strip of semiconductor wafer with no coverage gap. The first strip and the second strip may be longitudinally aligned and bonded together. The radiation detector may be mounted on a printed circuit board (PCB) and electrically connected to the PCB close to an edge of the radiation detector.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: December 19, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Chongshen Song, Yurun Liu
  • Patent number: 11837624
    Abstract: Disclosed herein are a radiation detector and a method of making it. The radiation detector is configured to absorb radiation particles incident on a semiconductor single crystal of the radiation detector and to generate charge carriers. The semiconductor single crystal may be a CdZnTe single crystal or a CdTe single crystal. The method may comprise forming a recess into a substrate of semiconductor; forming a semiconductor single crystal in the recess; and forming a heavily doped semiconductor region in the substrate. The semiconductor single crystal has a different composition from the substrate. The heavily doped region is in electrical contact with the semiconductor single crystal and embedded in a portion of intrinsic semiconductor of the substrate.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: December 5, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11826192
    Abstract: Disclosed herein is an apparatus, comprising: a platform configured to support a human body on a first surface of the platform; a first set of radiation detectors arranged in a first layer, wherein the radiation detectors of the first set are attached to a second surface of the platform opposite the first surface; wherein the radiation detectors of the first set are configured to detect radiation from a radiation source inside the human body.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: November 28, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11825201
    Abstract: Disclosed herein is a method of using an image sensor comprising N sensing areas for capturing images of a scene, the N sensing areas being physically separate from each other, the method comprising: for i=1, . . . , P, and j=1, . . . , Q(i), positioning the image sensor at a location (i,j) and capturing a partial image (i,j) of the scene using the image sensor while the image sensor is at the location (i,j), thereby capturing in total R partial images, wherein R is the sum of Q(i), i=1, . . . , P, wherein P>1, wherein Q(i), i=1, . . . , P are positive integers and are not all 1, wherein for i=1, . . . , P, a location group (i) comprises the locations (i,j), j=1, . . . , Q(i), and wherein a minimum distance between 2 locations of 2 different location groups is substantially larger than a maximum distance between two locations of a same location group; and determining a combined image of the scene based on the R partial images.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: November 21, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11815636
    Abstract: Disclosed herein is a radiation detector, comprising: an avalanche photodiode (APD) with a first side coupled to an electrode and configured to work in a linear mode; a capacitor module electrically connected to the electrode and comprising a capacitor, wherein the capacitor module is configured to collect charge carriers from the electrode onto the capacitor; a current sourcing module in parallel to the capacitor, the current sourcing module configured to compensate for a leakage current in the APD and comprising a current source and a modulator; wherein the current source is configured to output a first electrical current and a second electrical current; wherein the modulator is configured to control a ratio of a duration at which the current source outputs the first electrical current to a duration at which the current source outputs the second electrical current.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: November 14, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11815633
    Abstract: Disclosed herein are apparatuses for detecting radiation and methods of making them. The method comprises forming a recess into a semiconductor substrate, wherein a portion of the semiconductor substrate extends into the recess and is surrounded by the recess; depositing semiconductor nanocrystals into the recess, the semiconductor nanocrystals having a different composition from the semiconductor substrate; forming a first doped semiconductor region in the semiconductor substrate; forming a second doped semiconductor region in the semiconductor substrate; wherein the first doped semiconductor region and the second doped semiconductor region form a p-n junction that separates the portion from the rest of the semiconductor substrate.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: November 14, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Yurun Liu, Peiyan Cao
  • Patent number: 11784194
    Abstract: Disclosed herein is a detector having a pixel in a substrate and configured to detect radiation particles incident thereon; a first guard ring in the substrate, surrounding the pixel, and comprising a first doped semiconductor region in the substrate and a first electrically conductive layer in electrical contact to the first doped semiconductor region. The first electrically conductive layer overhangs the first doped semiconductor region toward an interior of the first guard ring.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: October 10, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11782173
    Abstract: Disclosed herein is an apparatus suitable for detecting radiation, comprising: a plurality of pixels configured to generate an electric signal upon exposure to a radiation; an electronic system configured to read out the electric signal; wherein the electronic system comprises a first memory and a second memory; wherein the first memory is configured to store a plurality of data bits representing the electric signal generated by the pixel that the first memory is associated with; wherein the electronic system is configured to transmit a subset of bits among the plurality of data bits, from the first memory to the second memory; wherein the electronic system is configured to transmit the subset of bits from the second memory to a bus.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: October 10, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventor: Peiyan Cao
  • Patent number: 11776986
    Abstract: Disclosed herein are various methods of packaging a semiconductor X-ray detector. The methods may include bonding chips including an X-ray absorption layer or including both an X-ray absorption layer and an electronic layer onto another support such as an interposer substrate or a printed circuit board.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: October 3, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11774609
    Abstract: Disclosed herein is an apparatus suitable for detecting x-ray, comprising: an X-ray absorption layer configured to generate an electrical signal from an X-ray photon incident on the X-ray absorption layer; an electronics layer comprising an electronics system configured to process or interpret the electrical signal; and an interposer chip embedded in a board of an electrically insulating material; wherein the X-ray absorption layer is bonded to the electronics layer; wherein the electronics layer is bonded to the interposer chip.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: October 3, 2023
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu