Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract: A voltage supply circuit capable of starting up a system while maintaining symmetry of a high level selection signal VH and a low level selection signal VL, not requiring a multistage charge pump circuit, and capable of reducing the number of parts of the system, wherein generation circuits of VD and VH are comprised of chopper type booster type switching regulators, and switching timings of a VH generation circuit 12 and a VL generation circuit 13 are controlled so that a virtual reference voltage VS (VD/2) and a middle point potential between VH and VL become the same.

Abstract: A surface image of a semiconductor wafer having a defect is picked up as a inspection image while a surface image of a semiconductor wafer having no defect is stored in an image memory as a reference image. A density difference image between the inspection image and the reference image. By extracting the defect in wiring and non-wiring regions from the density difference image, extract images are obtained. Two luminance information for wiring and non-wiring regions are obtained from extract images. Based on the luminance information, the type of the defect is determined and a production process where the defect has occurred is detect.

Abstract: A positioning control system for performing recording/reproducing operations by irradiating an optical beam to predertermined position on an optically recording medium, e.g., magneto-optical disk, includes a photo-detector constituted by at least two-divisional units; and a servo-error signal generating circuit which can generate at least one servo-error signal in accordance with a difference between the detection currents.

Abstract: A heating device for injected fuel in an internal combustion engine is disposed at an upper wall of an intake port. The heating device includes a casing and a plurality of fins integrally connected to a lower plate of the casing. A heater is disposed between the intake port and the casing. The fins are arranged to downwardly extend from said supporting member and along the injected direction of the injected fuel. Therefore, the atomization of the injected fuel is accelerated by the heating of the heating device.