Abstract: An apparatus for the gas-phase processing of disk-shaped workpieces serves for maintaining cleanliness of the processing space and the workpiece or for avoiding deposits on parts of the workpiece which are not inteded to be coated. In particular a second inner wall system, which is permeable to gas, is provided for the aforementioned purposes. This second inner wall system is associated with a flushing gas system.
Abstract: The invention relates to a drive mechanism for a wire bonding apparatus for large bonding regions, for connecting to bonding loci by means of wire bridges.The inventive drive mechanism is comprised of a drive motor (1) coupled to a first angle lever (2) and connected to a bonding head (9) via a bearing (8) in combination with a carrier piece (7), wherein said bonding head (9) is movable in the z-direction in a guide bushing (10). A second angle lever (14) guided by a mechism kinematically dsimilar to those for angle lever (2) is connected to a second drive motor (13) and couples the following three structures to the drive motor: an optical objective (32) vertically movable in a second guide bushing (29), a ratio device (27), and a sliding piece (24) which engages a lever (39) which lever is attached to the generator (12).
Abstract: The invention relates to a positioning device for the production of semiconductor components, particularly for wire bonding apparatuses, which positioning device is comprised of a cross table and separate x-direction and y-direction drive units.According to the invention, the two drive units, each comprised of a drive motor with an excursion measuring system (1; 17) affixed to the frame via a support plate (2; 18) are disposed in a parallel orientation. Each support plate (2; 18) also bears a bearing (3; 19) for a drive spindle (5; 20). A drive nut (6; 22) is disposed on the drive spindle (5; 20), where the nut is nonrotatably fixed. A vertical bearing (8) is mounted on the support plate (2), which bearing bears two adjustable levers (9, 11) oriented at a mutual 90.degree. angle, wherein the lever (9) is connected to the drive nut (6), and the lever (11) is connected to a x-direction guide a mechanism.
December 8, 1987
Date of Patent:
April 18, 1989
VEB Elektromat Dresden
Horst Podeschwa, Joachim Gerard, Wolfgang Schoepe
Abstract: The invention relates to an apparaus for ultrasonic wire bondings whereby the contact loci can be connected by wire straps, by means of ultrasonic welding, e.g. for connecting terminals on component mounts or the like to bonding islands on semiconductor chips. The inventive apparatus has means for combined axial and radial guiding of the rotatable bonding head, with low overall mass of the vertically movable parts and low moment of inertia around the rotational axis. As a result of the inventive disposition of the microscope objective, the object distance to the component can be set directly via the controllable vertical drive of the bonding head.
Abstract: The invention relates to an apparatus for ultrasonic wire bonding, whereby bonding loci can be interconnected by wire straps, by means of ultrasonic welding; in particular an apparatus in which bonding wire is guided and handled. According to the invention the bar (3) bearing the bonding head (2) has a longitudinal passage (4) in the direction of the ultrasound generator (35), which passage accommodates a guide tube (5) the upper end of which extends vertically upward out of the flange (6), near the rotational axis, and the lower end of which tube exits the bar (3) on an incline, in the outward direction, in the region of the mounting of the bonding head. A deflecting element (24) for the wire (40) is disposed above the upper end of the guide tube (5) and is not coupled with the rotational movement. The fact that the supply reel is mounted at a fixed location enables the employment of all customarily used type of reels, associated mounting means, and auxiliary elements for withdrawing the wire.