Abstract: An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 ?m of the film thickness at a wavelength of 350 to 375 nm.

Abstract: There are provided a photosensitive composition used in one-shot exposure of exposing it via a photomask to light from a UV lamp or in direct writing with light from a UV lamp or laser light to form a patterned latent image to be developed with an alkaline aqueous solution, wherein a difference between maximum absorbance and minimum absorbance, in a wavelength range of 355 to 405 nm, of a dry coating thereof before light exposure is within 0.3 per 25 ?m film thickness of the dry coating, and a dry film obtained by applying the photosensitive composition onto a carrier film and then drying it.

Abstract: A photocuring composition includes black particles (A), black particles (B), an organic binder (C), a photopolymerizable monomer (D), and a photopolymerization initiator (E). The black particles (B) have a volume resistivity lower than the volume resistivity of the black particles (A) and an average diameter larger than the average diameter of the black particles (A).

Abstract: An adhesive pattern is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.

Abstract: A thermosetting resin composition comprising (A) a thermoplastic resin having a structure represented by the following general formula (a) and/or a structure represented by the following general formula (b) in which 5 to 99 mol % of hydroxyl groups of polyhydroxyether are esterified, and (B) a thermosetting resin: wherein R1 represents C1-18 aliphatic or aromatic-ring-containing alkylene group or —SO2—, 5 to 99 mol % of R2 represent a straight chain or cyclic carbonyl group or aromatic carbonyl group having 1 to 20 carbon atoms, the residue 95 to 1 mol % represent a hydrogen atom, and R3 represents a hydrogen atom or a methyl group, with a proviso that a plurality of R3's may be the same or different.

Abstract: In a process for forming a solder mask, a photoimageable ink is coated on a carrier film to form a photoimageable ink layer on the carrier film. The photoimageable ink layer is dried to form a photoimageable resist layer, thereby forming at least one photoimageable resist layer bearing film. The photoimageable resist layer bearing film is laminated on at least one side of a substrate so as to bring the upper surface of the photoimageable resist layer into contact with the substrate. The photoimageable resist layer is exposed to light imagewise through the carrier film. The carrier film is removed from the photoimageable resist layer to form an exposed resist layer. The exposed resist layer is developed to form a developed resist layer. The developed resist layer is cured to form a solder mask on the substrate.

Abstract: A thermally curable resin composition includes a linear thermally curable resin and amorphous silica fine particles having pore portions.

Abstract: An alkali-developable black photosensitive resin composition for forming a light-shielding barrier wall which comprises, as indispensable components, (A) a carboxyl group-containing photosensitive prepolymer, (B) a photopolymerization initiator, (C) a black pigment, and (D) light-transmitting fine particles. By the use of this composition, light-shielding barrier walls (11) having sufficient light-shielding properties and a height of not less than 20 ?m can be formed by photolithography, without causing undercutting during development. In a preferred embodiment, the black pigment (C) is a metal oxide, preferably iron oxide, and the fine particles (D) are inorganic fine particles having a refractive index of 1.40-1.90, preferably silica.

Abstract: An actinic energy ray-curable resin is obtained by reacting an unsaturated monocarboxylic acid (c) with a terminal epoxy group of an epoxy resin having an unsaturated group and a hydroxyl group in its side chains and an epoxy group in its terminal and further reacting a polybasic acid anhydride (d) with the hydroxyl group of the above-mentioned epoxy resin, wherein the above-mentioned epoxy resin is a product of the polyaddition reaction of a reaction product (I) of a polybasic acid anhydride (a) and a compound (b) having at least one unsaturated double bond and one alcoholic hydroxyl group in its molecule, a compound (II) having at least two carboxyl groups in its molecule, and a bifunctional epoxy compound (III), wherein at least either one of the carboxyl group-containing compound (II) and the bifunctional epoxy compound (III) is a compound containing no aromatic ring.

Abstract: An object of the present invention is to provide a black paste composition suitable for use in laser direct imaging devices employing a light source emitting a laser having a maximum wavelength of 350 to 420 nm, useful in forming a high-definition black matrix pattern efficiently, and superior in storage stability, a black matrix pattern formed by using the composition, a plasma display having the pattern, and a method of forming the black matrix pattern by using the composition. An alkali development-type black paste composition of the present invention comprises (A) a carboxyl group-containing resin, (B) a glass frit, (C) a black pigment, (D) a compound having at least one radically polymerizable unsaturated group in its molecule, and (E-1) an oxime-based photopolymerization initiator represented by the following general formula (I).

Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.

Abstract: A thermosetting resin composition contains, as essential components, (A) an epoxy resin having at least two epoxy groups in its molecule, (B) a thermoplastic polyhydroxy polyether resin having a fluorene skeleton, (C) an epoxy curing agent, and (D) a filler. A dry film is obtained by forming a thin film of the thermosetting resin composition on a supporting base film, and a prepreg is obtained by coating and/or impregnating a sheet-like fibrous base material with the thermosetting resin composition. Since they exhibit excellent adhesiveness to a substrate or a conductor and a cured film of the thermosetting resin composition has a relatively low thermal expansion coefficient and a high glass transition point and exhibits high resistance to heat and the capability of being roughened by a roughening treatment, they are useful as a resin insulating layer of a multilayer printed circuit board.

Abstract: A composition for forming a cured film pattern comprises a combination of: an alkaline developable photocurable and thermosetting composition containing no thermal curing catalyst; and a developing solution comprising an aqueous solution of a basic curing catalyst of a nitrogen-containing heterocyclic compound for promoting a thermosetting reaction so that it has a long pot-life (useful life) after mixing of a main agent and a hardener or has excellent storage stability as a one-package composition. Preferably, the basic curing catalyst is a heterocyclic compound having an amidine structure. A film of the photocurable and thermosetting composition is selectively exposed to an actinic energy ray and then developed with the developing solution to remove an unexposed area of the film. At this time, the basic curing catalyst penetrates into the photocured film to effect doping. As a result, the film becomes excellent in thermosetting properties besides the patterning properties by development.

Abstract: A photocurable and thermosetting resin composition comprising (A) a carboxylic acid-containing photosensitive resin having at least one carboxyl group and at least two ethylenically unsaturated bonds in its molecule, (B) a filler, (C) a photopolymerization initiator, (D) a diluent, and (E) a compound having at least two cyclic ether groups and/or cyclic thioether groups in its molecule, wherein the difference between the refractive index of the carboxylic acid-containing photosensitive resin (A) and that of the filler (B) is 0.20 or less, and the average grain diameter of the filler (B) is 0.5 to 0.05 ?m, and wherein the photo-curing and thermosetting resin composition can be developed by a diluted alkali solution, and can be pattern-formed by a laser oscillation light source of 350 to 420 nm in wavelength.

Abstract: A white heat-hardening resin composition includes rutile-type titanium oxide and a heat-hardening resin.

Abstract: A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method.

Abstract: An alkali-developable black photosensitive resin composition for forming a light-shielding barrier wall which comprises, as indispensable components, (A) a carboxyl group-containing photosensitive prepolymer, (B) a photopolymerization initiator, (C) a black pigment, and (D) light-transmitting fine particles. By the use of this composition, light-shielding barrier walls (11) having sufficient light-shielding properties and a height of not less than 20 ?m can be formed by photolithography, without causing undercutting during development. In a preferred embodiment, the black pigment (C) is a metal oxide, preferably iron oxide, and the fine particles (D) are inorganic fine particles having a refractive index of 1.40-1.90, preferably silica.

Abstract: An object of the present invention is to provide a silver paste composition suitable for use in laser direct imaging devices employing a light source emitting a laser having a maximum wavelength of 350 to 420 nm, useful in forming a high-definition conductive pattern efficiently, and superior in storage stability, a conductive pattern formed by using the composition, a plasma display having the pattern, and a method of forming the conductive pattern by using the composition. An alkali development-type silver paste composition of the present invention comprises (A) a carboxyl group-containing resin, (B) a glass frit, (C) a silver powder, (D) a compound having at least one radically polymerizable unsaturated group in its molecule, and (E-1) an oxime-based photopolymerization initiator represented by the following general formula (I).

Abstract: In a flexible laminate containing a metal foil layer/a thermoplastic polyimide layer or/and a conductor circuit layer/a thermoplastic polyimide layer, the metal foil layer or the conductor circuit layer is bonded to at least one side of the thermoplastic polyimide layer. The thermoplastic polyimide layer is formed from a thermoplastic polyimide resin film or sheet produced by melt extrusion of a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is formed from a biaxially oriented thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily manufactured by a lamination method which comprises bonding a thermoplastic polyimide resin film (1) to a metal foil (2) or a conductive circuit layer (4) by heating under pressure, and has excellent heat resistance, electrical properties and mechanical strength inherent in a polyimide.

Abstract: Disclosed is a liquid ejecting recording head with improved operational reliability. A first coating resin layer of a liquid ejecting recording head, having a liquid flow duct and a liquid ejecting orifice, is formed of an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.