Abstract: A fin structure includes an inlet fin assembly and an outlet fin assembly. The inlet fin assembly includes a plurality of inlet fins arranged side by side, and a first air channel is formed between two of the plurality of inlet fins that are adjacent to each other. The outlet fin assembly includes a plurality of outlet fins arranged side by side, and a second air channel is formed between two of the plurality of outlet fins that are adjacent to each other. The inlet fin assembly is connected to the outlet fin assembly, and the plurality of first air channels are in fluid communication with the plurality of second air channels. A thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly.

Abstract: A fan assembly includes two fan apparatuses and at least one connector. Each of the two fan apparatuses includes a frame, a fan blade and at least one first terminal. The frame has at least one first engagement recess. The fan blade is rotatably disposed on the frame. The at least one first terminal is located in the at least one first engagement recess. The at least one connector includes a first assembly block and two second terminals. The first assembly block includes two first engaging portions connected to each other. The two second terminals are respectively mounted on the two first engaging portions. The two first engaging portions of the first assembly block are respectively engaged with the at least two first engagement recesses of the two frames, and the two second terminals are respectively plugged and electrically connected to the at least two first terminals.

Abstract: A heat dissipation device includes a thermally-conductive base and at least one heat pipe. The thermally-conductive base has a heat absorbing surface, a heat dissipation surface and at least one accommodation hole. The heat dissipation surface faces away from the heat absorbing surface, and the at least one accommodation hole extends from the heat absorbing surface to the heat dissipation surface. The at least one heat pipe is located in the at least one accommodation hole and has a first surface and a second surface which are exposed to outside. The second surface faces away from the first surface, and the first surface and the heat dissipation surface are substantially coplanar and directly connected to each other so as to form a same plane together.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.

Abstract: A fan device includes a fan frame and a fan impeller. The fan frame includes a frame and a shaft seat. The shaft seat includes a shaft tube and a buffer. At least a part of the buffer is clamped between the shaft tube and the frame. The fan impeller is rotably disposed on the shaft tube of the shaft seat. An elastic coefficient of the buffer is larger than an elastic coefficient of the shaft tube.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A heat pipe including a pipe body. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The condensation portion includes a condensation end. The evaporation portion includes an evaporation end. The evaporation end and/or the condensation end are/is in a rectangular shape.

Abstract: A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation plate. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation plate is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.

Abstract: A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.

Abstract: A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.

Abstract: A fan device includes a frame, a stability maintenance assembly, a shaft, an impeller, and a driving assembly. The frame includes a base and a bearing seat protruding from the base and having an accommodation space. The stability maintenance assembly is disposed in the accommodation space and includes a bearing and a magnet arranged coaxially. The bearing is located above the magnet and magnetized by the magnet. The shaft is disposed through the magnet and the bearing. The impeller is fixed to the shaft so as to be rotatable relative to the frame via the shaft and the bearing. The driving assembly includes a stator and a rotor. The stator is sleeved on the bearing seat of the frame, the rotor is mounted on the impeller and surrounds the stator, and the driving assembly is configured to drive the impeller to rotate relative to the frame.

Abstract: A three-dimensional heat transfer device includes a vapor chamber and a plurality of flatten heat pipes. The flatten heat pipes are disposed on the vapor chamber and arranged along an extension direction of a short side of the vapor chamber. Major axes of cross-sections of the flatten heat pipes are parallel to a long side of the vapor chamber.

Abstract: A fan frame assembly includes a first fan frame and a second fan frame. The first fan frame includes a first annular wall part and a plurality of first engagement parts connected to the first annular wall part. The second fan frame includes a second annular wall part and a plurality of second engagement parts connected to the second annular wall part. Each of the first engagement parts has a positioning structure extending along an axial direction of the first annular wall part, and each of the second engagement parts has a positioning structure extending along the axial direction of the first annular wall part. when the first engagement parts and the second engagement parts are respectively engaged with each other, the positioning structures of the second engagement parts are positioned by the positioning structures of the first engagement parts.

Abstract: A blade structure with multiple blade angles and a heat dissipation device include: the blade structure consisting of a plurality of blades with different blade angles. The blade angles of the blades decrease from an inner side to an outer side along a longitudinal direction of the blade structure. The blades have top portions on the same surface and are integrally formed in one piece. A joint between the blades has a transition part. The blade structures are evenly mounted on the hub and are connected to an outer frame. The hub and the blade structures are integrally formed in one piece, or the hub, the blade structures, and the outer frame are integrally formed in one piece. The blade structures can guide air flow to reduce air shedding, suppress backflows, reduce vortex turbulence, increase air volume, improve heat dissipation efficiency, and reduce vortex noise and vibration.

Abstract: A fan frame assembly includes a first fan frame and a second fan frame. The first fan frame includes a first annular wall part and a plurality of first engagement parts connected to the first annular wall part. The second fan frame includes a second annular wall part and a plurality of second engagement parts connected to the second annular wall part. Each of the first engagement parts has a positioning structure extending along an axial direction of the first annular wall part, and each of the second engagement parts has a positioning structure extending along the axial direction of the first annular wall part. when the first engagement parts and the second engagement parts are respectively engaged with each other, the positioning structures of the second engagement parts are positioned by the positioning structures of the first engagement parts.

Abstract: A method for manufacturing a roll-bond heat exchanger has steps of: (1) A preparing step: preparing an in-process roll-bond plate that has a main plate with a bulged structure, and a degassing portion with a tube; (2) A degassing step: removing air from the bulged structure through the tube; (3) A filling step: filling refrigerant into the bulged structure; (4) A pressing step: pressing the bulged structure flat to form a pressed portion; (5) A cutting step: cutting the degassing portion to form a cut portion on the main plate; and (6) A sealing step: welding the cut portion. The main plate and the degassing portion are integrally formed as a single part and the degassing portion is able to be directly connected with the vacuum filling machine. Accordingly, processing steps and manpower for manufacturing the roll-bond heat exchanger are reduced.

Abstract: A light emitting fan includes a frame, a circuit board, an impeller, a decorative board, a light emitting component, and a light guiding component. The circuit board is disposed on the frame. The impeller includes a hub and blades connected to the hub. The insertion hole has an end connected to an outer top surface of the hub and extends towards the circuit board. The decorative board is fixed to the frame and located farther away from the circuit board than the outer top surface of the hub. The light emitting component is disposed on the circuit board. The light guiding component is inserted into the insertion hole of the hub. Light emitted by the light emitting component is incident on the decorative board via the light guiding component.

Abstract: A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation structure. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation structure is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.

Abstract: A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions.