Abstract: A semiconductor packaging part and a method of forming the part by applying a minute plating with a high positional accuracy to a semiconductor chip to be packaged. A pair of alignment holes 2, 3 are formed at a pitch equal to n-times (n=1, 2 . . .

Abstract: A powder metallurgy product delicate in shape is obtained with high efficiency in binder expulsion by using an injection molding composition including a sintering alumina powder and a binder, the binder including therein, in gravimetric ratio, 10 to 80% of a low-density polyethylene, 10 to 80% of a paraffin type wax and 5 to 35% of a boric ester, and the volumetric mixing ratio of the sintering powder to the binder is 30 to 70% of the former component to 70 to 30% of the latter component.

Abstract: A method of manufacturing a soft magnetic Fe-Si alloy sintered product comprising a step of injection molding a composition comprising an Fe-Si powder mixture blended so as to contain from 1 to 10% by weight of Si and the substantial balance of Fe and a binder a step of applying binder-removal under heating to the resultant green body and applying a degassing and Si-diffusing; and a step of subsequently applying sintering. The sintered product is, preferably, applied with further heating for obtaining better soft magnetic property. Soft magnetic property of the sintered products is as comparable with or superior to products by conventional powder metallurgy.

Abstract: An alloy target used for manufacturing a magneto-optical recording medium, wherein the component and composition comprises 10-50 atom % of at least one of rare earth elements selected from the group consisting of Nd, Sm, Gd, Tb, Dy, Ho, Er and Tm, from 0.

Abstract: Magnetic powder of the samarium/praseodymium/cobalt type and of the samarium/praseodymium/neodymium/cobalt type having specific compositions is substantially composed of (1-5) single phase, has improved residual magnetic flux density and a high maximum energy product, and is hence suitable for resin magnets. In addition, production cost is lower compared with conventional rare-earth metal/cobalt type magnet powder because part of samarium metal has been replaced by praseodymium and neodymium which are more abundant and less expensive materials.

Abstract: A flash smelting furnace includes a reaction shaft defining a reaction chamber therein, a plurality of reaction air blowing pipes passing through the side wall of the reaction shaft for blowing reaction air into the reaction chamber, and at least one concentrate burner attached to the top end of the reaction shaft and comprising a concentrate chute, a tubular auxiliary fuel burner extending vertically through the chute, a tubular oxygen blowing pipe concentrically surrounding the auxiliary fuel burner and a dispersion cone attached to the lower end of the oxygen blowing pipe. The air from the blowing pipes disturbs the jet stream of mixed smelting material and reaction gas in the reaction chamber, thereby achieving a uniform mixture of the material and the reaction air and extending the retention time of the material in the reaction shaft.

Abstract: A lead frame for integrated circuits has a central opening in which there is fitted a metal piece having alternate recesses and projections, the recesses fitting over inner ends of leads of the lead frame and the projections fitting in gaps between the inner lead ends. The metal piece includes slots and cut-outs to allow its comb-shaped members to bend independently of each other. After the lead frame had been fused to a ceramic substrate, the metal piece can be moved by being pulled upwardly with a relatively small force applied. The metal piece has a pair of pull tabs. For fabricating such a lead frame, the metal piece is stamped out of an integral metal plate structure having the leads and support frame integral with the leads. Then, the stamped metal piece is pushed back so as to fit with the leads of the lead frame.

Abstract: An electroconductive paste comprising(a) an electroconductive filler,(b) a reactive solvent, and(c) a hardener comprising(c-1) an epoxy resin,(c-2) a latent hardener, and(c-3) an epoxy compound-dialkylamine adduct,the percent by weight of (a), (b) and (c) being 95 to 50, 1 to 20 and 4 to 30, respectively, and the weight ratio of (c-1):(c-2):(c-3) being 100:0 to 30:0.1 to 40. The paste is useful for bonding electronic elements to metal lead frames and/or substrates.

Abstract: In a process for converting UF.sub.6 into UO.sub.2, the UF.sub.6 is brought into contact with an aqueous aluminum nitrate solution. The resultant product is solvent extracted with tributyl phosphate to remove uranyl nitrate. The raffinate has a fluorine/aluminum (F/Al) weight ratio within the range of from about 0.5 to about 1.2. A sufficient quantity of hydrofluoric acid is added to the raffinate to minimize the solubility of aluminum fluoride (AlF.sub.3) therein and thereby maximize the precipitation potential of AlF.sub.3. Generally this occurs when sufficient hydrofluoric acid has been added to cause the F/Al weight ratio to be within the range of from about 1.8 to about 2.2. As a result of this treatment, the raffinate is divided into an uranium-containing aqueous solution and an AlF.sub.3 precipitate which contains substantially no uranium.

Abstract: A divalent silver oxide cell of the type having a positive electrode formed mainly of divalent silver oxide has its stability greatly improved by adding a cadmium component and a tellurium component and, optionally, at least one auxiliary component containing an element selected from the group consisting of thallium, mercury, lead, germanium, yttrium, tin, tungsten, lanthanum, rare earth elements, zinc, aluminum and selenium, each to either the divalent silver oxide, the alkaline electrolyte, or both. The cadmium component is contained in a concentration of not less than 0.03% by weight when in the divalent silver oxide and not less than 0.01 g/liter when in the alkaline electrolyte; and tellurium component in a concentration of not less than 0.01% by weight when in the divalent silver oxide and not less than 0.01 g/liter when in the alkaline electrolyte; and the at least one auxiliary component in a total concentration of not less than 0.01% by weight when in the divalent silver oxide and not less than 0.