Abstract: Methods and apparatus to clamp overvoltages for inductive power transfer systems are described herein. An example overvoltage protection circuit is described, including a first terminal configured to receive an alternating current signal for conversion to a second signal, a capacitor, a first switch configured to selectively electrically couple the capacitor to the first terminal based on an overvoltage detection signal to reduce an overvoltage on the second signal, and an overvoltage detector. The example overvoltage detector is configured to determine a signal level of the second signal and, in response to determining that the signal level of the second signal is greater than a threshold, to output the overvoltage detection signal to cause the switch to electrically couple the capacitor between the first terminal and a second terminal.

Abstract: The invention relates to an electronic device and a method for DC-DC-conversion. The electronic device includes energizing switch and a commutating switch coupled at a switching node. The switching node is configured to be coupled to an inductor. The electronic device is configured to repeatedly suspend the regular synchronous switching of the commutating switch during a load detection period, to sense the voltage at the output node during the load detection period and to determine a high-load condition or a light-load condition of the DC-DC-conversion based on the sensed voltage at the output node.

Abstract: A DC-DC converter includes a current control stage configured to provide a threshold based on an output voltage, an input voltage, and a reference voltage for the DC-DC converter. An off time control can be configured to receive the threshold and control an off time for the DC-DC converter based on the threshold such that the off time is inversely proportional to the peak current generated by the DC-DC converter.

Abstract: A first device is adapted to communicate with a second device using a protocol standard. The devices exchange security and connection setup frames using a preamble format and a header format defined in the protocol standard. The connection setup frames specify a modified protocol using a truncated preamble, a shortened header, or both. The devices configure their transceivers to transmit and receive frames formatted based on the modified protocol.

Abstract: An apparatus includes a heat-generating component and a thermally inert component positioned in close proximity to the heat-generating component.

Abstract: An electronic communication device includes an antenna configured to receive a radio frequency (RF) signal and generate a differential current signal at a first tag pin and a second tag pin. A first variable resistor is coupled to the first tag pin and a second variable resistor is coupled to the second tag pin. A mixer circuit is coupled across the first variable resistor and the second variable resistor and is configured to generate an output voltage. The output voltage is used for RF signal detection at all RF signal levels.

Abstract: A position detecting system detects and responds to the movement of a target through a sensing domain area of a plane. The movement causes the amount of the target that lies within a sensing domain area to change. A portion of the target always lies within at least one of the sensing domain areas of the plane.

Abstract: A method of reducing leakage current in a memory circuit is disclosed (FIG. 8A). The method includes connecting a first supply voltage terminal (VDD) to a bulk terminal of a transistor in an active mode of operation. The method further includes detecting a low power mode (SLEEP) of operation of the transistor and disconnecting the first supply voltage terminal from the bulk terminal in response to the step of detecting.

Abstract: Several circuits and methods that may be implemented to enable specification support of a plurality of interface components in an IC are disclosed. In an embodiment, a circuit includes a plurality of multiplexer circuits and a control circuit. The plurality of multiplexer circuits are configured to provide a plurality of data paths and a plurality of outputs according to a set of selection signals. The plurality of data paths is configurable for at least a first mode of operation or a second mode of operation based on the set of selection signals. The first mode of operation and the second mode of operation are associated with complimentary specifications. The control circuit is coupled with the plurality of multiplexer circuits in order to control the set of selection signals of the plurality of multiplexer circuits to thereby select one of the first mode and the second mode of operation.

Abstract: A method of making a flip chip assembly includes a substrate having a top surface and forming a plurality of generally longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. Applying a transversely extending solder resist strip over the first longitudinal end portions of the bond fingers. The strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps. Each tooth portion and each gap aligned with a different one of the bond fingers in each adjacent pair of bond fingers.

Abstract: A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.

Abstract: Topology discovery of a target system having a plurality of components coupled with a scan topology may be performed by driving a low logic value on the data input signal and a data output signal of the scan topology. An input data value and an output data value for each of the plurality of components is sampled and recorded. A low logic value is then scanned through the scan path and recorded at each component. The scan topology may be determined based on the recorded data values and the recorded scan values.

Abstract: A system comprises an enclosure, host logic contained in the enclosure, and intrusion security logic also contained in the enclosure. The intrusion security logic is coupled to the host logic and configured to detect a security intrusion to the system and to respond to a security intrusion with a user-configurable trigger event. The intrusion security logic implements at least two tamper blocks, each tamper block configured to monitor one more input signals and initiate a trigger event when a security breach of the enclosure is detected. At least one of the tamper blocks comprises a state machine whose operation is controlled by way of user-programmable registers.

Abstract: An ammonia-free method of depositing silicon nitride by way of plasma-enhanced chemical vapor deposition (PECVD). Source gases of silane (SiH4) and nitrogen (N2) are provided to a parallel-plate plasma reactor, in which energy is capacitively coupled to the plasma, and in which the wafer being processed has been placed at a support electrode. Low-frequency RF energy (e.g., 360 kHz) is applied to the support electrode; high-frequency RF energy (e.g., 13.56 MHz) is optionally provided to the parallel electrode. Process temperature is above 350° C., at a pressure of about 2.5 torr. Any hydrogen present in the resulting silicon nitride film is bound by N—H bonds rather than Si—H bonds, and is thus more strongly bound to the film. The silicon nitride can serve as passivation for ferroelectric material that may degrade electrically if contaminated by hydrogen.

Abstract: Several circuits and methods for field-based communication are provided. In an embodiment, a field-based communication circuit includes a receiver circuit, a detection circuit and a control circuit. The receiver circuit is configured to receive a field input signal from a field source. The detection circuit includes a voltage detection circuit and a current detection circuit configured to detect a voltage signal and a current signal, respectively associated with the field input signal. The control circuit is configured to trigger a selection of one of the voltage detection circuit and the current detection circuit based on a detection of a signal magnitude of one of the voltage signal and the current signal relative to at least a first predetermined threshold level, wherein the selection of one of the voltage detection circuit and the current detection circuit facilitates a demodulation of one of the voltage signal and the current signal.

Abstract: A circuit includes an antenna, and a pair of transceivers. A first transceiver in the pair is connected to the antenna via a first pair of feed-points, and is designed to transmit and receive signals in a first band of frequencies. A second transceiver in the pair is connected to the antenna via a second pair of feed-points, and is designed to transmit and receive signals in a second band of frequencies. The first band and the second band are non-overlapping frequency bands. The first pair of feed-points is located at a voltage null point of the antenna with respect to the second pair of feed-points. The second pair of feed-points is located at a voltage null point of the antenna with respect to the first pair of feed-points. The first transceiver and the second transceiver are, thus, enabled to simultaneously transmit and/or receive corresponding signals using the same antenna.

Abstract: Receiver circuits and methods of processing received signals are disclosed herein. An embodiment of a receiver circuit includes a differential input having a first input and a second input and a differential output having a first output and a second output. A first feedback loop is connected to the input and the output, wherein the first feedback loop centers a differential output voltage around a common mode output voltage so that the differential sum is zero centered on the common mode output voltage. The circuit also includes a second feedback loop, wherein the second feedback loop centers the voltage at the first input and the voltage at the second input to a reference voltage.

Abstract: Systems and methods for implementing data concentrated initiated multicast firmware upgrade in power line communications (PLC) are described. In an illustrative embodiment, a method performed by a PLC device may include forming a group of PLC devices to receive a transmission of a data set, the group being organized according to a hierarchical structure, transmitting the data set to the group of PLC devices, determining whether a PLC device in the lowest level of the hierarchical structure is missing one or more portions of the data set, and retransmitting at least the missing portions of the data set until the lowest level of PLC devices each have the full data set.

Abstract: A portable image projection device has a housing with first and second members pivotable between device folded and unfolded positions. First lens optics mounted within the first member are configured for projecting light modulated by a spatial light modulator along an optical axis through a first aperture with a first throw ratio with the device in the folded position. A second lens optics element movably mounted within the first member is configured for selective movement between positions of non-intersection and intersection with the optical axis. The second lens optics element is configured for cooperating with at least part of the first lens optics for projecting the light modulated by the spatial light modulator along the optical axis through a second aperture with a second throw ratio less than the first throw ratio with the device in the unfolded position.

Abstract: An independently based diagnostic system tests the execution of a processor. The processor is arranged to provide a diagnostic output that provides a pre-determined time-variant signal. The independently based diagnostic system has an independent basis from which to evaluate the pre-determined time-variant signal. The independent basis can be, for example, an independent time base that is separately generated from the processor time base used to clock the processor and/or an independent voltage source that is separate from the processor power supply. The independently based diagnostic system provides progressive notifications of the results of successive evaluations of the pre-determined time-variant signal.