Patents Assigned to The Furukawa Electric Co., Ltd.
  • Publication number: 20210199883
    Abstract: Provided is a coated optical fiber and an optical fiber cable capable of suppressing transmission loss (microbend loss) even in an optical fiber having high microbend sensitivity. In the present invention, the degree of freedom of a primary layer 11 represented by the equation (I) and the rigidity of a secondary layer 12 represented by the equation (II) are set in specific ranges, respectively. Thus, the present invention provides a coated optical fiber 1 capable of suppressing the transmission loss even when an optical fiber 10 having high microbend sensitivity such as a BI fiber having a large effective core cross-sectional area Aeff of an optical fiber is used. The present invention can be widely used as a coated optical fiber 1 constituting a coated optical fiber ribbon or as a coated optical fiber 1 housed in an optical fiber cable. Further, an optical fiber cable including such coated optical fibers 1 enjoys the effect of the above-described coated optical fiber 1. [Math.
    Type: Application
    Filed: March 12, 2021
    Publication date: July 1, 2021
    Applicant: FURUKAWA ELECTRIC CO. LTD.
    Inventors: Minoru KASAHARA, Yoshihiro ARASHITANI, Kouji MOCHIDUKI, Masahiro YABE
  • Patent number: 11050211
    Abstract: A pulsed laser device includes a laser light source, an electro-optic modulator, a laser light source driver, an electro-optic modulator driver, and a controller to control the laser light source driver and the electro-optic modulator driver. The laser light source outputs pulsed laser light pulse-modulated by the laser light source driver. The electro-optic modulator outputs pulsed laser light obtained by causing the electro-optic modulator driver to pulse-modulate the pulsed laser light from the laser light source. The control unit controls the laser light source driver and the electro-optic modulator driver such that the electro-optic modulator turns on at least while the laser light source is on and the electro-optic modulator turns on at least once while the laser light source is off, thereby increasing a duty ratio of the pulse modulation for the electro-optic modulator relative to a duty ratio of the pulse modulation for the laser light source.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: June 29, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Ryo Kawahara, Shunichi Matsushita
  • Publication number: 20210189197
    Abstract: The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film 13 for joining a semiconductor element 2 and a substrate 40, the joining film having an electroconductive joining layer 13a formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer 13b having tackiness and being laminated with the electroconductive joining layer. The tack layer 13b is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer 13a are sintered, and thereby the semiconductor element 2 and the substrate 40 are joined.
    Type: Application
    Filed: March 8, 2021
    Publication date: June 24, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Norzafriza NITTA, Yoshihiro SATO, Hidemichi FUJIWARA
  • Publication number: 20210189198
    Abstract: The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film for joining a semiconductor element and a substrate, the joining film having an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer having tackiness and being laminated with the electroconductive joining layer. The tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.
    Type: Application
    Filed: March 8, 2021
    Publication date: June 24, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Norzafriza NITTA, Yoshihiro SATO, Hidemichi FUJIWARA
  • Publication number: 20210186612
    Abstract: To provide an optical probe capable of changing a traveling direction of an output beam to a sideward direction. The optical probe includes an optical fiber that outputs a beam from a distal end thereof, and a traveling direction changing unit that changes a traveling direction of the output beam to a sideward direction with respect to the optical fiber. The optical probe includes a holder member that is mounted on a distal end side of the optical fiber and holds the optical fiber, and the traveling direction changing unit may be a reflector that is arranged on the holder member and that reflects output beam.
    Type: Application
    Filed: March 9, 2021
    Publication date: June 24, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kengo WATANABE, Shunichi MATSUSHITA, Yoshiki NOMURA, Shigehiro TAKASAKA, Masaki IWAMA
  • Publication number: 20210178514
    Abstract: A welding method includes: emitting laser beam toward a workpiece including a metal to melt and weld a part of the workpiece, the part being where the laser beam has been emitted to. Further, the laser beam includes a main power region and at least one auxiliary power region, a power of the main power region is larger than a power of each of the at least one auxiliary power region, and a ratio between the power of the main power region and the total of powers of the at least one auxiliary power region is in a range of 144:1 to 1:9.
    Type: Application
    Filed: February 24, 2021
    Publication date: June 17, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tomomichi YASUOKA, Takashi KAYAHARA, Ryosuke NISHII, Koji KIRIKAE, Keigo MATSUNAGA, Takashi SHIGEMATSU
  • Publication number: 20210177516
    Abstract: An optical probe includes: an optical fiber; a reflecting portion; and a traveling direction changing portion changing a traveling direction of a laser beam of a first wavelength that has transmitted through the reflecting portion to a direction different from a traveling direction before transmitting through the reflecting portion. Further, the traveling direction changing portion is configured by a bending structure having a structure in which a portion on a distal end side of the optical fiber is bent, and the reflecting portion is provided closer to a proximal end side of the optical fiber than the bending structure.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 17, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshiki NOMURA, Kengo WATANABE, Shunichi MATSUSHITA
  • Publication number: 20210184436
    Abstract: An optical semiconductor device outputting a predetermined wavelength of laser light includes a quantum well active layer positioned between a p-type cladding layer and an n-type cladding layer in thickness direction. The optical semiconductor device includes a separate confinement heterostructure layer positioned between the quantum well active layer and the n-type cladding layer. The optical semiconductor device further includes an electric-field-distribution-control layer positioned between the separate confinement heterostructure layer and the n-type cladding layer and configured by at least two semiconductor layers having band gap energy greater than band gap energy of a barrier layer constituting the quantum well active layer. The quantum well active layer is doped with 0.3 to 1×1018/cm3 of n-type impurity.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Junji YOSHIDA, Hirokazu ITOH, Satoshi IRINO, Yuichiro IRIE, Taketsugu SAWAMURA
  • Publication number: 20210184419
    Abstract: A light source for Raman amplification to Raman-amplify signal light includes: plural incoherent light sources that output incoherent light; plural pumping light sources that output second-order pumping light; an optical fiber for Raman amplification to Raman-amplify the incoherent light with the second-order pumping light, and outputs the amplified incoherent light; and an output unit connected to the optical transmission fiber, receiving the amplified incoherent light, and outputting the amplified incoherent light as first-order pumping light having a wavelength that Raman-amplifies the signal light to the optical transmission fiber.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Haruki OGOSHI, Masahito MORIMOTO
  • Publication number: 20210180161
    Abstract: Provided is an aluminum alloy material having high strength and excellent wear resistance, which can be a substitute for an iron-based metal material or a copper-based metal material. The aluminum alloy material has an alloy composition containing 0.05-1.80% by mass of Mg, 0.01-2.00% by mass of Si, and 0.01-1.50% by mass of Fe, the remainder comprising Al and unavoidable impurities, wherein the aluminum alloy material has a fibrous microstructure in which crystal grains extend along substantially one direction, the average value of the short-direction dimension L2 perpendicular to the longitudinal direction of the crystal grains is 500 nm or less in a cross section parallel to the substantially one direction, and the arithmetic mean roughness Ra of a principal surface of the aluminum alloy material is no greater than 1.000 ?m.
    Type: Application
    Filed: August 27, 2019
    Publication date: June 17, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Akiyoshi ARAKI, Yoshiaki OGIWARA
  • Patent number: 11036024
    Abstract: A method for manufacturing an intermittent bonding type optical fiber ribbon which is capable of forming non-connection portions and intermittent connection portions between adjacent coated optical fibers formed into an optical fiber ribbon by performing a laser processing for the ribbon through irradiation with a pulse laser light, thereby making it possible to rapidly form the intermittent connection portions and the non-connection portions while maintaining high linear velocity of the coated optical fiber. The non-connection portions and the intermittent connection portions are formed in the obtained intermittent bonding type optical fiber ribbon through the irradiation with the pulse laser light, so the intermittent bonding type optical fiber ribbon becomes the intermittent bonding type optical fiber ribbon, which is capable of securing operability during collective connection and surely being subjected to an intermediate branching without damaging cable characteristics during high density mounting.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: June 15, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiroki Tanaka, Kenji Yokomizo, Tomohiro Ishimura, Yutaka Hoshino, Masaki Iwama, Eisuke Otani, Shunichi Matsushita, Yoshihiro Arashitani, Takeshi Yagi
  • Patent number: 11037594
    Abstract: Provided is an aluminum alloy substrate for a magnetic disk that includes an aluminum alloy containing 0.4 to 3.0 mass % (hereinafter abbreviated as “%”) of Fe, 0.005% to 1.000% of Cu, and 0.005% to 1.000% of Zn, with a balance of Al and unavoidable impurities. This substrate has a ratio A/B of 0.70 or more, where A indicates a distribution density of Al—Fe intermetallic compound particles having maximum diameters of 10 ?m or more and less than 16 ?m, and B indicates a distribution density of Al—Fe intermetallic compound particles having maximum diameters of 10 ?m or more. The distribution density of Al—Fe intermetallic compound particles having maximum diameters of 40 ?m or more is at most one per square millimeter. Also provided are a method of fabricating this aluminum alloy substrate for a magnetic disk and a magnetic disk composed of the aluminum alloy substrate for a magnetic disk.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: June 15, 2021
    Assignees: UACJ CORPORATION, FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kotaro Kitawaki, Makoto Yonemitsu, Hideyuki Hatakeyama, Takashi Nakayama, Yasuo Fujii, Ryo Sakamoto
  • Publication number: 20210170527
    Abstract: A welding method includes a step of, while irradiating laser beam toward a workpiece, relatively moving the laser beam and the workpiece and, while sweeping the laser beam on the workpiece, melting the workpiece in an irradiated portion to perform welding. Further, the laser beam is configured by a main power region and a sub-power region, at least a part of the sub-power region is present on a sweeping direction side of the main power region, a power density of the main power region is equal to or higher than a power density of the sub-power region, and the power density of the main power region is at least power density that can generate a keyhole.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tomomichi YASUOKA, Takashi KAYAHARA, Toshiaki SAKAI, Ryosuke NISHII, Takashi SHIGEMATSU
  • Patent number: 11031746
    Abstract: A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: June 8, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Maiko Ariga, Masaki Iwama
  • Publication number: 20210162539
    Abstract: A welding method includes: layering two or more plate materials each including a plating plate material having a preform on a surface of which a plating layer is formed to form a workpiece; disposing the workpiece in a region to be irradiated with a processing laser beam; generating the processing laser beam having a power distribution shape in which two or more power regions are disposed along a predetermined direction in a plane perpendicular to a light traveling direction; irradiating a surface of the workpiece with the processing laser beam; and moving the processing laser beam and the workpiece relatively while performing the irradiation, and melting an irradiated area of the workpiece to perform welding while sweeping the processing laser beam in the predetermined direction on the workpiece during a swing of the processing laser beam.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 3, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Takashi KAYAHARA, Ryosuke NISHII, Satoshi ASANUMA, Tomomichi YASUOKA, Takashi SHIGEMATSU
  • Publication number: 20210164120
    Abstract: Provided is a plated wire rod having excellent salt water corrosion resistance, solder wettability, thermal peeling resistance, and fatigue resistance. A plated wire rod having a wire rod made of aluminum or an aluminum alloy, and a surface treatment coating which is constituted by one or more metal layers and with which the wire rod is coated, the plated wire rod comprising: a mixed layer in a boundary region between the wire rod and the surface treatment coating, the mixed layer containing a metal component of the wire rod, a metal component of the surface treatment coating, and an oxygen component, wherein the one or more metal layers constituting the surface treatment coating includes an innermost metal layer which is located closest to the wire rod among the one or more metal layers, the innermost metal layer being made of copper or a copper alloy.
    Type: Application
    Filed: March 18, 2019
    Publication date: June 3, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Miho YAMAUCHI, Yoshiaki OGIWARA
  • Publication number: 20210162387
    Abstract: A catalyst structure includes a carrier having a porous structure composed of a zeolite type compound and at least one catalytic material existing in the carrier. The carrier has channels communicating with each other, and the catalytic material is a metal fine particle and exists at least in the channel of the carrier.
    Type: Application
    Filed: February 4, 2021
    Publication date: June 3, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Sadahiro KATO, Masayuki FUKUSHIMA, Hiroko TAKAHASHI, Yuichiro BANBA, Kaori SEKINE, Takao MASUDA, Yuta NAKASAKA, Takuya YOSHIKAWA
  • Patent number: 11011885
    Abstract: A laser device that is easily assembled and can be manufactured at low cost and a light-source device using the same are provided. The laser device includes a base plate portion, a semiconductor laser element placed on the base plate portion, a lid portion provided on the base plate portion, on which the semiconductor laser element is placed, and including a top plate, and a side wall portion covering a part or all of lateral sides of a space between the base plate portion and the top plate. The top plate is integrally formed with a part or all of the side wall portion.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: May 18, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Etsuji Katayama, Atsushi Oguri, Hajime Mori
  • Publication number: 20210139664
    Abstract: A cellulose-fiber dispersion polyethylene resin composite material, formed by dispersing a cellulose fiber into a polyethylene resin, wherein a proportion of the cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin and the cellulose fiber, and wherein water absorption ratio satisfies the following formula; and a formed body and a pellet using the same, a production method therefor, and a recycling method for a cellulose-fiber adhesion polyethylene thin film piece. (water absorption ratio)<(cellulose effective mass ratio)2×0.01??[Formula].
    Type: Application
    Filed: August 23, 2017
    Publication date: May 13, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jirou HIROISHI, Hidekazu HARA, Yuka SAWADA, Masami TAZUKE, Toshihiro SUZUKI, Shingo MITSUGI
  • Patent number: 11001520
    Abstract: A method of manufacturing an optical fiber glass preform, the method comprising depositing glass particles on a base material, the glass particles being generated by glass making feedstock gas being supplied while a burner and the base material that is rotating are reciprocated relatively to each other, wherein when a portion corresponding to an outer diameter equal to or more than 0.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: May 11, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Seiichi Shinada, Akihiro Kanao