Abstract: In a method for manufacturing a display panel according to an embodiment, a first anisotropic conductive layer is formed by ejecting a first anisotropic conductive layer forming material in order to bond the circuit board to the display panel, a reinforced curing layer is formed by ejecting a reinforced curing layer forming material onto a side surface of the first anisotropic conductive layer, a second anisotropic conductive layer is formed by ejecting a second anisotropic conductive layer forming material to an inner side of the second anisotropic conductive layer and the reinforced curing layer in order to bond the display drive integrated circuit, and a pixel is formed by ejecting a material for pixel printing to an inner side of the second anisotropic conductive layer for fixing the display drive integrated circuit.
Abstract: An inkjet printing method may includes a dot pattern printing process of printing a dot pattern group by discharging ink at a preset position of a surface of an object using a nozzle group for forming a dot pattern so that dropped droplets are not in overlap with each other, a connection pattern printing process of printing a connection pattern group by discharging ink at a position between neighboring patterns using a nozzle group for forming a connection pattern so that the same attractive force acts to the neighboring patterns dropped on the surface of the object, and a finishing printing process of finishing a coating of the surface of the object by discharging ink to an area except for neighboring dropped droplets using a nozzle group for finishing so that the same attractive force act to the dropped droplets that are dropped on the surface of the object.
Type:
Grant
Filed:
February 10, 2021
Date of Patent:
August 8, 2023
Assignee:
UNIJET CO., LTD.
Inventors:
Seog-soon Kim, Hee-jun Han, Se-hyun Sim, Jong-gyun Lee
Abstract: A manufacturing method of a multilayered board, includes: a dot pattern forming process that forms a dot pattern comprising at least one hemispherical micro-lens shape by repeating a process of forming one hemispherical micro-lens shape by jetting one droplet for forming the dot pattern in an inkjet manner; and a stack pattern forming process that forms a stack pattern having a thickness less than that of the micro-lens by jetting a droplet for forming the stack pattern on a predetermined area around the dot pattern in the inkjet manner.
Abstract: A method for printing a micro line pattern using inkjet printing, includes: a bump forming process for forming a micro bump that sections a predetermined conductive pattern by inkjet-printing a quick drying liquid on a substrate; and a pattern printing process for printing a conductive pattern according to the predetermined conductive pattern by inkjet-printing a conductive liquid on an area sectioned by the micro bump.
Abstract: A manufacturing method of a multilayered board, includes: a dot pattern forming process that forms a dot pattern comprising at least one hemispherical micro-lens shape by repeating a process of forming one hemispherical micro-lens shape by jetting one droplet for forming the dot pattern in an inkjet manner; and a stack pattern forming process that forms a stack pattern having a thickness less than that of the micro-lens by jetting a droplet for forming the stack pattern on a predetermined area around the dot pattern in the inkjet manner.