Patents Assigned to Tokyo Electron Tohoku Kabushiki Kaisha
  • Patent number: 5884917
    Abstract: Annular groove portions are formed in each of facing surfaces of a sealing portion of a processing vessel that is kept in an atmosphere of a prescribed gas or an atmosphere at a reduced pressure, and a thin annular plate is arranged in such a manner that it is sucked against the entire periphery of the opening portions of the annular groove portions. The annular groove portions are each connected to an exhaust device, and the facing surfaces of the sealing portion are sealed in a gas-tight manner by reducing the pressure in the annular groove portions so that the thin annular plate is sucked against the entire periphery of the openings of the annular groove portions. This configuration prevents the introduction of unwanted oxygen and moisture from the atmosphere into the interior of the processing vessel, and also provides a thermal processing apparatus which has a sealing portion that prevents the emission of gases and moisture at high temperatures.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: March 23, 1999
    Assignee: Tokyo Electron Tohoku Kabushiki Kaisha
    Inventor: Kenichi Yamaga
  • Patent number: 5777300
    Abstract: The present invention comprises a processing furnace for oxidizing object to be processed at a high temperature, pressure reducing means for evacuating the interior of the processing furnace, a burning apparatus disposed outside the processing furnace for burning hydrogen gas and oxygen gas to generate water vapor, a water vapor supply pipe interconnecting the burning apparatus and to the processing furnace, and a throttle disposed on the water vapor supply pipe for generating a pressure difference in the water vapor supply pipe between a side of the burning apparatus and a side of the processing furnace. Stable burning is ensured in the burning apparatus, which makes set oxidation under low pressures possible. It is possible that in place of the throttle, atomization means for atomizing pure water, or a boiling water vapor generating unit, or a microwave water vapor generating unit.
    Type: Grant
    Filed: November 16, 1994
    Date of Patent: July 7, 1998
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Kenji Homma, Koichi Yomiya
  • Patent number: 5750436
    Abstract: An Si.sub.3 N.sub.4 layer is formed on a surface of a wafer, which is an object to be processed, at a high temperature of, for example, 780.degree. C., using a vertical thermal processing apparatus having a reaction tube of a double-wall structure comprising an inner tube and an outer tube in which a predetermined reduced-pressure status is maintained within the reaction tube while a reaction gas comprising, for example, SiH.sub.2 Cl.sub.2 and NH.sub.3 is made to flow from an inner side to an outer side of the inner tube by the action of a first gas supply pipe and first exhaust pipe provided in the thermal processing apparatus. Next, the temperature in the interior of the reaction tube is raised to, for example, 1000.degree. C., a reaction gas comprising, for example, H.sub.2 O vapor and HCl is made to flow from the outer side to the inner side of the inner tube by the action of a second gas supply pipe and second exhaust pipe, and an SiO.sub.2 layer is formed by the oxidation of the surface of the Si.sub.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 12, 1998
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, Kabushiki Kaisha Toshiba
    Inventors: Kenichi Yamaga, Yuichi Mikata, Akihito Yamamoto
  • Patent number: 5697749
    Abstract: The present invention refers to a wafer transfer robot for a wafer boat of a wafer processing apparatus wherein a turntable within a chamber of a turntable apparatus is provided with a prescribed number of stations formed thereon. Each of the stations is provided with protrusions that hold a wafer cassette that is transferred thereto and orientated thereon in such a manner that a base surface thereof is inclined at an angle to the outward direction. Although, while the wafer cassette is being transferred and orientated, it is transferred and orientated reliably with the base surface thereof held horizontal by an elevator apparatus. By providing a loadlock chamber of a rotational configuration, the apparatus of the present invention ensures good sealing, and also ensures that when regions within the apparatus are being evacuated or being filled with an inert gas, they are kept reliably airtight.
    Type: Grant
    Filed: April 11, 1995
    Date of Patent: December 16, 1997
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Katsuhiko Iwabuchi, Eiichirou Takanabe
  • Patent number: 5678989
    Abstract: An object holder is raised, a mount portion is stopped at a middle stop position higher than a lower stop position, and an object of treatment is preheated. Thereafter, the object holder is further raised, the mount portion is stopped at an upper stop position in a processing tube higher than the middle position, and the object is heat-treated. A first temperature sensor for measuring a temperature on the obverse side of the object on the mount portion is located opposite the obverse side. A second temperature sensor for measuring a temperature on the reverse side of the object on the mount portion is located opposite the reverse side. The temperature of the object is detected in accordance with the respective outputs of the first and second temperature sensors.
    Type: Grant
    Filed: June 12, 1996
    Date of Patent: October 21, 1997
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventor: Wataru Okase
  • Patent number: 5671903
    Abstract: The present invention relates to a heat treatment apparatus, specifically a valve device for use in an exhaust system of a low pressure heat treatment furnace, which comprises urging device for urging a valve body in a valve closing direction, and a drive unit for opening/closing the valve body against an urging force of the urging device. An interconnection releasing mechanism is provided between the driving unit and the valve rod of the valve body, the interconnection releasing mechanism connecting both with each other, and releasing their connection in an emergency. Thus, an exhaust system of the low pressure heat treatment furnace is instantaneously shut off in an emergency to prevent reverse flow of exhaust gas into the furnace. An evacuation fine adjustment gap is defined between the periphery of the valve body and that of the valve casing for facilitating evacuation control.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: September 30, 1997
    Assignee: Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Kenji Homma, Hironobu Nishi
  • Patent number: 5662469
    Abstract: The present invention relates to a thermal processing method wherein a cylindrical process tube that has at one end an entrance/exit is provided at the other end thereof with a heat source, and thermal processing is performed on a workpiece which has been brought in from the entrance/exit of the process tube to a prescribed position therein. This thermal processing method and an apparatus therefor is characterized in that, when the workpiece is moved to the prescribed position, it is first moved to a proximity position that is closer to the heat source than the prescribed position, then it is returned therefrom to the prescribed position.
    Type: Grant
    Filed: March 24, 1995
    Date of Patent: September 2, 1997
    Assignees: Tokyo Electron Tohoku Kabushiki Kaisha, Tokyo Electron Kabushiki Kaisha
    Inventors: Wataru Okase, Yasushi Yagi, Satoshi Kawachi
  • Patent number: 5645419
    Abstract: A heat treatment device including a handling chamber that has a carriers feed in/out opening for carriers holding plural sheets of objects to be treated parallelly vertical, a vertical heat treatment furnace for heat treating the objects and a posture changer for swinging the carriers near the carriers feed in/out opening of the handling chamber on a rotational center into a territory of lower sides of the carriers to change the posture of the objects to be treated from the vertical position to the horizontal position. The heat treatment device also has a carriers storage unit disposed above the posture changing means for storing a plural number of posture changed carriers, conveying device for conveying the carriers between the storage unit and the posture changing device and the heat treatment furnace side. Also, provided is a transferrer for transferring the objects-to-be-treated to/from an objects-to-be-treated holder for loading and unloading into/out of the heat treatment furnace side.
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: July 8, 1997
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Tetsu Ohsawa, Hiroyuki Iwai, Hisashi Kikuchi, Shingo Watanabe, Keiji Takano, Tsutomu Haraoka, Ken Nakao
  • Patent number: 5639234
    Abstract: A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and an first air-tight carrier storage chamber for storing the carrier. The treatment apparatus may also have an air-tight second carrier storage chamber. An inert gas supply and exhaust are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. A valve device is provided for the inert gas supply and exhaust.
    Type: Grant
    Filed: September 30, 1994
    Date of Patent: June 17, 1997
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha, both of
    Inventors: Yuji Ono, Katsuhiko Mihara
  • Patent number: 5622639
    Abstract: A heat treating apparatus for mounting objects to be treated on an object-to-be-treated boat (wafer boat) provided on a heat insulating cylinder, and loading the object-to-be-treated boat into a processing vessel for a heat treatment, a temperature detecting sensor is provided in a film depositing area of a relatively large heat capacity, which is a lower part of a gap defined between an inner tube of the processing vessel and an outer tube thereof so as to detect temperatures of those of the objects to be treated located there and control temperatures of the heating unit. Thus heat response is improved, and temperatures of the objects to be treated can be accurately detected.
    Type: Grant
    Filed: July 26, 1994
    Date of Patent: April 22, 1997
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Hirofumi Kitayama, Toshimitu Shibata, Toshiaki Miyaju, Katsushin Miyagi
  • Patent number: 5578132
    Abstract: A heat treating unit for semiconductor processing is adapted to conduct normal pressure high temperature processing and low pressure thermal processing using corrosive gases. The unit includes an inner tube for receiving a boat which carries objects to be processed, an outer tube concentrically disposed outside the inner tube, a cylindrical manifold which has a gas feed port and an exhaust port, and a cap which tightly closes an opening of the manifold. The inner tube, outer tube and manifold are formed of quartz which is heat resistant and corrosion resistant, and these three components are integrally joined together by melting. The interior surface of the cap is provided with a protecting layer which is heat resistant and corrosion resistant. A connection between the cap and the manifold includes a high temperature heat resistant seal in which O-rings are cooled by a cooling system.
    Type: Grant
    Filed: July 5, 1994
    Date of Patent: November 26, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Kenichi Yamaga, Toshiki Kobayashi
  • Patent number: 5571010
    Abstract: An object holder is raised, a mount portion is stopped at a middle stop position higher than a lower stop position, and an object of treatment is preheated. Thereafter, the object holder is further raised, the mount portion is stopped at an upper stop position in a processing tube higher than the middle position, and the object is heat-treated. A first temperature sensor for measuring a temperature on the obverse side of the object on the mount portion is located facing the obverse side. A second temperature sensor for measuring a temperature on the reverse side of the object on the mount portion is located facing the reverse side. The temperature of the object is detected in accordance with the respective outputs of the first and second temperature sensors.
    Type: Grant
    Filed: June 17, 1994
    Date of Patent: November 5, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventor: Wataru Okase
  • Patent number: 5562383
    Abstract: A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region.
    Type: Grant
    Filed: January 5, 1996
    Date of Patent: October 8, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Hiroyuki Iwai, Tamotsu Tanifuji, Takanobu Asano, Ryoichi Okura
  • Patent number: 5554226
    Abstract: While the interior of a reaction vessel is being deaerated by a first vacuum pump, an inert gas is supplied from an upstream side (reaction gas bottle side) of a flow rate control unit (MFC) to a reaction gas supply pipe. Thus, a reaction gas is substituted with the inert gas. A passageway downstream of the MFC is closed and the interior of the pipe is deaerated from the upstream side through a bypass pipe so that a predetermined degree of vacuum is obtained. Thus, the gas substituting efficiency can be improved. The interior of the reaction vessel and the interior of the reaction gas supply pipe are quickly deaerated without an influence of resistance of the MFC. The inert gas substitution process and the deaerating process are repeated for 10 cycles or more.
    Type: Grant
    Filed: March 28, 1995
    Date of Patent: September 10, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Wataru Okase, Masaaki Hasei
  • Patent number: 5551984
    Abstract: A circulation duct with a blow fan and a shutter is provided to form gas flows in a transfer chamber below a heat treatment furnace, and a dust removing filter unit is provided in a blowout port of the circulation gas passage. Three, for example, gas supply pipes with a number of blowout holes are provided on the front side of the filter unit at set heights, and a clean air source is connected to the proximal end of the air supply pipes through an opening/closing valve. Clean gas is fed into the transfer chamber from the clean air source from the start of an unloading of the wafers to the time of the dismounting of the wafers from a wafer boat with the circulation of gas flows in the circulation gas passage stopped. A filter material of the dust removing filter is PTFE, which can reduce the amount of impurities scattered from the dust removing filter that attach on the wafers.
    Type: Grant
    Filed: December 5, 1994
    Date of Patent: September 3, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventor: Takashi Tanahashi
  • Patent number: 5540782
    Abstract: A heat-treating apparatus for heat treating a plurality of objects-to-be-treated (semiconductor wafers) by loading the objects-to-be-treated into a heat treatment vessel having the lower end opened, mounted on a heat-treatment boat vertically spaced from each other, and sealing the opened end includes a heat insulator disposed on the lower end portion of the heat-treatment boat for heat-insulating the interior of the reaction vessel. The heat-insulator includes heat transmission preventing plates of opaque quartz for preventing the transmission of heat rays from a heater, and a support for supporting the heat transmission preventing plates. Thus sufficient heat-insulating effect for a heat-treating operation can be achieved, and stable heat-treatment can be conducted without impairing the function of sealing the heat-insulating unit. Furthermore, particle formation can be prevented, with a result of improved yields of the heat-treatment.
    Type: Grant
    Filed: October 13, 1993
    Date of Patent: July 30, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Katsushin Miyagi, Miyuki Yamahara
  • Patent number: 5533736
    Abstract: Annular groove portions are formed in each of facing surfaces of a sealing portion of a processing vessel that is kept in an atmosphere of a prescribed gas or an atmosphere at a reduced pressure, and a thin annular plate is arranged in such a manner that it is sucked against the entire periphery of the opening portions of the annular groove portions. The annular groove portions are each connected to an exhaust device, and the facing surfaces of the sealing portion are sealed in a gas-tight manner by reducing the pressure in the annular groove portions so that the thin annular plate is sucked against the entire periphery of the openings of the annular groove portions. This configuration prevents the introduction of unwanted oxygen and moisture from the atmosphere into the interior of the processing vessel, and also provides a thermal processing apparatus which has a sealing portion that prevents the emission of gases and moisture at high temperatures.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: July 9, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventor: Kenichi Yamaga
  • Patent number: 5527390
    Abstract: A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and a first air-tight carrier storage chamber for storing the carrier. The treatment apparatus has an air-tight second carrier storage chamber. An inert gas supply pipe and an exhaust pipe are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. An open/close valve and an open/close device are connected to each of the inert gas supply pipes and the exhaust pipes.
    Type: Grant
    Filed: March 14, 1994
    Date of Patent: June 18, 1996
    Assignees: Tokyo Electron Kabushiki, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Yuji Ono, Katsuhiko Mihara
  • Patent number: 5520142
    Abstract: A gap is defined between an inner region of an end face of a first container member of a container and an inner region of an abutting portion of a second container member, the inner regions being situated inside a seal member. The respective inner regions of the end face of the first container member and the abutting portion of the second container member, which are situated inside the seal member, are prevented from coming into contact with each other when the interior of the container is decompressed. Even though the second container member is bent inward by atmospheric pressure when the container is decompressed to a predetermined degree of vacuum, therefore, the abutting portion thereof cannot come into contact with the inner edge of the end face of the first container member.
    Type: Grant
    Filed: March 24, 1995
    Date of Patent: May 28, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventors: Towl Ikeda, Katsumi Ishii, Yoji Iizuka
  • Patent number: 5520742
    Abstract: A heat shielding member is provided on an object-to-be-processed holder for loading/unloading an object to be processed to/from a thermal processing position. The heat shielding member can cover a space below the processing position. As a result, leakage of radiation heat from the processing position can be blocked, and an optimum temperature gradient at the processing position can be maintained. Accordingly the entire surface of the object to be processed can be efficiently thermally processed at uniform temperatures, and throughputs in the fabrication steps can be improved.
    Type: Grant
    Filed: March 1, 1994
    Date of Patent: May 28, 1996
    Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki Kaisha
    Inventor: Wataru Ohkase