Abstract: A heat sink adapted to thermally couple to a surface mounted heat generating electronic device package in a manner which provides an increased thermal path between the heat sink and the electronic device package. The heat sink is typically mounted piggyback on a heat generating electronic device package which is surface mounted to a printed circuit board or other substrate. The heat sink comprises thermal legs which extend from the heat sink body and are thermally coupled to thermal leads of the heat generating electronic device package.

Abstract: A heat dissipation system for a heat generating electronic device includes a releasable attachment assembly for removably securing a heat sink to a heat spreader plate thereof includes at least one spring clip for biasing the heat spreader plate into a secured engagement with the heat sink. The spring clips are adapted to allow easy engagement and/or disengagement of the heat sink from the heat spreader plate, thereby facilitating the use of variously configured heat sinks as part of the heat dissipation system.

Abstract: A mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package. The mounting assembly essentially comprises a heat generating device package, a mounting attachment, and a heat sink. The mounting attachment and heat generating device package are surface mounted to a PCB or other substrate in mutual thermal communication with a thermal pad on the substrate. The mounting attachment is adapted to facilitate the effective dissipation of heat from surface mounted heat generating electronic device packages while allowing for the post-manufacture installation and exchange of heat sinks.

Abstract: An elongated unitary clip apparatus having an S-shaped mid-section connecting end portions which extend in opposite directions from the mid-section is mounted within an aperture in a support base so that one end of the apparatus extends substantially parallel with one face of the support base and the opposite end extends substantially parallel with the opposite face. One end of the clip apparauts is secured in a second aperture in the support base and the opposite end urges an electronic device package into contact with a heat sink.

Abstract: Disclosed is a spring clip fastener for mounting a heat sink and a semiconductor device package to the surface of a circuit board. The fastener includes a spring portion and support members extending from the spring portion for supporting the spring portion above the surface of the circuit board. A shoulder is internally formed in the support members so that the spring portion urges the semiconductor device package against the heat sink. Feet extend from the support members for engaging the surface of the circuit board. The feet are coated with a solder-promoting material.

Abstract: A unitary clip having a base portion and a stake end is used to attach an electronic device package to a heat sink. The stake end of the clip is secured within an aperture such as a groove or slot in the face of the heat sink and connected to the base by a curved spring portion. An electronic device package inserted between the base portion and the heat sink is urged into intimate contact with the surface of the heat sink.

Abstract: A finned heat sink is constructed from a base having parallel grooves with a latching lip. The fins are individually formed with a retaining boss adjacent one edge which is adapted to mate with the latching lip to secure the fin in the groove. Spacing tabs are formed on the fins to assure uniform parallel spacing between the fins when assembled.

Abstract: Disclosed are insulating covers for electronic device packages secured to heat sinks by clips. The covers provide minimum predetermined creepage distance between the electronic device packages and the heat sinks upon which they are mounted.

Abstract: Disclosed is apparatus for mounting an electronic device package on a printed circuit board or the like. The apparatus includes a frame for receiving the electronic device package with the leads of the electronic device package presented for solderable connection to preformed locations on the printed circuit board. Solderable means are provided to mount the frame and the electronic device package on the printed circuit board. A clip engaging a heat sink is secured to the frame to urge the heat sink into intimate thermal contact with the electronic device package.

Abstract: A stanchion having a base with holes passing therethrough is used to hold elongated electronic device packages in a vertical position during assembly of a circuit board. The leads extending from the end of the device package are positioned in the holes in the base and the device package retained in the vertical position by attachment arms extending upwardly from opposite sides of the base defining a cavity for receiving the device package. Legs extending from the base support the device package above the surface of the circuit board to permit cleaning of the assembly.

Abstract: Disclosed are apparatus and methods for attaching an electronic device package and a heat sink to a circuit board or the like. The electronic device package has a body with a planar bottom and leads extending from the body. The distal ends of the leads are coplanar with the bottom of the electronic device package. The heat sink has a base, heat-dissipating fins or the like and a clip for securing the electronic device package to the heat sink. A pair of dimples project downward from the base of the heat sink to tilt the bottom of the electronic device package. Tilting the electronic device package causes the ends of the leads to contact the circuit board so that the leads can be easily soldered to the circuit board. The dimples and the front edge of the heat sink can also be soldered to the circuit board.

Abstract: Disclosed are solderable fastener devices for mounting heat sinks and electronic device packages on circuit boards. The fastener includes at least one mounting member extending to the circuit board and adapted for soldering thereto. The mounting member spaces the fastener, heat sink and electronic device package above the surface of the circuit board. The fastener further includes attachment means for gripping the heat sink and attaching it to the fastener. Securing means are provided for affixing the electronic device package to the heat sink and the fastener above the surface of the circuit board.

Abstract: Unitary heat sink apparatus for use in removal of heat from a heat generating component is disclosed which includes a heat sink body formed by extrusion. Parallel fins extend outwardly a first predetermined distance for the heat sink body and are separated by a first predetermined number of grooves of a first predetermined depth and width. The ratio of the height of the fins to the width of the grooves is approximately four to one. The first predetermined number of parallel grooves are gang sawed to a second predetermined depth to provide a second and greater predetermined height to the parallel fins such that the new ratio of the second predetermined height of the fins to the width of the parallel grooves is increased to at least six to one. In another embodiment, the heat sink is then rotated ninety degrees and a second predetermined number of grooves are gang sawed at right angles across and through the parallel fins to provide a predetermined number of pins extending outwardly from the heat sink body.

Abstract: Unitary heat sink apparatus for use in removal of heat from a heat generating component is disclosed which includes a heat sink body formed by extrusion. Parallel fins extend outwardly a first predetermined distance from the heat sink body and are separated by a first predetermined number of grooves of a first predetermined depth and width. The ratio of the height of the fins to the width of the grooves is approximately four to one. The first predetermined number of parallel grooves are gang sawed to a second predetermined depth to provide a second and greater predetermined height to the parallel fins such that the new ratio of the second predetermined height of the fins to the width of the parallel grooves is increased to at least six to one. In another embodiment, the heat sink is then rotated ninety degrees and a second predetermined number of grooves are gang sawed at right angles across and through the parallel fins to provide a predetermined number of pins extending outwardly from the heat sink body.

Abstract: Alignment apparatus for receiving, aligning and retaining the pin connectors of an electronic component package in predetermined relationship is used to maintain proper alignment of the pin connectors with preformed holes or mounting pads on a printed circuit board or the like when the sub-assembly of a heat sink and an electronic component package is mounted on a printed circuit board or the like.

Abstract: Disclosed is a compensating roll pin securing a heat sink to a circuit board. The roll pin comprises a deformable body of resilient material, such as annealed spring steel, formed into a generally cylindrical body having first and second end portions separated by a middle portion of enlarged external diameter and an axially extending gap in the surface of the body. A method of use is also disclosed wherein the first end portion of the roll pin is inserted into an aperture in a heat sink and the middle portion deformed within the aperture to form a tight fit between the pin and heat sink. A substantial part of the middle portion remains outside the aperture in the heat sink. The second end portion is inserted into a hole in a circuit board and forms an interference fit therewith. The middle portion forms a stop to prevent further insertion of the roll pin into the circuit board so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Abstract: Disclosed is a compensating roll pin securing a heat sink to a circuit board. The roll pin comprises a deformable body of resilient material, such as annealed spring steel, formed into a generally cylindrical body having first and second end portions separated by a middle portion of enlarged external diameter and an axially extending gap in the surface of the body. A method of use is also disclosed wherein the first end portion of the roll pin is inserted into an aperture in a heat sink and the middle portion deformed within the aperture to form a tight fit between the pin and heat sink. A substantial part of the middle portion remains outside the aperture in the heat sink. The second end portion is inserted into a hole in a circuit board and forms an interference fit therewith. The middle portion forms a stop to prevent further insertion of the roll pin into the circuit board so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Abstract: Disclosed is a heat sink clip assembly comprising a frame and a clip for securing and aligning a heat sink with an electronic device package. The frame includes a cavity for receiving the electronic device package with the leads thereof exposed for mounting on a printed circuit board or the like. A resilient heat sink clip is removably engaged with a pair of latching members on the perimeter of the frame. The clip includes means for releasably gripping the heat sink. The heat sink is urged by the heat sink clip into intimate thermal contact with the electronic device package for dissipation of heat therefrom.