Patents Assigned to Sony Chemical & Information Device Corporation
  • Publication number: 20120222808
    Abstract: To mount electronic components with different types of electrodes en masse on a substrate, the present invention comprises a heating section that heats an electrode of a first electronic component and an electrode of a second electronic component among the plurality of electronic components; a heat releasing section that releases heat from the electrode of the first electronic component and the electrode of the second electronic component; a first thermally conductive member disposed between the electrode of the first electronic component and the heating section or the heat releasing section; and a second thermally conductive member disposed between the electrode of the second electronic component and the heating section or the heat releasing section. The first thermally conductive member and the second thermally conductive member have different amounts of heat transfer per unit time.
    Type: Application
    Filed: May 13, 2012
    Publication date: September 6, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Kazunori HAMAZAKI
  • Patent number: 8256684
    Abstract: The present invention provides an antenna apparatus (60) for use in a non-contact type IC card into and from which data can be written and read by an electronic apparatus having a communication function, by virtue of inductive coupling. The antenna apparatus includes a loop coil (61) and a magnetic member (62). The loop coil (61) is produced by winding a conductive wire in a plane and configured to perform the inductive coupling with the electronic apparatus. The magnetic member (62) covers one region (61a) of the loop coil, provided at one side, from one surface of the loop coil, passes through the loop coil, and covers the other region (61b) of the loop coil, provided at the other side, from the other surface of the loop coil.
    Type: Grant
    Filed: June 13, 2006
    Date of Patent: September 4, 2012
    Assignees: Sony Chemical & Information Device Corporation, Sony Corporation
    Inventors: Satoru Sugita, Keisuke Aramaki, Hiraku Akiho
  • Publication number: 20120218496
    Abstract: A red phosphor of high efficiency and a method for producing it are provided. A white light source and an illumination device that allow illumination with the pure white color using the red phosphor are also provided. In addition, a liquid crystal display device using the red phosphor and exhibiting good color reproducing performance is provided. The red phosphor contains an element A, europium (Eu), silicon (Si), carbon (C), oxygen (O) and nitrogen (N) in the ratios of the numbers of atoms of the following compositional formula (1): [Chemical Formula 1] [A(m?x)Eux][Si(9?y)Cy]OnN[12?2(n?m)/3]??compositional formula (1) where the element A is at least one of magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba), and where m, x and n in the compositional formula (1) satisfy the relationships of 3<m<5, 0<x<1, 0<y<2 and 0<n<10 (FIG. 5A).
    Type: Application
    Filed: December 28, 2011
    Publication date: August 30, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Takamasa Izawa, Hiraku Akiho, Tsuneo Kusunoki, Takahiro Igarashi, Masaki Kanno
  • Patent number: 8247697
    Abstract: Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure. The conductive film electrically connects a first circuit member with a second circuit member having a nitrogen atom containing film on a surface thereof facing the first circuit member, the conductive film including a first layer which is to be located at a first circuit member side, and a second layer which is to be located at a second circuit member side, wherein the first layer comprises a cationic curing agent and a first thermosetting resin, and the second layer comprises a radical curing agent and a second thermosetting resin, and wherein at least one of the first and second layers comprises conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: August 21, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Tomoyuki Ishimatsu
  • Publication number: 20120206307
    Abstract: An antenna device includes an antenna coil that receives a magnetic field transmitted from a reader/writer and a capacitor. The antenna device also includes a magnetic sheet formed at a face-to-face position with respect to the antenna coil and configured for changing the inductance of the antenna coil. The capacitor has a temperature characteristic in which the capacitance of the capacitor is changed with changes in temperature. The magnetic sheet is formed of a magnetic material having a temperature characteristic in which the inductance of the antenna coil is made to be changed with an opposite sign of change to that of the capacitance of the capacitor that is changed with changes in temperature in the working temperature range. In this manner, the resonance frequency of the antenna circuit in the working temperature range may be brought approximately into coincidence with the oscillation frequency of the reader/writer.
    Type: Application
    Filed: February 3, 2012
    Publication date: August 16, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Katsuhisa Orihara, Satoru Sugita, Norio Saito, Masayoshi Kanno
  • Publication number: 20120205025
    Abstract: A method for producing a magnetic sheet wherein a magnetic sheet composition onto a substrate. The magnetic sheet composition contains: a binder; magnetic powder; and a curing agent, wherein the binder contains a thermosetting organic resin, and the curing agent contains a sulfonium borate complex expressed by General Formula 1: where R1 is an aralkyl group, R2 is a lower alkyl group, X is a halogen atom, and n is an integer of 0 to 3.
    Type: Application
    Filed: April 16, 2012
    Publication date: August 16, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Keisuke Aramaki, Yoshihisa Shinya, Katsuhiko Komuro
  • Publication number: 20120204414
    Abstract: A method for manufacturing an antenna device is provided. The manufacturing method includes forming an antenna circuit so that the resonance frequency of the antenna circuit will be lower than an oscillation frequency of the reader/writer and affixing a magnetic sheet to an antenna coil via an adhesive. The antenna circuit includes the antenna coil that receives the magnetic field transmitted from the reader/writer and a capacitor electrically connected to the antenna coil. The magnetic sheet is at a face-to-face position with respect to the antenna coil and is configured to change the inductance of the antenna coil. The adhesive is of a film thickness to change the inductance so that the resonance frequency of the resonance circuit will be coincident with the oscillation frequency depending on the spacing between the antenna coil and the magnetic sheet.
    Type: Application
    Filed: January 30, 2012
    Publication date: August 16, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Katsuhisa Orihara, Satoru Sugita, Norio Saito, Masayoshi Kanno
  • Patent number: 8241455
    Abstract: A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: August 14, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Takashi Matsumura
  • Publication number: 20120200167
    Abstract: An antenna device that is able to maintain the resonance frequency approximately constant despite changes in temperature to provide for stabilized communication is provided. The antenna device includes an antenna coil that receives a magnetic field transmitted from a reader/writer and a capacitor. The antenna device also includes a magnetic sheet formed at a face-to-face position with respect to the antenna coil and configured for changing the inductance of the antenna coil. The capacitor has a temperature characteristic in which the capacitance of the capacitor is changed with changes in temperature. The magnetic sheet is formed of a magnetic material having a temperature characteristic in which the inductance of the antenna coil is made to be changed with an opposite sign of change to that of the capacitance of the capacitor that is changed with changes in temperature in the working temperature range.
    Type: Application
    Filed: January 30, 2012
    Publication date: August 9, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Katsuhisa Orihara, Satoru Sugita, Norio Saito, Masayoshi Kanno
  • Publication number: 20120193666
    Abstract: A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide, or resin-coated metal particles formed by coating the surface of scale-like or spherical metal particles with an insulating resin.
    Type: Application
    Filed: July 20, 2010
    Publication date: August 2, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
  • Patent number: 8232640
    Abstract: A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of pins are provided. A device includes at least one projection having a structure in which a surface of at least a tip part of a projecting section made of an elastic body is coated with a conductive film.
    Type: Grant
    Filed: July 17, 2007
    Date of Patent: July 31, 2012
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Katsuhiro Tomoda, Shiyuki Kanisawa, Hidetsugu Namiki
  • Patent number: 8221880
    Abstract: An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: July 17, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yasushi Akutsu, Yasunobu Yamada, Kouichi Miyauchi
  • Publication number: 20120175660
    Abstract: A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.
    Type: Application
    Filed: July 22, 2010
    Publication date: July 12, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi
  • Publication number: 20120168814
    Abstract: An adhesive composition for flip-chip-mounting a chip component on a circuit board contains an alicyclic epoxy compound, an alicyclic acid anhydride curing agent, and an acrylic resin. The amount of the alicyclic acid anhydride curing agent is 80 to 120 parts by mass based on 100 parts by mass of the alicyclic epoxy compound, and the amount of the acrylic resin is 5 to 50 parts by mass based on 100 parts by mass of the total amount of the alicyclic epoxy compound, the alicyclic acid anhydride curing agent, and the acrylic resin. The acrylic resin is a resin obtained by copolymerization of 100 parts by mass of alkyl (meth)acrylate and 2 to 100 parts by mass of glycidyl methacrylate and having a water absorption rate of 1.2% or less.
    Type: Application
    Filed: September 9, 2010
    Publication date: July 5, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Hidetsugu Namiki, Shiyuki Kanisawa, Genki Katayanagi
  • Patent number: 8211330
    Abstract: A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: July 3, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Daisuke Masuko, Katsuhiko Komuro, Masahiko Ito, Tadasu Kawashima
  • Patent number: 8206544
    Abstract: A device for ideal cutting of an adhesive film mother sheet which prevents or reduces displacement or peeling of a cover film, etc. on an adhesive layer when the adhesive film mother sheet deforms as a result of shearing forces that act during cutting. The cutting device cuts the adhesive film mother sheet into strips while performing conveyance thereof and includes a cutter mechanism and heating mechanism. The cutter mechanism may include an upper blade unit wherein a plurality of upper blades are arranged axially and a lower blade unit wherein a plurality of lower blades are arranged axially. The heating mechanism is disposed upstream of the cutter mechanism and may include a blower, a heater, a temperature sensor, and/or a temperature control unit. The blower may be connected to the heater via a an air passage and be disposed so as to blow heated air onto the adhesive film mother sheet.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: June 26, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventor: Tomohisa Kawai
  • Publication number: 20120153230
    Abstract: A latent curing agent formed by holding an imidazole compound in porous resin particles is produced by emulsifying an oil phase obtained by dissolving a polyfunctional isocyanate compound in an organic solvent in an amount of 1.5 to 5 times by mass the amount of polyfunctional isocyanate compound in an aqueous phase obtained by dissolving a water-soluble polypeptide and a surfactant in water, then subjecting the emulsion to interfacial polymerization, adding a proteolytic enzyme to carry out an enzyme degradation treatment, then recovering the porous resin particles, and making an imidazole compound solution permeate into the recovered porous resin particles.
    Type: Application
    Filed: July 13, 2011
    Publication date: June 21, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Kazunobu Kamiya
  • Publication number: 20120153008
    Abstract: A joined structure of the present invention including a first substrate having a wiring thereon, any one of a second substrate and an electronic part, and an anisotropic conductive film containing conductive particles, wherein the first substrate and any one of the second substrate and the electronic part are electrically joined via the anisotropic conductive film, and wherein the conductive particles pressure-bonded to the wiring of the first substrate protrude from both edges of the wiring in a width direction, and an interval of the wiring is 3.5 times or more larger than an average particle diameter of the conductive particles which are not pressure-bonded to the wiring.
    Type: Application
    Filed: February 29, 2012
    Publication date: June 21, 2012
    Applicant: Sony Chemical & Information Device Corporation
    Inventor: Toshiyuki SHUDO
  • Patent number: 8198342
    Abstract: An aluminum chelate latent curing agent includes an aluminum chelate curing agent, and a porous resin that holds the aluminum chelate curing agent and is obtained by subjecting a polyfunctional isocyanate compound to interfacial polymerization while simultaneously subjecting a polyfunctional radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator. In the aluminum chelate latent curing agent, a silanol compound of the formula (A) is further held in the porous resin. (Ar)mSi(OH)n??(A) In the formula, m is 2 or 3, and the sum of m and n is 4. Ar represents an optionally-substituted aryl group.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: June 12, 2012
    Assignee: Sony Chemical and Information Device Corporation
    Inventor: Kazunobu Kamiya
  • Patent number: 8193295
    Abstract: A novel amide group-containing siloxane amine compound, which is useful as a diamine component of a polybenzimidazole resin, a polybenzoxazole resin, and particularly a polyimide resin, which is derived from an amine monomer, has a chemical structure represented by the formula (1). In the formula (1), R1 and R2 each independently represent an optionally substituted alkylene group; p denotes an integer of 0 to 3; q denotes an integer of 0 to 3; m denotes an integer of 1 to 30; and n denotes an integer of 0 to 20; provided that p and q are not 0 at the same time.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: June 5, 2012
    Assignees: Sony Chemical & Information Device Corporation, Ihara Chemical Industry Co., Ltd.
    Inventors: Tomoyasu Sunaga, Junichi Ishii, Etsuchi Nishikawa