Abstract: Provided are a method for cutting silicon rod and an apparatus for diamond multi-wire cutting, the method for cutting silicon rod includes: using a cooling pipe to supply cutting fluid to the diamond wire, and using the diamond wire to cut the silicon rod, wherein the distance between the supply position of the cutting fluid and the periphery of the silicon rod is 10-20 mm; or adjusting the new wire running amount and/or feed speed at different positions of the crystal cross section during the cutting process.

Abstract: A control method of a grinding water flow rate during a double side grinding process. A double side grinder used includes a grinding wheel, a feed unit and a water supply device, wherein a water inlet is disposed on the feed unit. The control method includes: prepare for grinding and complete the installation of a workpiece according to an operation procedure of the double side grinder; during a process of double side grinding, the flow rate of the water inlet is set to decrease with the shortening of the teeth length of the grinding wheel, with the flow rate of the water inlet being set to have a linear relationship with the teeth length of the grinding wheel.