Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a plurality of internal electrodes laminated in one axial direction, and an end surface extending along a plane parallel to the axial direction, at least part of the plurality of internal electrode being drawn from the end surface. The external electrode covers the end surface of the ceramic body. In a thermal desorption spectrum of water of the multi-layer ceramic electronic component by thermal desorption spectroscopy, a ratio P1/P2 of a detection intensity P1 of a first peak in a range of 200° C. to 300° C. to a detection intensity P2 of a second peak in a range of 550° C. to 800° C. is equal to or lower than 11.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of a plurality of internal electrode layers having pores are alternately stacked. A continuity modulus of at least one of the plurality of internal electrode layers is 80% or less. An average pore diameter of the pores of the at least one of the plurality of internal electrode layers is equal to or less than each thickness of the plurality of dielectric layers.

Abstract: A selection method includes: obtaining or providing multilayer ceramic capacitors each having a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked; measuring a ratio of (a current value at 10 V/?m when a direct voltage is applied to a plurality of ceramic dielectric layers at 125 degrees C.)/(a current value at 10 V/?m when a direct voltage is applied to the plurality of the ceramic dielectric layers at 85 degrees C.), with respect to each multilayer ceramic capacitor; determining whether the ratio is in a predetermined range; and selecting a multilayer ceramic capacitor or multilayer ceramic capacitors each having a ratio in the predetermined range as a desired multilayer ceramic capacitor.

Abstract: A filter includes first and second signal terminals, a filter circuit connected between the first and second signal terminals, a substrate having first and second surfaces, the first and second signal terminals being located on the first surface, a part of the filter circuit being located at a side of the second surface, a line located closer to the first surface than the filter circuit in the substrate, a first end of the line being connected to one of the first and second signal terminals, and a ground terminal that is located on the first surface and to which a second end of the line is connected, an area of a region where the line overlaps with the ground terminal being greater than an area of a region where the line overlaps with the one of the first and second signal terminals when the substrate is viewed in plan view.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which dielectric layers and internal electrode layers are alternately stacked; wherein a main component of the dielectric layers is a ceramic material having a main phase having a perovskite structure (ABO3) wherein a B site includes an element solid-solved in the B site and acting as a donor; wherein an A site and the B site of the ceramic material includes a rare earth element, wherein (an amount of the rare earth element substitutionally solid-solved in the A site)/(an amount of the rare earth element substitutionally solid-solved in the B site) is 0.75 or more and 1.25 or less. The amount of the element acting as the donor in the B site is 0.05 to 0.3 atm % relative to a main component element of the B site.

Abstract: An acoustic wave device including a support substrate, a piezoelectric layer provided over the support substrate, at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers, a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having first protruding portions and/or first recessed portions, a second surface of the insulating layer having second protruding portions and/or second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film.

Abstract: A ceramic electronic component includes an element body and at least one external electrode. The element body includes a dielectric and at least one internal electrode therein. The element body has a plurality of surfaces that includes a first surface and a second surface opposite the first surface. Two end regions are defined on the second surface at opposite ends of the second surface, and an intermediate region is defined on the second surface between the two end regions. The intermediate region has a surface roughness smaller than each of the two end regions. The respective external electrode is formed on the element body at a position away from the second surface. The respective external electrode includes a base layer formed on the element body and a plating layer formed on the base layer. The base layer is connected to the respective internal electrode and contains at least one metal.

Abstract: A coil component includes: an element body part 10; a coil 30 embedded in the element body part 10; an external electrode 50a electrically connected to the coil 30 and provided at least on a bottom face 12 of the element body part 10 along a side 13a of the bottom face 12; and an external electrode 50b electrically connected to the coil 30 and provided at least on the bottom face 12 along a side 13b, wherein the external electrode 50a has a joining part 56a physically and electrically joined to the bottom face 12, and a non-joining part faces the bottom face 12 but is positioned away from the bottom face 12 before being mounted on a circuit board, wherein the non-joining part is positioned closer to the external electrode 50b on the bottom face 12 than is the joining part 56a.

Abstract: A ceramic electronic device includes a multilayer chip in which dielectric layers including ceramic as a main component and internal electrode layers including a first metal as a main component are alternately stacked, and the internal electrode layers is exposed alternately to portions of the multilayer chip, and external electrodes, each of which is provided on each of the portions of the multilayer chip. A dielectric pattern is provided in end margins where internal electrode layers connected to one of the external electrodes face each other with no internal electrode layer connected to the other of the external electrodes interposed therebetween. The internal electrode layers include one or more type of a second metal which is different from the first metal. A concentration of the second metal in the plurality of dielectric layers is higher than a concentration of the second metal of the dielectric pattern.

Abstract: A coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate quadrangle, wherein the line length of the curved line parts along the inner periphery of the opening part is 20% or more but no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.

Abstract: A manufacturing method of a coil component includes: providing an assembly including a wound-wire part formed by winding, around a core, a conductive wire coated with a coating; and a lead part pulled out outwardly from the wound-wire; removing a portion of the coating from the conductive wire at a location outwardly extending away from the wound-wire part, wherein an entire coating over an entire circumference of the conductive wire at the portion of the coating is removed; providing a terminal electrode with a connecting part; forming a joining part at an end of the coating-removed lead conductive wire to electrically connect the terminal electrode to the lead part via the joining part by irradiating a laser from the connecting part toward the coating-removed lead conductive wire while restricting an irradiation range of the laser within a range where the coated lead conductive wire is not included.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of three or more of internal electrode layers are alternately stacked. The three or more of internal electrode layers include Ni and Sn. An internal electrode layer having a larger Sn concentration is closer to an outermost edge in a stacking direction than an internal electrode layer having a smaller Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of internal electrode layers.

Abstract: A manufacturing method of a multilayer ceramic electronic device includes: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is formed from the each of internal electrode patterns and each dielectric layer is formed from the each of the dielectric green sheets wherein, in the each internal electrode layer, an Au concentration near each interface between the each internal electrode layer and the each dielectric layer is larger than an Au concentration in each center portion in a thickness direction.

Abstract: A dielectric body includes a plurality of crystal grains of which a main component is barium titanate, and an additive including Zr, Eu and Mn. At least one of the plurality of crystal grains has a core-shell structure having a core and a shell. A Zr/Ti atomic concentration ratio is 0.02 or more and 0.10 or less. An Eu/Ti atomic concentration ratio is 0.001 or more and 0.03 or less. A Mn/Ti atomic concentration ratio is 0.005 or more and 0.05 or less. A total atomic concentration of the one or more rare elements is smaller than an atomic concentration of Eu when the dielectric body has the one or more rare earth elements. A median diameter of the plurality of crystal grains is 200 nm or more and 400 nm or less.

Abstract: A magnetic base body in one embodiment of the invention includes first metal magnetic particles having a first average particle size, and second metal magnetic particles having a second average particle size smaller than the first average particle size. In the embodiment, a first insulating layer having a first thickness is provided on surfaces of the first metal magnetic particles, and a second insulating layer having a second thickness smaller than the first thickness is provided on surfaces of the second metal magnetic particles.

Abstract: An electronic component includes a first substrate having a substantially quadrangular planar shape and having a first surface and a second surface, the first surface and the second surface being opposite to each other, an element disposed on the first surface, four first terminals located adjacent to four corners on the second surface, respectively, and a second terminal located between the first terminals at respective ends of each of two sides opposite to each other of the second surface, an area of the second terminal being smaller than an area of each of the first terminals at the respective ends of each of the two sides, a width of the second terminal in an extension direction of each of the two sides being equal to or less than a width of each of the first terminals at the respective ends of each of the two sides in the extension direction.

Abstract: A composite magnetic body according to one aspect of the present invention includes a first metal magnetic particle covered with a first resin portion made of a first resin material and a second metal magnetic particle having a smaller particle size than the first metal magnetic particle, where the second metal magnetic particle is bound to the first metal magnetic particle via a second resin portion made of a second resin material, the second resin material having a softening point higher than the first resin material.

Abstract: A piezoelectric ceramic containing no lead as a constituent element is provided. Coefficient of variation C.V. of grain size of grains contained in the piezoelectric ceramic is 35% or less, and an image quality (IQ) image obtained by analyzing a cross section of the piezoelectric ceramic by an electron backscatter diffraction (EBSD) method shows that at least one of the grains has a grain size of 3 ?m to 5 ?m and an area ratio of a domain in said at least one of the grains is 85% or more.

Abstract: A method for manufacturing a coil component having a coil part with a flat-shaped connection end parts, includes step of physically and electrically connecting ends of the coil part and terminal electrodes, respectively, by thermocompression bonding wherein the ends of the coil part are heated and compressed, thereby deforming the ends of the coil part into the flat-shaped connection end parts and bonding the flat-shaped connection end parts to the terminal electrodes, respectively.

Abstract: A coil component includes: a substrate body; a winding part formed by a conductive wire wound around a part of the substrate body; and terminal electrodes, each having a foundation part constituted by a metal plate provided to the substrate body, and a welded part formed on the foundation part wherein a part of the metal plate is welded to the conductive wire at a lead part led out from the winding part; wherein, based on a vertical line which passes through the peak point of the welded part where its height becomes the highest and which also intersects at right angles the foundation part, the distance from the vertical line to the surface of the welded part as viewed in a direction parallel with the foundation part is longer at a point closer to the foundation part when viewed at least in one direction from the vertical line.