Patents Assigned to TOSHIBA ELETRONIC DEVICES & STORAGE CORPORATION
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200075464
    Abstract: According to one embodiment, a semiconductor device includes a semiconductor chip, and a die pad. The die pad has a first surface. The semiconductor chip is bonded on the first surface using a paste including a metal particle. A concave structure is provided in the first surface. The concave structure is positioned directly under each of a plurality of sides of the semiconductor chip and extends along each of the plurality of sides.
    Type: Application
    Filed: March 4, 2019
    Publication date: March 5, 2020
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELETRONIC DEVICES & STORAGE CORPORATION
    Inventors: Hideharu KOJIMA, Yoshiharu Takada