Abstract: A micro-manipulator machine for harvesting and cryofreezing crystals for cryogenic storage and subsequent analysis includes a micropositioner mechanism for converting motions manually input to a position control knob to fractionally-scaled motions of a follower mechanism which includes a tool head support arm and tool head that releasably holds a filamentary polymer cryoloop for immersion into a liquid crystal growth media and extraction of a liquid drop containing a selected crystal from the media. A first automatic actuator mechanism orbits the tool head support arm, tool head, cryoloop, liquid drop and harvested crystal from a harvesting location to a retrieval location when the micropositioner input control arm has been moved manually away from the crystal harvesting location by the operator after extracting a crystal drop, and a second automatic actuator mechanism pivots the toll head into a flowing stream of a cryogenic gas to freeze the liquid drop and crystal.
Abstract: A method and apparatus for confirming whether wire bonds are successfully made to sites on a workpiece by an ultrasonic bonding tool using wire supplied to an entrance bore through the tool from a despooling wire supply spool, and for providing a fault detection status signal if bonds are not successfully made, utilizes an automatic wire despooler which includes a spool drive motor for rotating a wire supply spool to thereby pay out wire from the supply spool to form a drooping catenary-shaped length of slack wire, located between the spool and an output wire guide having an aperture through which wire is supplied to a bonding machine head that supports an ultrasonic bonding tool. The apparatus includes a proximity-type feed sensor for detecting when the catenary straightens and shortens a predetermined amount in response to tension caused by moving the tool tip between successive bond sites, thereby drawing wire out through an exit opening of the bonding tool bore.
Abstract: An automatic ultrasonic wire bonding machine for bonding interconnecting wires to electrically conductive sites on a workpiece includes a gantry which supports a generally downwardly cascaded series of support platforms linearly translatable with respect to the gantry and to one another in response to translation drive signals provided from a remote source to a separate translation motor for each platform. A head support assembly mounted to the last translatable platform in the series rotatably supports via a hollow elongated spindle an orbital bonding tool head rotatable with respect to the head support assembly in response to a rotational drive signals provided to a head rotation motor from a remote source.
Abstract: A machine for automatically making ultrasonic bonds between metallic conductors using a metal bonding wire precisely positions the tip of an ultrasonic bonding tool relative to a workpiece with a positioning mechanism which includes a first, upper tool support platform rollably supported by a support structure and translatable in a first direction with respect to the support structure by a first remotely operable drive motor, at least a second tool support platform rollably supported by the first tool support platform and translatable with respect thereto in a second direction by a second drive motor, and preferably, a third, end tool support platform rollably supported by the second tool support platform and translatable with respect thereto by a third drive motor.
Abstract: An improved apparatus and method for forming a fusion ball at the end of a wire protruding from an ultrasonic bonding tool preparatory to making a ball bond to a workpiece includes shielding means for attenuating electromagnetic interference (EMI) emissions from an electrical arc discharge used to form the ball, which EMI emissions may damage sensitive electronic circuitry on a workpiece. In a preferred embodiment, a ball-forming arc discharge to a wire end occurs with a spark chamber in an electrically conductive electrostatic shield and preferably includes a ferromagnetic shield cup surrounding the chamber. According to the method of the present invention, a capillary ultrasonic bonding tool having a severed end of a gold bonding wire protruding from a capillary bore through the tool is moved away from a vertical line of action between the tool and a workpiece.
Abstract: A micropositioner affording the ability to precisely move the tip of an ultrasonic bonding tool relative to a miniature workpiece such as a microcircuit includes a pantograph-like input manipulator mechanism coupled by a single ball joint coupling to a follower mechanism which supports an ultrasonic transducer support housing from which a transducer and bonding tool attached thereto protrudes. In the preferred embodiment, the input manipulator includes a longitudinally outwardly protruding control arm having a control knob at the outer longitudinal end thereof, for grasping between the thumb and fingers of a human operator. The control arm is coupled to the outer lateral end of a four-bar parallelogram linkage comprising part of a pantograph mechanism, while the inner lateral end of the pantograph mechanism is pivotably connected through vertically and horizontally disposed pivot support bearings to a support structure.
Abstract: An alignment method for ultrasonic wire bonders of the type using capillary ball type and wedge type bonding tools utilizes a bonding tool construction having an elongated shank angle obliguely At any desired azimuthal angle from the lower working face of a tool tip. This angular offset allows a workpiece to be positioned laterally to place a desired wire bond site on an integrated circuit or other such workpiece in precise alignment with a target image in the field of view of a television camera or other optical imaging device viewing the location of a desired bond site along the line of action of the tool tip. Because of the angular offset construction of the bonding tool, the line of site of the imaging device is coincident with the line of action of the tool tip eliminating parallax errors and permitting viewing of the bond site continuously during motion of the tool tip along its line of action.
Abstract: A de-spooler apparatus for paying out fine wire from a spool of wire, for use in wire bonding machines, maintains a relatively constant slack length of wire within the apparatus, thereby allowing wire to be drawn from the machine as needed with a minimum amount of tension exerted on the wire. The apparatus includes a spool drive motor for paying out wire from a spool, a hairpin-shaped bail for containing a slack length of wire, and a nozzle for directing a stream of pressurized gas downwards into the open end of the bail, causing wire within the bail to form a curved slack length. The apparatus also includes a proximity-type feed sensor for detecting when the slack length straightens and shortens a pre-determined amount, bringing the slack length into the detection range of the feed sensor, which outputs an electrical signal that causes the drive motor to rotate in a forward sense, paying off wire from the supply spool and increasing the slack length.
Abstract: An improved tool for ultrasonic wire bonding, and a novel method by which the tool may be semi-automatically threaded with bonding wire are disclosed. The overall exterior shape of the tool is that of an elongated rectangular cross-section bar having at the lower end thereof a tapered, smaller cross-section tip. The tip includes a flattened front toe section for applying ultrasonic energy to wire and a bonding pad, and an upawardly angled oblique lower face rearward of the toe section. A wire guide hole through the tip that has a longitudinal axis that slopes upward at a steeper angle than the oblique lower face has an exit opening in the lower oblique face, just rearward of the front toe section. The guide hole has an enlarged opening in the rear face of the tip. An elongated straight shallow groove formed in a side wall of the tip extends obliquely downwards from the rear face to front face of the tip.