Patents Assigned to Silanna Asia Pte Ltd
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Patent number: 11469667Abstract: An improved power converter produces power through a power switch in response to an activation signal that has an on-time and a switching frequency. An on-time signal has a constant on-time and controls the on-time of the activation signal. An error signal indicates that the switching frequency is not equal to a reference frequency. A step up signal and a step down signal are based on the error signal. A count signal is increased in response to the step up signal and decreased in response to the step down signal. An on-time pulse has a duration that is related to a value of the count signal. The on-time pulse controls the constant on-time of the on-time signal and maintains the switching frequency at about the reference frequency.Type: GrantFiled: October 14, 2020Date of Patent: October 11, 2022Assignee: Silanna Asia Pte LtdInventors: Rawinder Dharmalinggam, Tiong Lim
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Patent number: 11451220Abstract: In a delay circuit, first and second sets of transistors are connected in series between a supply voltage and a ground. The first and second sets of transistors both include a current source transistor, a cascode transistor, and a control transistor. The first set of transistors generates a current that charges a capacitor to generate a ramp signal with a positive slope. A first bias transistor may cause the ramp signal to be biased to ground upon activating the first set of transistors. The second set of transistors generates a current that discharges the capacitor to generate the ramp signal with a negative slope. A second bias transistor may cause the ramp signal to be biased to the supply voltage upon activating the second set of transistors. The delay circuit transitions the state of the output signal based on a voltage level of the ramp signal.Type: GrantFiled: November 9, 2021Date of Patent: September 20, 2022Assignee: Silanna Asia Pte LtdInventors: Joseph H. Colles, Steven E. Rosenbaum, Stuart B. Molin
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Publication number: 20220294205Abstract: Embodiments of the disclosure include a switch having an on-state resistance that varies based on a temperature coefficient of the switch and an overcurrent protection circuit coupled to the switch and having an adjustable overcurrent threshold level determined based on an adjustable voltage generated by the overcurrent protection circuit, the adjustable voltage generated based on the temperature coefficient of the switch.Type: ApplicationFiled: June 1, 2022Publication date: September 15, 2022Applicant: Silanna Asia Pte LtdInventor: Guanghua Ye
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Patent number: 11444433Abstract: A laser diode driver includes a clock terminal to receive a clock signal, configuration terminals to receive configuration data, drive terminals, and charging terminals. A first charging terminal is operable to charge a source capacitor of a resonant circuit that includes the source capacitor, an inductor, and a bypass capacitor. Each drive terminal is operable to be directly electrically connected to an anode or cathode of a laser diode or to ground. A mode, output selection, and grouping of drive signals that are delivered to the laser diodes are configured based on the configuration data. The laser diode driver is operable to control a current flow through the resonant circuit to produce high-current pulses through the laser diodes, the high-current pulses corresponding to a peak current of a resonant waveform developed at respective anodes of the laser diodes, a timing of the high-current pulses being synchronized using the clock signal.Type: GrantFiled: August 31, 2021Date of Patent: September 13, 2022Assignee: Silanna Asia Pte LtdInventors: Joseph H. Colles, Steven E. Rosenbaum, Stuart B. Molin
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Publication number: 20220278027Abstract: A semiconductor package includes a leadframe having an electrically conductive paddle, electrically conductive perimeter package leads, a first electrically conductive clip electrically connected to a first set of the package leads, and a second electrically conductive clip electrically connected to a second set of the package leads. The semiconductor package includes a single semiconductor die. The die includes a front-side active layer having an integrated power structure of two or more transistors. The die includes a backside portion having a backside contact electrically coupled to at least one of the two or more transistors and to the paddle. One or more first front-side contacts of the die are electrically coupled to at least one of the transistors and to the first clip, and one or more second front-side contacts of the die are electrically coupled to at least one of the transistors and to the second clip.Type: ApplicationFiled: April 26, 2022Publication date: September 1, 2022Applicant: Silanna Asia Pte LtdInventors: Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Stuart B. Molin, Raymond Jiang
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Publication number: 20220271672Abstract: A quasi-resonant auto-tuning controller includes a zero-voltage crossing detection circuit and a valley tuning finite-state machine having a look-up table. The zero-voltage crossing detection circuit receives a reference voltage and receives an auxiliary signal from an auxiliary winding. The zero-voltage crossing detection circuit produces a comparison signal having pulses when the auxiliary signal is less than the reference voltage. The valley tuning finite-state machine produces a divided pulse width based on the comparison signal, stores the divided pulse width of each pulse in the look-up table, determines, from the comparison signal, that the auxiliary signal is less than the reference voltage, waits a time period corresponding to the divided pulse width stored in the look-up table if the auxiliary signal is less than the reference voltage, and produces a valley point signal after waiting the time period.Type: ApplicationFiled: May 16, 2022Publication date: August 25, 2022Applicant: Silanna Asia Pte LtdInventor: Aleksandar Radic
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Patent number: 11424717Abstract: A closed-loop switch-mode boost converter includes a switching signal generator circuit, a switch-mode boost amplifier, a filter circuit, and an error amplifier circuit. The switching signal generator circuit receives an input signal and outputs a switching signal. A duty-cycle of the switching signal has a first non-linear relationship to an amplitude of the input signal. The switch-mode boost amplifier receives the switching signal and produces an output signal. An amplitude of the output signal has a second non-linear relationship to the duty-cycle of the switching signal, and the output signal has a linear relationship to the input signal based on the first and second non-linear relationships. The filter circuit receives the output signal and outputs a filtered output signal. The error amplifier circuit receives the input signal and the filtered output signal and produces a feedback control signal. The filtered output signal is adjusted based on the feedback control signal.Type: GrantFiled: July 24, 2020Date of Patent: August 23, 2022Assignee: Silanna Asia Pte LtdInventors: Steven E. Rosenbaum, Stuart B. Molin
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Publication number: 20220231152Abstract: A thyristor tile includes first and second PNP tiles and first and second NPN tiles. Each PNP tile is adjacent to both NPN tiles, and each NPN tile is adjacent to both PNP tiles. A thyristor includes a plurality of PNP tiles and a plurality of NPN tiles. The PNP and NPN tiles are arranged in an alternating configuration in both rows and columns. The PNP tiles are oriented perpendicular to the NPN tiles. Interconnect layers have a geometry that enables even distribution of signals to the PNP and NPN tiles.Type: ApplicationFiled: April 7, 2022Publication date: July 21, 2022Applicant: Silanna Asia Pte LtdInventors: Vadim Kushner, Nima Beikae
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Publication number: 20220208964Abstract: A semiconductor structure for facilitating an integration of power devices on a common substrate includes a first insulating layer formed on the substrate and an active region having a first conductivity type formed on at least a portion of the first insulating layer. A first terminal is formed on an upper surface of the structure and electrically connects with at least one other region having the first conductivity type formed in the active region. A buried well having a second conductivity type is formed in the active region and is coupled with a second terminal formed on the upper surface of the structure. The buried well and the active region form a clamping diode which positions a breakdown avalanche region between the buried well and the first terminal. A breakdown voltage of at least one of the power devices is a function of characteristics of the buried well.Type: ApplicationFiled: March 17, 2022Publication date: June 30, 2022Applicant: Silanna Asia Pte LtdInventors: Jacek Korec, Boyi Yang
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Patent number: 11374392Abstract: Embodiments of the disclosure include a switch having an on-state resistance that varies based on a temperature coefficient of the switch and an overcurrent protection circuit coupled to the switch and having an adjustable overcurrent threshold level determined based on an adjustable voltage generated by the overcurrent protection circuit, the adjustable voltage generated based on the temperature coefficient of the switch.Type: GrantFiled: March 1, 2021Date of Patent: June 28, 2022Assignee: Silanna Asia Pte LtdInventor: Guanghua Ye
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Publication number: 20220190811Abstract: A power transistor is switched on and off with an on-time that is held constant and an off-time that is varied. When the off-time is detected to be less than a threshold value that is greater than a minimum off-time limit, the on-time is extended. Then the power transistor is switched on and off with the extended on-time that is held constant and the off-time that varies.Type: ApplicationFiled: March 2, 2022Publication date: June 16, 2022Applicant: Silanna Asia Pte LtdInventors: Robert Eric Fesler, William E. Rader, III, Yashovardhan R. Potlapalli
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Publication number: 20220190156Abstract: A method for forming a semiconductor device involves providing a semiconductor wafer having an active layer of a first conductivity type. First and second gates having first and second gate polysilicon are formed on the active layer. A first mask region is formed on the active layer. Between the first and second gates, using the first mask region, the first gate polysilicon, and the second gate polysilicon as a mask, a deep well of a second conductivity type, a shallow well of the second conductivity type, a source region of the first conductivity type, and first and second channel regions of the second conductivity type, are formed. In the active layer, using one or more second mask regions, first and second drift regions of the first conductivity type, first and second drain regions of the first conductivity type, and a source connection region of the second conductivity type, are formed.Type: ApplicationFiled: March 3, 2022Publication date: June 16, 2022Applicant: Silanna Asia Pte LtdInventors: David Snyder, Shanghui Larry Tu
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Patent number: 11362591Abstract: A quasi-resonant auto-tuning controller includes a zero-voltage crossing detection circuit and a valley tuning finite-state machine having a look-up table. The zero-voltage crossing detection circuit receives a reference voltage and receives an auxiliary signal from an auxiliary winding. The zero-voltage crossing detection circuit produces a comparison signal having pulses when the auxiliary signal is less than the reference voltage. The valley tuning finite-state machine produces a divided pulse width based on the comparison signal, stores the divided pulse width of each pulse in the look-up table, determines, from the comparison signal, that the auxiliary signal is less than the reference voltage, waits a time period corresponding to the divided pulse width stored in the look-up table if the auxiliary signal is less than the reference voltage, and produces a valley point signal after waiting the time period.Type: GrantFiled: September 15, 2020Date of Patent: June 14, 2022Assignee: Silanna Asia Pte LtdInventor: Aleksandar Radic
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Publication number: 20220166418Abstract: In a delay circuit, first and second sets of transistors are connected in series between a supply voltage and a ground. The first and second sets of transistors both include a current source transistor, a cascode transistor, and a control transistor. The first set of transistors generates a current that charges a capacitor to generate a ramp signal with a positive slope. A first bias transistor may cause the ramp signal to be biased to ground upon activating the first set of transistors. The second set of transistors generates a current that discharges the capacitor to generate the ramp signal with a negative slope. A second bias transistor may cause the ramp signal to be biased to the supply voltage upon activating the second set of transistors. The delay circuit transitions the state of the output signal based on a voltage level of the ramp signal.Type: ApplicationFiled: November 9, 2021Publication date: May 26, 2022Applicant: Silanna Asia Pte LtdInventors: Joseph H. Colles, Steven E. Rosenbaum, Stuart B. Molin
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Patent number: 11335627Abstract: A semiconductor package includes a leadframe having an electrically conductive paddle, electrically conductive perimeter package leads, a first electrically conductive clip electrically connected to a first set of the package leads, and a second electrically conductive clip electrically connected to a second set of the package leads. The semiconductor package includes a single semiconductor die. The die includes a front-side active layer having an integrated power structure of two or more transistors. The die includes a backside portion having a backside contact electrically coupled to at least one of the two or more transistors and to the paddle. One or more first front-side contacts of the die are electrically coupled to at least one of the transistors and to the first clip, and one or more second front-side contacts of the die are electrically coupled to at least one of the transistors and to the second clip.Type: GrantFiled: January 8, 2020Date of Patent: May 17, 2022Assignee: Silanna Asia Pte LtdInventors: Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Stuart B. Molin, Raymond Jiang
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Publication number: 20220149588Abstract: A pulsed laser diode driver includes an inductor having a first terminal configured to receive a source voltage. A source capacitor has a first terminal connected to the first terminal of the inductor to provide the source voltage. A bypass switch has a drain node connected to a second terminal of the inductor and to a first terminal of a bypass capacitor. A laser diode switch has a drain node connected to the second terminal of the inductor. A laser diode has an anode connected to a source node of the laser diode switch and a cathode connected to a bias voltage node. The laser diode switch and the bypass switch control a current flow through the inductor to produce a high-current pulse through the laser diode, the high-current pulse corresponding to a peak current of a resonant waveform developed at the anode of the laser diode.Type: ApplicationFiled: January 25, 2022Publication date: May 12, 2022Applicant: Silanna Asia Pte LtdInventors: Joseph H. Colles, Steven E. Rosenbaum, Stuart B. Molin
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Patent number: 11316037Abstract: A thyristor tile includes first and second PNP tiles and first and second NPN tiles. Each PNP tile is adjacent to both NPN tiles, and each NPN tile is adjacent to both PNP tiles. A thyristor includes a plurality of PNP tiles and a plurality of NPN tiles. The PNP and NPN tiles are arranged in an alternating configuration in both rows and columns. The PNP tiles are oriented perpendicular to the NPN tiles. Interconnect layers have a geometry that enables even distribution of signals to the PNP and NPN tiles.Type: GrantFiled: June 5, 2020Date of Patent: April 26, 2022Assignee: Silanna Asia Pte LtdInventors: Vadim Kushner, Nima Beikae
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Patent number: 11302775Abstract: A semiconductor structure for facilitating an integration of power devices on a common substrate includes a first insulating layer formed on the substrate and an active region having a first conductivity type formed on at least a portion of the first insulating layer. A first terminal is formed on an upper surface of the structure and electrically connects with at least one other region having the first conductivity type formed in the active region. A buried well having a second conductivity type is formed in the active region and is coupled with a second terminal formed on the upper surface of the structure. The buried well and the active region form a clamping diode which positions a breakdown avalanche region between the buried well and the first terminal. A breakdown voltage of at least one of the power devices is a function of characteristics of the buried well.Type: GrantFiled: April 17, 2019Date of Patent: April 12, 2022Assignee: Silanna Asia Pte LtdInventors: Jacek Korec, Boyi Yang
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Patent number: 11290090Abstract: A power transistor is switched on and off with an on-time that is held constant and an off-time that is varied. When the off-time is detected to be less than a threshold value that is greater than a minimum off-time limit, the on-time is extended. Then the power transistor is switched on and off with the extended on-time that is held constant and the off-time that varies.Type: GrantFiled: December 15, 2020Date of Patent: March 29, 2022Assignee: Silanna Asia Pte LtdInventors: Robert Eric Fesler, William E. Rader, III, Yashovardhan R. Potlapalli
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Patent number: 11282955Abstract: A method for forming a semiconductor device involves providing a semiconductor wafer having an active layer of a first conductivity type. First and second gates having first and second gate polysilicon are formed on the active layer. A first mask region is formed on the active layer. Between the first and second gates, using the first mask region, the first gate polysilicon, and the second gate polysilicon as a mask, a deep well of a second conductivity type, a shallow well of the second conductivity type, a source region of the first conductivity type, and first and second channel regions of the second conductivity type, are formed. In the active layer, using one or more second mask regions, first and second drift regions of the first conductivity type, first and second drain regions of the first conductivity type, and a source connection region of the second conductivity type, are formed.Type: GrantFiled: May 20, 2020Date of Patent: March 22, 2022Assignee: Silanna Asia Pte LtdInventors: David Snyder, Shanghui Larry Tu