Abstract: A method of fabrication of a laminated glazing unit, includes cutting out a first through-hole in a first glass sheet; positioning a conducting wire and a film of thermoplastic polymer between the first glass sheet and a second glass sheet so that a first extremity and a second extremity of the conducting wire extend outside the laminated glazing unit to be formed, and feeding out the first extremity of the conducting wire via the first through-hole so that the first extremity exits the laminated glazing unit to be formed via the first through-hole, the conducting wire extending continuously from the first extremity to the second extremity, and after the positioning and feeding out, assembling the conducting wire, the film of thermoplastic polymer, the first glass sheet and the second glass sheet all together to form the laminated glazing.

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A component supply device includes a transport path that guides a component connected body from a component insertion port on an upstream side in a component feeding direction to a component supply position on a downstream side, the component connected body including a plurality of axial components arranged and connected at a predetermined pitch, the plurality of axial components each having a lead, and a feed mechanism that pitch-feeds the component connected body along the transport path to the downstream side. The feed mechanism includes a feed member which has a plurality of feed hooks disposed at the predetermined pitch along the component feeding direction, a rotating shaft which is connected to one end side of the feed member, and a moving mechanism which is connected to the feed member through the rotating shaft and reciprocates the rotating shaft along the component feeding direction.

Abstract: A method of fabricating an ultrasonic medical device is presented. The method includes machining a surgical tool from a flat metal stock, contacting a face of a first transducer with a first face of the surgical tool, and contacting a face of a second transducer with an opposing face of the surgical tool opposite the first transducer. The first and second transducers are configured to operate in a D31 mode with respect to the longitudinal portion of the surgical tool. Upon activation, the first transducer and the second transducer are configured to induce a standing wave in the surgical tool and the induced standing wave comprises a node at a node location in the surgical tool and an antinode at an antinode location in the surgical tool.

Abstract: In a method for manufacturing a rotor, each of adhesive placement portions that are provided between a surface of a permanent magnet on the radially inner side and grooves is formed so as to cover a part of an adhesive applied to the permanent magnet on the radially inner side and parts of the adhesive on both sides in the circumferential direction.

Abstract: A crimping tool exchange device exchanges a first crimping tool for a second crimping tool, wherein each crimping tool, when at a processing position in a crimping press, produces a crimp connection connecting a conductor end of a cable to a crimp contact. The device includes first and second exchange units retaining the first and second crimping tools respectively. When one of the exchange units is arranged in an exchange position the retained crimping tool can be moved in a first direction between the processing position and the one exchange unit. The first exchange unit is moved linearly from the exchange position in a second direction, and the second exchange unit is moved linearly from the exchange position in a third direction that is different from the second direction, the second direction being at an angle relative to the third direction.

Abstract: A system is provided for wire processing. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing.

Abstract: Fabrication of superconducting devices that combine or separate direct currents and microwave signals is provided. A method can comprise forming a direct current circuit that supports a direct current, a microwave circuit that supports a microwave signal, and a common circuit that supports the direct current and the microwave signal. The method can also comprise operatively coupling a first end of the direct current circuit and a first end of the microwave circuit to a first end of the common circuit. The direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a capacitor. Alternatively, the direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a bandpass circuit. Alternatively, the microwave circuit can comprise a capacitor and the direct current circuit can comprise one or more quarter-wavelength transmission lines.

Abstract: A method of manufacturing an armature coil includes steps of arranging a plurality of coil conductors of the armature coil between an end metal die and a back portion metal die on a lower metal die; pressing, with the upper metal die in a pressing direction, the plurality of the coil conductors arranged between the end metal die and the back portion metal die on the lower metal die; and removing coil conductors that become formed in a convex shape and a concave shape from the lower metal die. The upper metal die may be provided with an inclined portion on a lower metal die side of the upper metal die, and the upper metal die may be configured to be pressed such that a space is formed by the dies, the space having a width that gets gradually narrower.

Abstract: A method of fabricating an inductor includes (a) forming a ferromagnetic core on a semiconductor substrate, the ferromagnetic core lying in a core plane and (b) fabricating an inductor coil that winds around the ferromagnetic core, the inductor coil configured to generate an inductor magnetic field that passes through the ferromagnetic core in a first direction parallel to the core plane. While forming the ferromagnetic core, the method further includes (1) generating a bias magnetic field that passes through the ferromagnetic core in a second direction that is orthogonal to the first direction, and (2) inducing a magnetic anisotropy in the ferromagnetic core with the bias magnetic field.

Abstract: Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

Abstract: A lifting structure in the form of a release hook configured to conveniently and easily release computer components from their supporting structure by a simple pivoting action in response to lifting of thumbscrews. A typical computer component would be a PCIe card within a GPU tray. The lifting structure does not require the use of tools to release the computer components, and can be used where computer components ordinarily cannot be released by human fingers due to limitations of space. The lifting structure lifts the computer component to a height where the computer component can then be easily grasped by human fingers for removal of the component.

Abstract: A hand crimp tool includes a handle having upper and lower handles having upper and lower handgrips hand squeezed to close the hand crimp tool. The hand crimp tool includes a head having upper and lower jaws defining a crimp zone therebetween. The lower jaw includes an anvil holding a terminal and the upper jaw includes a crimper crimping the terminal. The hand crimp tool includes a wire inserter coupled to the head having a carriage movable between an advanced position and a retracted position. The wire inserter has a wire clamp holding a wire in the carriage and the wire inserter moves the wire relative to the head to position and hold the wire in the terminal during crimping of the terminal between the anvil and the crimper.

Abstract: An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

Abstract: In a coil forming device, an edge line in an escape region is formed so that a clearance between the edge line in the escape region and a recess portion in an axis direction is larger than a minimum clearance between the edge line in an inclined region and the recess portion in the axis direction. When a second die is rotated relative to a first die in the clockwise direction the flat-square conductive material end is bent in flatwise bending by the recess portion and the inclined region of a protrusion portion, and then, the flat-square conductive material end reaches the escape region.

Abstract: An apparatus is provided relating to the insertion of one or more wires into a cavity of a fixture of a structure or component. The wire insertion apparatus includes a grommet, a gripper adapted to interface with the grommet, and at least a first vibrating element. The first vibrating element is connected to and vibrates one or more of the apparatus, the grommet, the gripper, the wire, and/or a component of the apparatus. Vibration, induced in any direction, enables the cavities to shift position during insertion relative to the contact, thus increasing the tolerance of the cavity, reducing the failure rate of wire insertion, and reducing total production time. The vibration breaks the static friction of the contact in the grommet or dielectric opening, creates the positive locating required to insert the contact in the grommet and/or dielectric, and/or pivots the contact.

Abstract: One or more embodiments are directed to methods of forming one or more cantilever pads for semiconductor packages. In one embodiment a recess is formed in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

Abstract: A component mounting system has a supply reel accommodating a component, a plurality of mounting lines each having a mounting apparatus and a line management apparatus, and a central network that provides direct communication between the line management apparatuses of each mounting line. A remaining number of components on the supply reel is determined based on cross line communication between the line management apparatuses and comparison of data at different times stored on the line management apparatuses. Such architecture does not require the use of a central server. Rather, the system is a material information exchange system without a single point of failure, where no one computer failure can cause an entire factory shutdown.

Abstract: There is provided technology which is a component mounting machine which mounts electronic components onto a circuit substrate and is capable of displaying a movable region of an inner portion of the component mounting machine within a same image. The component mounting machine is provided with a fixed camera which monitors the inner portion of the component mounting machine and a display section which is capable of displaying a captured image of the fixed camera. The fixed camera is capable of imaging a range from a pickup position at which the suction nozzle picks up the electronic component which is supplied from the component feeder to a mounting position at which the electronic component is mounted onto the circuit substrate within the same image.

Abstract: A tool is provided for shaping contact tab interconnects at a circuit card edge. The tool includes a base member with a slot to receive a circuit card edge. The slot is sized such that the edge of the circuit card is slidable lengthwise within the slot. The tool further includes shaping dowels disposed within the base member, including at least two shaping dowels that define a set of adjacent shaping dowels extending at an angle relative to each other. The set of adjacent shaping dowels are exposed, at least in part, within the slot so that with lengthwise sliding of the edge of the circuit card within the slot, the edge of the circuit card contacts and slides across the set of adjacent shaping dowels rounding off, at least in part, ends of the contact tab interconnects at the edge of the circuit card.