Abstract: A method for programming a two-wire sensor having at least two sensor units. The method comprises the following steps of: switching on the at least two sensor units, activating one of the at least two sensor units, capturing operating states of the at least two sensor units; detecting an operating state in which one individual sensor unit is active; and sending a programming command to the detected active sensor unit.

Abstract: A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.

Abstract: A distance measuring device with two magnetic field sensors and a permanent magnet and a semiconductor body is provided. The device includes a monolithically integrated evaluation circuit, and a difference signal can be determined by means of the magnetic field sensors and provides an output signal as a result of the determination. The value of the output signal based on the neutralization of a magnetic-flux-free region is a function of a distance of a ferromagnetic sensing element from the two magnetic field sensors. The semiconductor body is arranged between U-shaped pole shanks of the magnet, which is magnetized in the X direction, wherein the first magnetic field sensor is arranged in an area located between two opposing shanks of the first pole, and the second magnetic field sensor is arranged in an area located between two opposing shanks of the second pole.

Abstract: A packaged IC component having a semiconductor body and a printed circuit board. The semiconductor body includes a monolithically integrated circuit and at least two metal contact areas. The printed circuit board has a first and second region and a top and a bottom. At least two formed terminal contacts and two conductive traces are connected to the terminal contacts, and the terminal contacts are designed as contact holes passing through the printed circuit board, and are arranged in the first region of the printed circuit board. The two metal contact areas are connected to the conductive traces by bond wires, and the semiconductor body is implemented as a die. The die is arranged in the second region on the top of the printed circuit board, and the semiconductor body and the bond wires are completely covered with a potting compound on the top of the printed circuit board.

Abstract: An apparatus (10) for determining a stray magnetic field in the vicinity of a sensor is described. The apparatus (10) has a multipole permanent magnet (60) with four or more poles and an axis of rotation (70). The multipole permanent magnet (60) produces a magnetic field (65) with magnetic field vectors (67). Two vertical Hall sensors (40a and 40) are so arranged in two positions on a circular path (50) about the axis of rotation, such that the sum of the magnet field vectors (67) measured at the two positions is substantially zero.

Abstract: An arrangement for testing integrated circuits includes an integrated test circuit and a cluster which has at least one integrated circuit and a second integrated circuit. The first integrated circuit is provided in a first component region of a wafer, and the second integrated circuit in a second component region. The first component region and the second component region are spaced a distance apart by a scribe line of the wafer. The integrated test circuit is connected to the first integrated circuit via a first test line section, and the second integrated circuit is connected to the first test line section via a first connecting line that has a first well in the semiconductor material, the first well extending continuously in the wafer from the first component region over the scribe line to the second component region, the first well being electrically insulated from a substrate of the wafer.

Abstract: A method for computing a correction factor (KF) for an angular measuring system (10) comprising a measurement of a first output value (W1) in a first measuring position (20) and a measurement of a second output value (W2) in a second measuring position (30). An actual value (DI) is formed from the difference between the first output value (W1) and the second output value (W2), and a target value (DS) is formed from the difference of target values (S1, S2) in the first measuring position (20) and in the second measuring position (30). The correction factor (KF) is computed from the ratio of the target value (DS) to the actual value (DI).

Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.

Abstract: A method for increasing a reliability of transducers having a first IC and a second IC, each has a sensor and a signal output and a signal input and a comparator, and a sensor signal generated as a function of the physical quantity sensed by the relevant sensor is applied to the respective signal outputs. The signal outputs are each connected to a first input of the comparator, and the signal inputs are each connected to a second input of the comparator. The two ICs can be integrated into a common IC package, and the signal output of the first IC is connected to the first input of the comparator on the first IC and to the signal input of the second IC and to a first contact area passing through the IC package.

Abstract: Magnetic field compensation device having a first bar-shaped flux concentrator and a second bar-shaped flux concentrator, wherein the first flux concentrator and the second flux concentrator are separated from one another in a y-direction, and the longitudinal axis of the first flux concentrator and the longitudinal axis of the second flux concentrator are arranged to be substantially parallel to one another. A control unit is in an operative electrical connection with the magnetic field sensor and the compensating coil, and the control unit is equipped to control the compensating current through the compensating coil using a measured signal from the magnetic field sensor in such a manner that, for an external magnetic field formed in the x-direction at the location of the magnetic field sensor, the magnetic field is substantially compensated.

Abstract: A measuring system and drive system with a measuring system, a magnet, a transmitter, and a magnetic field sensor. The magnetic field sensor is arranged between the magnet and the transmitter. The transmitter has a number of segments made of a magnetically conductive material, each segment having a wing shape with a web edge that is radially directed outwards, each web edge being diagonally designed towards the rotational direction, and that each web edge is distanced from the magnetic field sensor by an air gap.

Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.

Abstract: A measuring system for determining an angle of rotation of a shaft, which is rotatable about an axis of rotation, having a magnetically conductive encoder, which is spaced from the axis of rotation and fixedly connected to the shaft, a magnet unit with a permanent magnet, and an intermediate sensor unit having two magnetic field sensors. The permanent magnet has a magnetization extending parallel to the axis of rotation, and a circular-cylindrical recess having a bottom, an axis of symmetry extending perpendicular to the bottom, and a diameter, the sensor unit being completely arranged within the recess and stationary with respect to the permanent magnet. The first distance of the encoder from the axis of rotation being less than half the diameter of the recess, the encoder being arranged in a direction parallel to the axis of rotation at a second distance from the sensor unit.

Abstract: A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.

Abstract: The invention relates to a device (1) for measurement of an angle of an axis of rotation (10), comprising a magnet (12) with a magnet surface (14), which is pivotally assembled at the axis of rotation (10), and further comprising a sensor (16) for recognition of external magnetic flux lines of the magnet (12). According to the invention, the magnet (12) comprises at least a first magnet section (20) with a magnetic first orientation (22) and the magnet (12) further at least comprises a second magnet section (24) with a second magnetic orientation (26), wherein the first magnetic orientation (22) is displaced from the second magnetic orientation (26), whereby the magnet surface (14) comprises a different concentration of external magnetic flux lines.

Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.

Abstract: An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.

Abstract: A method is provided for operating a magnetic field detector circuit, whereby the magnetic field detector circuit is operated alternately in an active state or in a sleep state and the magnetic field detector circuit has a magnetic field measuring device and a wake-up timer, whereby the magnetic field measuring device comprises a magnetic field sensor. In the active state, the magnetic field measuring device is operated with a supply voltage and an output signal is generated by the magnetic field sensor. The magnetic field detector circuit comprises a wake-up timer, whereby the wake-up timer is operated with the supply voltage in the sleep state and a wake-up signal is generated by the wake-up timer after a predetermined sleep interval, and the magnetic field measuring device changes from the sleep state to the active state.

Abstract: A sensor device for suppressing a magnetic stray field, having a semiconductor body with a surface, formed in an x-y plane, and a back surface. Each circle half of a disk-shaped magnet has two magnetic poles and the magnet is rotatable relative to the IC housing around a z-direction. An imaginary lengthening of the axis penetrates the magnet in the center of gravity of the main extension surface of the magnet. A first pixel cell and a second pixel cell are integrated into the surface of the semiconductor body together with a circuit arrangement, and each pixel cell has a first magnetic field sensor and a second magnetic field sensor. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the first pixel cell in a projection along an imaginary lengthening of the axis is arranged within the two inner circle segments.