Abstract: An electronic system includes a control circuit to provide a binary control signal alternating between a first binary state during first phases and a second binary state during second phases; a screen controlled by the control signal, the screen emitting light during each first phase, and to not emit any light during each second phase; a light sensor under the screen or along the edge of the screen, and providing a measurement signal representative of a quantity of light received by the sensor during a measurement phase or a plurality of consecutive measurement phases; and a synchronization device to synchronize each measurement phase with a second phase.

Abstract: A first RF-to-DC circuit receives a radiofrequency signal and produces a first converted signal delivered to an energy storage circuit. A second RF-to-DC circuit, which is a down-scaled replica of the first RF-to-DC circuit, produces a second converted signal from the radiofrequency signal that is indicative of an open-circuit voltage of the first RF-to-DC circuit. The first RF-to-DC section includes N sub-stages, with a sub-set of sub-stages being selectively activatable. A window comparison of the second converted signal generates a first signal and a second signal indicative of whether the second converted signal is within a range of values proportional to a voltage reference signal. The sub-set of sub-stages is selectively deactivated, respectively activated, when the performed window comparison has a first result, respectively, a second result.

Abstract: A signal processing circuit includes a filter generating a quantizer input signal from a noise shaping input signal and a quantizer output signal. A quantizer divides the quantizer input signal by a scaling factor to produce a noise shaping output signal and multiplies the noise shaping output signal by the scaling factor to produce the quantizer output signal. Receiver circuitry scales the quantizer output signal by a second scaling factor. A dynamic range optimization circuit compares a current value of the noise shaping input signal to a threshold value, lowers or raises the scaling factor in response to the comparison, and proportionally lowers or raises the scaling factor such that a ratio between the scaling factor and second scaling factor remains substantially constant.

Abstract: An audio device includes a gain step selection circuit that receives a different requested gain value and an associated requested step size from each of a plurality of sources, compares each requested gain value to a same feedback gain value and generates a polarity based thereupon, performs step polarization on each requested step size as a function of the generated polarity therefor to thereby generate a plurality of step values, and outputs a least of the plurality of step values as an output step value. An accumulator circuit generates a current input gain value based upon the output step value and the feedback gain value, and then updates the feedback gain value to be equal to the current input gain value. A normalizing circuit multiplies an input data value by the current input gain value and applies a truncation function to a result thereof to produce an output data value.

Abstract: An image sensor is includes a plurality of pixels. Each of the pixels includes a silicon photoconversion region and a material that at least partially surrounds the photoconversion region. The material has a refraction index smaller than the refraction index of silicon, and the interface between the photoconversion region of the pixel and the material is configured so that at least one ray reaching the photoconversion region of the pixel undergoes a total reflection or a plurality of successive total reflections at the interface.

Abstract: A low power crystal oscillator circuit having a high power part and a low power part. Oscillation is initialized using the high power part. Once the crystal is under stable oscillation, the circuit switches to the low power part and continue operation for a long duration.

Abstract: A convolutional accelerator includes a feature line buffer, a kernel buffer, a multiply-accumulate cluster, and mode control circuitry. In a first mode of operation, the mode control circuitry stores feature data in a feature line buffer and stores kernel data in a kernel buffer. The data stored in the buffers is transferred to the MAC cluster of the convolutional accelerator for processing. In a second mode of operation the mode control circuitry stores feature data in the kernel buffer and stores kernel data in the feature line buffer. The data stored in the buffers is transferred to the MAC cluster of the convolutional accelerator for processing. The second mode of operation may be employed to efficiently process 1×N kernels, where N is an integer greater than or equal to 1.

Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.

Abstract: A method of driving an electrical load includes coupling a power supply source to a power supply pin of a driver circuit, and coupling an electrical load to at least one output pin of the driver circuit. A driver sub-circuit of the driver circuit produces at least one driving signal for driving the electrical load. The at least one driving signal is provided to the electrical load via the at least one output pin. The at least one driving signal is modulated to supply the electrical load with a load current and to subsequently interrupt the load current. A compensation current pulse is sunk from the power supply pin, at a compensation circuit of the driver circuit, in response to the load current being interrupted.

Abstract: A processing system includes a transmission terminal configured to provide a transmission signal, a reception terminal configured to receive a reception signal, a microprocessor programmable via software instructions, a memory controller configured to be connected to a memory, a serial communication interface, and a communication system. Specifically, the serial communication interface supports a CAN FD Light mode of operation and a UART mode of operation. For this purpose, the serial communication interface comprises a control register, a clock management circuit, a transmission shift register, a transmission control circuit, a reception shift register and a reception control circuit. Accordingly, the microprocessor can transmit and/or receive CAN FD Light or UART frames via the same serial communication interface.

Abstract: A PFC correction circuit includes first, second, and third phase inputs coupled to three-phase power mains, with a three-phase full-wave rectifying bridge connected to an input node. First, second, and third boost inductors are respectively connected between first, second, and third phase inputs and first, second, and third taps of the three-phase full-wave rectifying bridge. A boost switch is connected between the input node and ground, and a boost diode is connected between the input node and an output node. A multiplier input driver generates a single-phase input signal as a replica of a signal at the three-phase power mains after rectification. A single-phase power factor controller generates a PWM signal from the single-phase input signal. A gate driver generates a gate drive signal from the PWM signal. The boost switch is operated by the gate drive signal.

Abstract: A device includes: a micromechanical sensing structure configured to provide an electrical detection quantity as a function of a load; and a package enclosing the micromechanical sensing structure and providing a mechanical and electrical interface with respect to an external environment. The package includes a housing structure defining a cavity housing the micromechanical sensing structure; and a package coating that coats, at least in part, the housing structure, the package coating including a mechanical interface configured to transfer, in a uniform manner, the load on the housing structure and on the micromechanical sensing structure, wherein the housing structure includes a deformable layer interposed and in contact between the micromechanical sensing structure and the package coating, and wherein the deformable layer defines a mechanical-coupling interface.

Abstract: The present disclosure relates to a device and method for measuring a flicker frequency of a light source configured to implement at least one phase lock loop.

Abstract: An integrated circuit includes a semiconductor substrate, electronic components integrated in the semiconductor substrate, an electric connection structure overlying the semiconductor substrate, and an conductive region, with elongated shaped, having a first and a second end. The conductive region is formed in the electric connection structure, extends over an entire length of the substrate and is not directly electrically connected to the electronic components. A first and a second synchronization connection element are electrically coupled to the first end and to the second end, respectively, of the conductive region and have each a respective synchronization connection portion facing the coupling face.

Abstract: In an embodiment, an electronic circuit includes: an input differential pair including first and second transistors; a first pair of transistors in emitter-follower configuration including third and fourth transistors, and an output differential pair including fifth and sixth transistors. The third transistor has a control terminal coupled to the first transistor, and a current path coupled to a first output terminal. The fourth transistor has a control terminal coupled to the second transistor, and a current path coupled to a second output terminal. The fifth transistor has a control terminal coupled to the first transistor, and a first current path terminal coupled to the first output terminal. The sixth transistor has a control terminal coupled to the second transistor, and a first current path terminal coupled to the second output terminal. First and second termination resistors are coupled between the first pair of transistors and the output differential pair.

Abstract: In accordance with an embodiment, a power supply circuit includes: a first transistor device comprising a first gate associated with a first transconductance and a second gate associated with a transconductance greater than the first transconductance; and a second transistor device including a third gate associated with a second transconductance and a fourth gate associated with a transconductance greater than the second transconductance. The second transistor device is configured to supply power to at least one load, the first and the third gates are controlled by a closed regulation loop, and the second and the fourth gates are controlled by a sampled reference voltage.

Abstract: A successive approximation analog-to-digital converter includes a digital-to-analog converter DAC configured to receive a digital signal. First conversion units of the DAC are configured to sample an analog signal via a first switch and provide a first level voltage. Each first conversion unit includes a first capacitor array and a first switch array controlled from the digital signal. A single second conversion unit of the DAC is configured to provide a second level voltage. The second conversion unit includes a second capacitor array and a second switch array. A comparator operates to compare each of the first level voltages to the second level voltage and to provide a comparison signal based on each comparison and actuation of a set of third switches. A control circuit closes the first switches simultaneously and closes the third switches successively for the conversion of each sampled analog signal.

Abstract: A semiconductor device comprises at least one semiconductor die electrically coupled to a set of electrically conductive leads, and package molding material molded over the at least one semiconductor die and the electrically conductive leads. At least a portion of the electrically conductive leads is exposed at a rear surface of the package molding material to provide electrically conductive pads. The electrically conductive pads comprise enlarged end portions extending at least partially over the package molding material and configured for coupling to a printed circuit board.

Abstract: A switching circuit includes first and second half bridges supplying an electrical load via filter networks. During alternate switching sequences a first transistor pair (high-side in one half bridge and low-side in the other half bridge) is switched to a non-conductive state, and a second transistor pair (high-side in the other half bridge and low-side in the one half bridge) is switched to a conductive state. A current flow line is provided by an inductance, a first switch and a second switch between outputs of the half bridges. In a medium-high power mode, the first and second switches are in the conductive state between switching the first pair of transistors to the non-conductive state and the second pair of transistors to the conductive state. In a low or quiescent power mode, switching the first and second switches to the conductive state is refrained due to application of a longer delay.

Abstract: An electronic device includes an electronic chip located between a cover and an interconnection substrate. The electronic chip has contact pads located in front of a first surface of the interconnection substrate. At least one metal region (for example extending on the front surface) thermally couples at least one contact pad of the electronic chip to the cover.