Patents Assigned to Tatsuta Electric Wire & Cable Co., Ltd.
  • Patent number: 11191198
    Abstract: A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 ?m to 50 ?m, and a radical polymerization initiator.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: November 30, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Hajime Nakazono, Hidetoshi Noguchi
  • Patent number: 11185630
    Abstract: To provide a liquid leakage detection device in which restriction of of a patient is alleviated as compared with the related art while receiving an injection. A liquid leakage detection device 2 detects that an injection solution to be injected into a blood vessel 4 leaks to the outside of the blood vessel 4. The liquid leakage detection device 2 includes a plurality of thermocouples 18 attached to a body surface around a puncture site 16 of an injection needle 12 for injecting the injection solution, an acquisition device 34 which acquires a value indicating a body surface temperature at an attachment point of each of the thermocouples 18 based on an output of each of the thermocouples 18, and a determination device 14 which determines that the injection solution leaks to the outside of the blood vessel when the acquired value deviates from a normal temperature of the body surface temperature at the attachment point.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: November 30, 2021
    Assignee: Tatsuta Electric Wire & Cable Co., Ltd.
    Inventors: Junichi Inoue, Hiroaki Umeda
  • Publication number: 20210289615
    Abstract: An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0.
    Type: Application
    Filed: July 5, 2019
    Publication date: September 16, 2021
    Applicant: Tatsuta Electric Wire & Cable Co., Ltd.
    Inventors: Sougo ISHIOKA, Masahiro WATANABE
  • Patent number: 11098227
    Abstract: The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: August 24, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Osamu Isobe, Kenji Kamino
  • Patent number: 11060192
    Abstract: The present invention provides a metal-ceramic base material and the like which allow a ceramic base material and a desired metal material to be easily joined. A metal-ceramic base material (30) to be joined to a metal material (40), includes: a ceramic base material (20); and a metal film (25) provided on the ceramic base material (20), the metal film (25) being formed by thermal spray of a mixed powder material containing aluminum, alumina, and nickel, at least part of the nickel being exposed on a surface of the metal film (25).
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: July 13, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventor: Masaki Hirano
  • Patent number: 11054240
    Abstract: A light interference unit includes a branching optical element, a multiplexing optical element, and at least one fiber device. The branching optical element branches a laser light with an emission wavelength temporally swept, into a measurement light and a reference light. The multiplexing optical element multiplexes the reference light and the measurement light reflected by a measured object, and causes them to interfere. The fiber device includes a reference light device. A transmission light path length is a light path length of the reference light transmitting the reference light device, from the reference light device to the multiplexing optical element. A reflection light path length is a light path length of the reference light reflected by a separation portion of the reference light device, from the reference light device to the multiplexing optical element. The transmission light path length is equal to or more than the reflection light path length.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: July 6, 2021
    Assignees: TATSUTA ELECTRIC WIRE & CABLE CO., LTD., NIDEK CO., LTD.
    Inventors: Masato Takaya, Shinya Iwata
  • Publication number: 20210203088
    Abstract: The present invention provides an electric wire joining structure (80), an electric wire joining method, and a terminal (1), each of which allows a reduction in burden on an operator. The present invention includes: one or more electric wires (10); a terminal (1) including one or more insertion holes (7) for the respective one or more electric wires (10), the one or more electric wires (10) being inserted into the respective insertion holes (7); and a joining part (20) formed by thermal spraying, the joining part (20) joining the one or more electric wires (10) to the terminal (1) on a side on which the one or more electric wires (10) have passed through the respective one or more insertion holes (7).
    Type: Application
    Filed: May 11, 2018
    Publication date: July 1, 2021
    Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventor: Masaki HIRANO
  • Patent number: 10926514
    Abstract: Provided are (i) a solder connection structure having improved solder wettability and including an aluminum base material and (ii) a film forming method for forming, on the aluminum base material, a metal film having high solder wettability. A solder connection structure (50) includes (i) an aluminum substrate (30), (ii) an Ni film (35) formed on the aluminum substrate by a cold spray method, and (iii) a mixed metal film (40) provided on the Ni film, the mixed metal film (40) being formed by the cold spray method with use of a mixed powder material, the mixed powder material being a mixture of Ni powder (41) and Sn powder (42).
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: February 23, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventor: Masaki Hirano
  • Patent number: 10893603
    Abstract: A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: January 12, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
  • Patent number: 10876985
    Abstract: Provided is a sheet sensor comprising an anisotropically-conductive sheet exhibiting conductivity in a thickness direction and having a first surface as a contact surface for a sensing target object, and multiple conductive members electrically connected to a second surface of the anisotropically-conductive sheet and electrically insulated from each other.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: December 29, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Shinji Yoshino, Keisho Shinohara
  • Patent number: 10873081
    Abstract: An electrode material (1) includes: a porous support (2); and silver chloride (4) supported on the porous support (2). The porous support (2) is, for example, silica. The silica may be: wet-process silica such as precipitated silica or gelation method silica; dry-process silica; or the like.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: December 22, 2020
    Assignees: TATSUTA ELECTRIC WIRE & CABLE CO., LTD., FUJI SILYSIA CHEMICAL LTD.
    Inventors: Keisho Shinohara, Takashi Morita, Shinji Yoshino, Mitsuteru Ogawa, Mitsuhiro Kamimura
  • Patent number: 10864701
    Abstract: A stretchable conductive film for textiles 1 includes a stretchable conductive layer 3, and a hot-melt adhesive agent layer 4 formed on one surface of the stretchable conductive layer 3. The stretchable conductive film for textiles 1 may also include a first peel film 2 formed on a surface of the stretchable conductive layer 3 on the opposite side from the hot-melt adhesive agent layer 4 side, and a second peel film 5 formed on a surface of the hot-melt adhesive agent layer 4 on the opposite side from the stretchable conductive layer 3 side.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: December 15, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Akio Takahashi, Tsunehiko Terada
  • Patent number: 10855017
    Abstract: Provided is a connector terminal, including: a tubular section having a lance formed by cutting a part of a peripheral wall thereof and raising the same about its base part. At least a portion of the peripheral wall in which the lance is cut and raised is curved to bulge outward as seen from an opening direction of the tubular section. The lance has a pair of end edges opposed to each other in a width direction orthogonal to a direction in which the lance extends, and at least one of the pair of end edges at least on the side of the base part of the lance is formed to come close to an opposed one of the at least one of the end edges as it advances toward a leading end of the lance. Also provided are a connector including the connector terminal, and a size adjustment device.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: December 1, 2020
    Assignees: Tatsuta Electric Wire & Cable Co., Ltd., Iwanuma Seiko Corporation
    Inventors: Syoji Nakazono, Kiyotaka Urashita, Koji Chiba, Kokichi Hori
  • Patent number: 10835140
    Abstract: Provided is a biological electrode tool including an electrode portion (10) attached to a human body to acquire a biological signal, and a lead portion (20) for externally leading out the biological signal from the electrode portion (10). The entire areas of the upper and lower surfaces of the electrode portion (10) are covered with a nonwoven fabric (30) except for a portion that contacts the living body (13). The entire areas of the upper and lower surfaces of the lead portion (20) are also covered with nonwoven fabric except for an external lead-out end portion (14). The full circumferential peripheries of the nonwoven fabrics (30) on the upper and lower surfaces of the electrode portion (10) and the lead portion (20) are bonded except for the portion that contacts the living body (13) and the external lead-out end portion (14). Neither the electrode (11) of the electrode portion (10) nor a thin-film lead wire (21) of the lead portion (20) are exposed.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: November 17, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Takashi Morita, Keisho Shinohara
  • Publication number: 20200299524
    Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).
    Type: Application
    Filed: March 27, 2017
    Publication date: September 24, 2020
    Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
  • Publication number: 20200299523
    Abstract: A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).
    Type: Application
    Filed: March 27, 2017
    Publication date: September 24, 2020
    Applicant: Tatsuta Electric Wire & Cable Co., Ltd.
    Inventors: Hiroaki UMEDA, Kazuhiro MATSUDA, Ken YUKAWA
  • Publication number: 20200288608
    Abstract: A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 ?m to 50 ?m, and a radical polymerization initiator.
    Type: Application
    Filed: September 27, 2018
    Publication date: September 10, 2020
    Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Hajime Nakazono, Hidetoshi Noguchi
  • Patent number: 10757849
    Abstract: An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 25, 2020
    Assignee: Tatsuta Electric Wire & Cable Co., Ltd.
    Inventor: Masahiro Watanabe
  • Patent number: 10723920
    Abstract: A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: July 28, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshihiko Aoyagi, Osamu Isobe, Kenji Kamino
  • Patent number: D920923
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 1, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventor: Masaki Hirano