Patents Assigned to Tel Yamanashi Limited
  • Patent number: 4944542
    Abstract: A support device of the present invention includes an expansible means attached to at least one of plural support systems for supporting an object. Even when the object has dimensional errors caused in its making process, therefore, the interval between the support systems which contact the object to be supported can be self- and micro-adjusted. This enables objects, different in shape, to be correctly positioned and supported.
    Type: Grant
    Filed: October 6, 1988
    Date of Patent: July 31, 1990
    Assignee: Tel Yamanashi Limited
    Inventors: Mizuki Uchida, Kozo Hara
  • Patent number: 4936734
    Abstract: A chuck for transporting wafer carriers is designed to hold the wafer carriers in a cantilever manner and with support members supporting one sides of the wafer carriers. This enables the whole chuck to be extremely compact. This also enables the wafer carriers to be made freer fron any limit while they are being transported and prevents them from being damaged because they can be steadily transported.
    Type: Grant
    Filed: October 12, 1988
    Date of Patent: June 26, 1990
    Assignee: Tel Yamanashi Limited
    Inventor: Atsushi Osada