Patents Examined by Adrian L. Coley
  • Patent number: 5768770
    Abstract: Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 23, 1998
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Ismail Cevdet Noyan, Michael Jon Palmer
  • Patent number: 5740607
    Abstract: In order to reemploy the centering strips when equipping wiring backplanes with contact blades, the contact blades (2, 12) have their press-in zones introduced into a blade holder (1, 11) serving as a centering strip, being introduced thereinto in attitudinally correct allocation to one another. The contact blades (2, 12) introduced into the blade holder (1, 11) are pressed into the wiring backplane (5, 15) from the blade holder (1, 11) with a press-in die (7, 17) and the blade holder (1, 11) is pulled off from the contact blades (2, 12) when the press-in die (7, 17) is retracted.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: April 21, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Karl Zell, Peter Seidel
  • Patent number: 5718038
    Abstract: An electronic assembly for connecting to an electronic system is disclosed which includes, in one embodiment, a connector having a group of contacts, each contact having a mating portion and an interconnect finger. A first circuitry module includes a group of leads providing a signal path to electronic components contained therewithin, wherein each of the leads is coupled directly to an interconnect finger of a corresponding one of the group of connector contacts. A protective body is rigidly coupled to the first connector and is formed to encase the first circuitry module and to provide support and protection to the circuitry module. In another embodiment suitable for a PCMCIA card assembly, each of a group of leads of a leaded chip-carrier module is directly connected to interconnect fingers of the connector.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 17, 1998
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: 5713119
    Abstract: A tool for installing the planetary assembly and reverse clutch assembly of an automatic transmission as a combined assembly therein. The tool includes an elongated tubular handle extending along a longitudinal axis having a first end and an opposed second end. A grip assembly is formed at the first end of the handle. The grip assembly has a handle extension fastened to the first end of the handle and extending away from the handle along the longitudinal axis, and a pair of spaced fingers positioned at the free end of the handle extension, the fingers being spaced about the longitudinal axis of the tool and extending in a direction transverse to the length of the tool. The fingers of the tool are adapted to engage a groove defined in the hub of the front planetary assembly so that the combined reverse clutch assembly and planetary assembly can be simultaneously installed in the automatic transmission of an automobile.
    Type: Grant
    Filed: June 30, 1995
    Date of Patent: February 3, 1998
    Inventor: Richard Lagatta
  • Patent number: 5694680
    Abstract: To provide wire laying method and apparatus which realize high utilization of a wire laying space by pressing a plurality of wires one over another in a wire groove formed in an insulating plate, wires 2A to 2C drawn from a wire laying head 5 are, while being inserted into a wire groove 1a using a natural bend R, forcibly pressed to specified depths by a pressing pin 11 in synchronism with the movement of the wire laying head 5.
    Type: Grant
    Filed: August 14, 1995
    Date of Patent: December 9, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Takayuki Yamada, Hiroshi Rokutani, Nori Inoue
  • Patent number: 5692297
    Abstract: For soldering a terminal (14) to a land (13) formed on an FPC (12) made of a material having a softening point below 230.degree. C., such as PET, by using a flow soldering or reflow soldering technique, an opening (17) larger than the land (13) is formed in a thermal insulation holder (11) including a phenolic paper base copper clad laminate board or the like so that the land (13) and the terminal (14) are within sight, and the thermal insulation holder (11) is held in contact with a surface of the FPC (12) to which solder is applied so that the land (13) and the terminal (14) are located within the opening (17) to perform the soldering using the flow soldering or reflow soldering technique, whereby molten solder readily reaches the land (13) through the opening (17) which need not be worked into a conventional trapezoidal configuration in vertical section, thereby preventing poor soldering. (FIG.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: December 2, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Haruo Noda
  • Patent number: 5687478
    Abstract: Disclosed is a modular jack having a first plurality of wires which extend in a common vertical plane from the bottom wall of the housing across the opened end and to the top wall and then extend horizontally forward and then angularly downwardly and rearwardly back toward the rear opened end. A second plurality of wires extends first in a common vertical plane from the bottom wall across only a part of the rear opened end and then extends obliquely, horizontally and upwardly toward the front opened end. A method of use is also disclosed.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: November 18, 1997
    Assignee: Berg Technology, Inc.
    Inventor: Yakov Belopolsky
  • Patent number: 5685067
    Abstract: A crimp terminal is supplied to a predetermined crimping position. Into the barrel of the supplied terminal, the wire end of an insulated conductor is inserted. At that time, the cable conductor end is aligned in the desired proper position for crimping. Even when the cable conductor end is deformed or broken in the stripping or supply processes, all the cable conductor ends can be reliably accommodated in the barrel of the terminal. Accordingly, it is possible to prevent crimping defects caused by exclusion from the terminal of one or more wire ends.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: November 11, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Eiji Fudoo
  • Patent number: 5682673
    Abstract: A mold is provided for use in encapsulating integrated circuit (IC) dies attached to die attach pads of lead frames, wherein the mold has one or more support elements in cavities of the mold for supporting the die attach pad portions of the lead frame while the mold is closed on the lead frame and encapsulation material is injected to encapsulate the IC dies and die attach pads. The support elements are, in a preferred embodiment, pins extending from the surfaces of the cavities in the mold, and the pins keep the die attach pads from moving into contact with surfaces of the cavities, so die attach pads or dies are not exposed in finished packages. In a preferred embodiment the pins each are tapered in the extended portion, so the amount of exposure of the die attach pad is absolutely minimized. In another embodiment, the support elements are retractable.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: November 4, 1997
    Assignee: IPAC, Inc.
    Inventor: Gerald K. Fehr
  • Patent number: 5678304
    Abstract: A method for manufacturing double-sided circuit assemblies by a surface mount process includes the steps of: arranging the circuit assemblies in arrays so that two or more circuit assemblies, at least one top side up and at least one bottom side up, are provided in each array; populating one side of the circuit assemblies in a first pass of the arrays through the surface mount process; flipping each array over; and populating the other side of the circuit assemblies in a second pass of the flipped arrays through the same surface mount process with no changes in stencil, placement program, or components.
    Type: Grant
    Filed: July 24, 1996
    Date of Patent: October 21, 1997
    Assignee: Eastman Kodak Company
    Inventor: Jay B. Soper
  • Patent number: 5678287
    Abstract: Polymer (preferably polyimide) sheets with laser ablated through-holes plated with metal are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4-4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: October 21, 1997
    Assignee: Raychem Limited
    Inventors: Nicholas J. G. Smith, Michael Joseph Ludden, Peter Nyholm, Paul James Gibney
  • Patent number: 5673476
    Abstract: An anode bonding method for bonding a first substrate and a second substrate, both of which have a recessed portion, includes the steps of heating the first and second substrates in a stacked state; and bonding the substrates by applying a voltage between the substrates.
    Type: Grant
    Filed: November 22, 1995
    Date of Patent: October 7, 1997
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masatake Akaike, Takayuki Yagi, Masahiro Fushimi
  • Patent number: 5671526
    Abstract: Fast and economic process to prepare, without waste, E-I or U-I shaped transformer cores consisting of laminations (1, 2-9,10) that are directly stacked during blanking and are permanently jointed by punched zones (5,5'). Each free end of the E (1) or U (9) shaped laminations has a profile, snap-joint matching the profile (4,4') of the lamination in front of it (2,2) so as to permit their rigid fixing. The laminations are obtained from a steel strip (11) using a discontinuous feed cutting machine from one processing station to the next.
    Type: Grant
    Filed: March 2, 1995
    Date of Patent: September 30, 1997
    Assignee: Tranceria Ligure S.R.L.
    Inventor: Alessandro Merlano
  • Patent number: 5671528
    Abstract: An anvil (5) has a receiving surface (20) to receive an electrical terminal (4) and a punching hole (6) penetrating through the anvil (5) with an opening in the receiving surface (20). A crimper (2) has a curved surface to crimp the terminal (4). An auxiliary punch (8) has a protrusion (7) that can pass through the punching hole (6) to extend from the opening in the receiving surface (20). A wire core portion (25) is crimped to the electrical terminal (4) between the crimper (2) and the anvil (5). Then, the auxiliary punch (8) strikes out a crimped portion (21) to form a concave portion (27) in the state that the crimped portion (21) is compressed by the crimper (2) and the anvil (5).
    Type: Grant
    Filed: February 9, 1996
    Date of Patent: September 30, 1997
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Yuji Hatagishi
  • Patent number: 5666721
    Abstract: A lead 20 protrudes from a main body 19a of a connector 18. A connector electrode 13 extends along a surface 10a of a printed circuit board 10. A solder paste 26, applied onto the connector electrode 13, is offset a predetermined distance inward from the edge of the printed circuit board 10. The lead 20 is shifted along the surface of connector electrode 13 inwardly from the edge of the printed circuit board 10 until a distal end 20a of the lead 20 is brought into contact with the solder paste 26. Then, the solder paste 26 is melted under the condition where the distal end 20a is brought into contact with the solder paste 26, thereby soldering the connector 18 on the printed circuit board 10.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: September 16, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Shoji Sakemi
  • Patent number: 5666720
    Abstract: An apparatus for stuffing a snailed endless new pre-inked ribbon into a ribbon cartridge is provided, said apparatus comprising a cabinet having a top plate mounted thereon, a ribbon stock reel assembly mounted on the top plate for supporting a new pre-inked ribbon supply reel containing a length of new pre-inked ribbon, a ribbon stock reel brake assembly mounted in the cabinet and attached to the ribbon stock reel assembly, an idler with an adjustable collar for providing tension on the new pre-inked ribbon between the new pre-inked ribbon supply reel on the ribbon stock reel assembly and a counting wheel, a counting wheel, a proximity sensor, an electrical motor for pulling the new pre-inked ribbon from the ribbon stock reel assembly past the idler around the counting wheel and stuffing said new pre-inked ribbon into a ribbon cartridge, a universal jig having cartridge securing means for holding the ribbon cartridge to be stuffed mounted on the top plate, a programmed counter, a control panel having a main
    Type: Grant
    Filed: June 26, 1995
    Date of Patent: September 16, 1997
    Inventor: Larry Smith
  • Patent number: 5664326
    Abstract: In a terminal receiving chamber made of a connector housing of synthetic resin, the metal terminal is retained by the flexible holding strip disposed in the connector housing, the retaining portion of the metal terminal abutting against a retaining projection of the flexible holding strip includes an end part of a laminated plate portion formed by folding a rolling thin plate portion.
    Type: Grant
    Filed: February 21, 1996
    Date of Patent: September 9, 1997
    Assignee: Yazaki Corporation
    Inventor: Hideki Ohsumi
  • Patent number: 5658345
    Abstract: The acetabulum (1) in accordance with the invention comprises a spherically formed outer shell (3) as well as a spherically formed inner shell (4) which is inserted into the outer shell (3). The inner shell (4) can, for example, consist of an oxide-ceramic material, in particular of aluminum oxide. The outer shell (4) can consist of, for example, titanium. The outer surface (4c) of the inner shell (4) is formed such that it has a first partial surface (4c) with increasing outer cross-section from the pole (2a) towards the equatorial opening (4b) to a site (4a) with a largest outer diameter, that a further partial surface (4e) with an outer cross-section decreasing towards the equatorial opening (4b) connects to the partial surface (4c), which goes into a further partial surface (4f) with increasing outer cross-section towards the equatorial opening.
    Type: Grant
    Filed: July 11, 1995
    Date of Patent: August 19, 1997
    Assignee: Sulzer Medizinaltechnik AG
    Inventor: Roland Willi
  • Patent number: 5655294
    Abstract: To facilitate the insertion of a metal terminal with a waterproof seal into a cavity, a tool is provided with a stepped tubular portion and a grip portion connected to the tubular portion. The stepped tubular portion has, in one embodiment, four cylindrical portions having different outer diameters, and the outer diameters decrease stepwise toward a distal end of the tubular portion. A slit is formed in the tubular portion and extends from the distal end thereof into the fourth cylindrical portion. The slit has a width so as to allow a wire to pass therethrough. With this construction, the distal end of the cylindrical portion can easily push the waterproof seal without deformation.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: August 12, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Hirotaka Makino
  • Patent number: 5655295
    Abstract: A method of manufacturing a lead-provided porous metal sheet comprises the steps of: forming a porous metal material having a metal layer on a surface of a framework of a porous base material comprising a foamed sheet and the like, by plating the porous base material and/or applying fine metal powders thereto; passing the porous metal material through a pair of rolls having a plurality of projections formed thereon to compress the porous metal material against the projections and reduce or eliminate pores so as to form one or more recesses extending; and forming solid metal portions by applying fine metal powders to the entire recesses.
    Type: Grant
    Filed: May 10, 1995
    Date of Patent: August 12, 1997
    Assignee: Katayama Special Industries, Ltd.
    Inventor: Hirofumi Sugikawa