Abstract: A separation apparatus suitable for separating plastic and silicone in a composite material includes a storage tank configured to store a hydrocarbon solvent, and a reaction tank fluidly connected to the storage tank and having a reaction space for placement of the composite material therein and for receiving the hydrocarbon solvent from the storage tank such that the composite material is immersed in the hydrocarbon solvent for separating the plastic and the silicone in the composite material. The plastic and the silicone in the composite material are insoluble in the hydrocarbon solvent.

Abstract: A sensor device includes a plurality of wires that are adapted to be disposed on an object, a control circuit that is electrically coupled to the wires, and a conductive member that is electrically coupled to the control circuit. Each of the wires has a detection section. The conductive member is operable to contact the detection sections of the wires. The detection sections are urged to move relative to the conductive member when the object is deformed, so that a quantity of the detection sections in contact with the conductive member varies with deformation of the object. When the conductive member is in contact with the detection section of any one of the wires, the conductive member and the one of the wires cooperatively form one closed circuit. The control circuit is adapted to transmit data of a quantity of the closed circuit to an external device.

Abstract: A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

Abstract: A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.

Abstract: An electronic device includes a base seat, a rotary seat rotatably coupled to the base seat, a drive mechanism for driving the rotary seat to rotate relative to the base seat, a power consumption unit disposed on and co-rotatable with the rotary seat, and a power supply unit. The power supply unit includes a solar panel disposed in the rotary seat and electrically connected to the power consumption unit, and a light emitting module operable to emit light toward the solar panel so that the solar panel transforms light energy into electric energy, which is supplied to the power consumption unit.

Abstract: A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

Abstract: A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.

Abstract: A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

Abstract: A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together.

Abstract: A composition for preparing polyamide powders, includes polyamide granules, a nucleating agent and an organic solvent having a boiling point ranging from 190° C. to 209° C. The weight ratio of the polyamide granules to the organic solvent ranges from 0.11 to saturation solubility of the polyamide granules is the organic solvent, and the weight ratio of the polyamide granules to the nucleating agent is 100:1.

Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.?Tm?T2?33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.

Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.

Abstract: An injection molding method includes the steps of positioning a core piece in a mold cavity through a plurality of positioning pins; injecting a molten plastic material into the mold cavity to surround and cover the core piece; maintaining the pressure inside the mold cavity at a predetermined maintaining time so that the core piece is positioned by the molten plastic material; retracting the positioning pins from the mold cavity when a predetermined retraction time is reached, so that spaces occupied by the positioning pins in the mold cavity can be filled with the molten plastic material; and completely curing the molten plastic material to form a finished product.

Abstract: A method of manufacturing a microfluidic chip includes: providing an upper mold having multiple upper ribs extending along a second direction, and a lower mold having multiple lower ribs extending along a first direction different from the second direction; forming a forming material in a filling space defined by the upper and lower molds to provide a channeled plate having multiple upper microfluidic channels complementary in shape to the upper ribs, lower microfluidic channels complementary in shape to the lower ribs, and multiple thin film valves formed at intersections where the upper microfluidic channels intersect the lower microfluidic channels; separating the upper and lower molds; and covering the lower and upper microfluidic channels.

Abstract: A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.

Abstract: A method of manufacturing a microfluidic chip includes providing an upper mold having multiple upper ribs extending along a second direction, and a lower mold having multiple lower ribs extending along a first direction different from the second direction, forming a forming material in a filling space defined by the upper and lower molds to provide a channeled plate having multiple upper microfluidic channels complementary in shape to the upper ribs, lower microfluidic channels complementary in shape to the lower ribs, and multiple thin film valves formed at intersections where the upper microfluidic channels intersect the lower microfluidic channels, separating the upper and lower molds, and covering the lower and upper microfluidic channels.

Abstract: An electrochemical biosensor includes a substrate, a plurality of layered active metal parts, a plurality of layered electrodes, a reaction confinement layer, an electrochemical reactive layer and a cover piece. The substrate is formed with through holes each of which is defined by an interior wall surface and penetrates top and bottom surfaces. Each of the layered active metal parts is formed at least upon a respective one of the interior wall surfaces. The layered electrodes are formed on the layered active metal parts. The reaction confinement layer confines a reactor space over a region where the through holes are formed. The electrochemical reactive layer is disposed in the reactor space and is electrically coupled to the layered electrodes.

Abstract: A method for making a conformal array antenna includes: providing a substrate having a non-conductive curved surface; roughening the curved surface; forming an activation layer containing an active metal on the roughened curved surface; forming a first metal layer on the activation layer by chemical plating process; and defining a plurality of spaced-apart antenna pattern regions on the first metal layer, by forming a gap along an outer periphery of each of the antenna pattern regions to isolate the antenna pattern regions from a remainder of the first metal layer. The curved surface is roughened by blasting a plurality of particles thereonto, or the spaced-apart antenna pattern regions are substantially evenly distributed.

Abstract: A method of preparing polyamide (PA) powders includes the steps of: heating a composition including PA granules, a nucleating agent and an organic solvent under normal pressure to T1 not lower than melting point (Tm) of PA granules and maintaining at T1 to dissolve PA granules; cooling the heated composition to T2 to nucleate the dissolved PA granules and maintaining at T2 to crystallize, where 15° C.?Tm?T2?33° C.; cooling the crystallization product to precipitate PA; and washing the precipitated product to remove the organic solvent. The weight ratio of PA granules to the nucleating agent is 100:1, and the weight ratio of PA granules to the organic solvent ranges from 0.11 to saturation solubility of PA granules in the organic solvent.