Abstract: An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0.

Abstract: The present invention provides a conductive coating material curable at low temperatures. The present invention relates to a conductive coating material containing: 100 parts by weight of an epoxy resin-containing binder component (A); 500 to 2500 parts by weight of metal particles (B); 1 to 150 parts by weight of a curing agent (C); 20 to 800 parts by weight of a solvent (D); and 0.5 to 5 parts by weight of a curing catalyst (E).

Abstract: The present invention provides an electric wire joining structure (80), an electric wire joining method, and a terminal (1), each of which allows a reduction in burden on an operator. The present invention includes: one or more electric wires (10); a terminal (1) including one or more insertion holes (7) for the respective one or more electric wires (10), the one or more electric wires (10) being inserted into the respective insertion holes (7); and a joining part (20) formed by thermal spraying, the joining part (20) joining the one or more electric wires (10) to the terminal (1) on a side on which the one or more electric wires (10) have passed through the respective one or more insertion holes (7).

Abstract: An adhesive film for a printed wiring board includes an adhesive layer 111 and an insulating protective layer 112. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.

Abstract: Provided is a conductive paint that can be cured at a temperature of 110° C. or less and has both excellent conductivity and adhesiveness. The conductive paint includes, per 100 parts by mass of a binder component (A) containing an epoxy resin, 1,000 to 4,000 parts by mass of metal particles (B), 50 to 150 parts by mass of a blocked isocyanate curing agent (C), and 200 to 1,500 parts by mass of a solvent (D).

Abstract: Provided is an electromagnetic wave shielding film capable of reducing a space formed between the electromagnetic wave shielding film and an electronic component on a wiring substrate and to increase an electromagnetic wave shielding effect. An electromagnetic wave shielding film 1 includes a conductive layer 3 having stretchability and a property of hardly returning to an original state thereof when once stretched, and an adhesion layer 4 formed on one surface of the conductive layer 3 and having insulating properties. The conductive layer 3 is made of a conductive composition, including a resin having stretchability and a property of hardly returning to an original state thereof when once stretched and a conductive filler filled with the resin. The resin has a tensile permanent set of 2.5% or more and 90% or less.

Abstract: The present invention provides a connector that can be easily and properly connected to a sheet-like electrically conductive member that is provided with a plurality of electrically conductive portions arranged at different height positions in the thickness direction. A connector 1 includes a plurality of contacts 2, a body housing 5 that holds the contacts 2, and a cover housing 7 that is attached to the body housing 5. The body housing 5 has a plurality of holding portions 51 that hold the contacts 2. The holding portions 51 are provided in the body housing 5 so as to hold the contacts 2 at different height positions in the thickness direction of the body housing 5. A plurality of electrically conductive portions 101 come into contact with the contacts 2 in a state where an electrically conductive member 100 is sandwiched between the cover housing 7 and the body housing 5.

Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.

Abstract: Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 ?m.

Abstract: Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 ?m, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.

Abstract: The present invention provides an electromagnetic wave shielding film that can be made thinner and that has a higher folding endurance. The electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: a conductive adhesive layer containing conductive particles and an adhesive resin composition, wherein in a cut surface of the conductive adhesive layer after heating and pressurizing the electromagnetic wave shielding film at 150° C. and 2 MPa for 30 minutes, the conductive particles have an average aspect ratio of 18 or more, and an area percentage of the adhesive resin composition is 60 to 95% relative to a total area of the cut surface.

Abstract: There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

Abstract: A liquid detection sensor includes a first electrode, an insulating layer and a second electrode. The insulating layer is located on the first electrode. The second electrode is located on the insulating layer. A surface of the second electrode is provided with a first hole passing through each of the second electrode and the insulating layer. The first electrode and the second electrode are configured to be rendered conductive through liquid collected in the first hole. Accordingly, the liquid detection sensor and a liquid detector are provided that can reduce malfunctions.

Abstract: The present invention provides a shield package having a highly distinctive pattern formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a resin layer, and a shield layer covering the package, wherein a surface of the resin layer includes a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw a pattern with lines and/or dots.

Abstract: A bioelectrode (1) includes: a main electrode film (3); a nonpolarizable electrode film (4) disposed on one surface of the main electrode film (3); and a conductive gel film (5) disposed on the opposite surface of the nonpolarizable electrode film (4) from the main electrode film. The nonpolarizable electrode film (4) is constituted by an electrode film that contains supported silver chloride, the supported silver chloride including (i) a support and (ii) silver chloride supported on the support.

Abstract: An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.

Abstract: Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.

Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

Abstract: Provided is a conductive paint that can be cured at a temperature of 110° C. or less and has both excellent conductivity and adhesiveness. The conductive paint includes, per 100 parts by mass of a binder component (A) containing an epoxy resin, 1,000 to 4,000 parts by mass of metal particles (B), 50 to 150 parts by mass of a blocked isocyanate curing agent (C), and 200 to 1,500 parts by mass of a solvent (D).