Patents Examined by Akm E. Ullah
  • Patent number: 10598967
    Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: March 24, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Donald Adams, Prakash B. Gothoskar, Vipulkumar Patel, Mark Webster
  • Patent number: 10591804
    Abstract: A plug-and-play fiber-coupled nonlinear optical quantum wave-converter, optimized for quantum communications, comprises a commercial periodically-poled, waveguide-based, nonlinear optical chip, coupled with a pair of substrate-guided holographic (SGH) wavelength division multiplexers (WDM) and a pair of SGH filters; it offers bidirectional difference frequency conversion (DFG) and sum frequency conversion (SFG) simultaneously in a single packaged device.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: March 17, 2020
    Assignee: Luminit LLC
    Inventors: Jun Ai, Fedor Dimov, Xiaowei Xia, Selim Shahriar, Russell Kurtz, Chris Griffo
  • Patent number: 10591678
    Abstract: An optical connector includes a first sub-assembly that is factory-installed to a first end of an optical fiber and a second sub-assembly that is field-installed to the first end of the optical fiber. The optical fiber and first sub-assembly can be routed through a structure (e.g., a building) prior to installation of the second sub-assembly. The second sub-assembly interlocks with the first sub-assembly to inhibit relative axial movement therebetween. Example first sub-assemblies include a ferrule, a hub, and a strain-relief sleeve that mount to an optical fiber. Example second sub-assemblies include a mounting block; and an outer connector housing forming a plug portion.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: March 17, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Julian S. Mullaney, Eric Emmanuel Alston, William Alan Carrico
  • Patent number: 10578800
    Abstract: Various embodiments of a photonic integrated circuit (PIC) are described herein. A PIC, functioning as a coherent receiver, may include optical components such as an optical coupler, a directional coupler, a beam splitter, a polarizing beam rotator-splitter, a variable optical attenuator, a monitor photodiode, 90-degree hybrid mixer, and a waveguide photodiode. The PIC may also include electrical components such as an electrode, a capacitor, a resistor and a Zener diode.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: March 3, 2020
    Assignee: SIFOTONICS TECHNOLOGIES CO., LTD.
    Inventors: Tuo Shi, Tzung-I Su, Yongbo Shao, Dong Pan
  • Patent number: 10578801
    Abstract: A SOI bent taper structure is used as a mode convertor. By tuning the widths of the bent taper and the bend angles, almost lossless mode conversion is realized between TE0 and TE1 in a silicon waveguide. The simulated loss is <0.05 dB across C-band. This bent taper can be combined with bi-layer TM0-TE1 rotator to reach very high efficient TM0-TE0 polarization rotator. An ultra-compact (9 ?m) bi-layer TM0-TE1 taper based on particle swarm optimization is demonstrated. The entire TM0-TE0 rotator has a loss <0.25 dB and polarization extinction ratio >25 dB, worst-case across the C-band.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: March 3, 2020
    Assignee: Elenion Technologies, LLC
    Inventor: Yangjin Ma
  • Patent number: 10571678
    Abstract: According to one aspect, the invention concerns a device for transporting and controlling light pulses for lensless endo-microscopic imaging and comprises: a bundle of N monomode optical fibers (Fi) arranged in a given pattern, each monomode optical fiber being characterized by a relative group delay value (Ax) defined relative to the travel time of a pulse propagating in a reference monomode optical fiber (F0) of the bundle of fibers (40), an optical device for controlling group velocity (50) comprising a given number M of waveplates (Pj) characterized by a given delay (8tj); a first spatial light modulator (51) suitable for forming from an incident light beam a number N of elementary light beams (Bi) each of which is intended to enter into one of said optical fibers, each elementary beam being intended to pass into a given waveplate such that the sum of the delay introduced by said waveplate and the relative group delay of the optical fiber intended to receive said elementary light beam is minimal in abs
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: February 25, 2020
    Assignees: Centre National de la Recherche Scientifique, Université d' Aix-Marseille
    Inventors: Esben Andresen, Hervé Rigneault
  • Patent number: 10551570
    Abstract: A plug of a connector that performs optical transmission is provided with an optical connection unit. The optical connection unit includes a lens that is provided on a side surface of the optical connection unit and performs optical connection with a lens provided on an optical connection unit of a receptacle in a direction orthogonal to an inserting/removing direction of the plug, and a locating surface that is provided on the side surface of the optical connection unit and abuts on a locating surface of the receptacle to determine a position of the optical connection unit in a mating condition of the plug into the receptacle.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: February 4, 2020
    Assignee: YOKOWO CO., LTD.
    Inventors: Akihiro Yodogawa, Hideki Kamitsuna, Ryo Nagase
  • Patent number: 10545300
    Abstract: An optical WDM device on a substrate and a fabrication method are disclosed. The WDM device includes a broadband light source, multiple output optical receivers, and a silicon waveguide terminated with two end reflectors, and a number of sequentially arranged WDM splitters between the two end reflectors. Each of the WDM splitters has a front and rear reflectors. The first end reflector is broadband coated to input light into the waveguide. The front reflectors of the WDM splitters and the second end reflector are narrowband coated so each reflector only selects to reflect one of the wavelengths from the light source. The rear reflectors of the WDM splitters are anti-reflection coated in order to transmit the unselected light to the next stage WDM splitter. The first end reflector is aligned to the input source, the WDM splitters and the second end reflector each are sequentially aligned to the output receivers.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: January 28, 2020
    Assignee: ADOLITE INC.
    Inventors: Abraham Jou, Paul Mao-Jen Wu
  • Patent number: 10539741
    Abstract: [Problem] To provide an optical device capable of suppressing an optical signal from being trimmed because of band narrowing due to optical filters. [Solution] An optical device according to the present invention is provided with a plurality of optical filters each of which filters an optical signal in a predetermined band out of a plurality of optical signals with wavelengths different from one another. The plurality of optical filters are configured in such a way that portions of the pass bands (13_1, 13_2, 13_3) of respective optical filters that respectively pass optical signals (15_1, 15_2, 15_3) with wavelengths adjacent to each other overlap each other.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: January 21, 2020
    Assignee: NEC Corporation
    Inventors: Yurie Matsuyama, Takefumi Oguma
  • Patent number: 10534131
    Abstract: A semiconductor optical integrated device includes: a substrate; at least a lower cladding layer, a waveguide core layer, and an upper cladding layer sequentially layered on the substrate, a buried hetero structure waveguide portion having a waveguide structure in which a semiconductor cladding material is embedded near each of both sides of the waveguide core layer; and a ridge waveguide portion having a waveguide structure in which a semiconductor layer including at least the upper cladding layer protrudes in a mesa shape. Further, a thickness of the upper cladding layer in the buried hetero structure waveguide portion is greater than a thickness of the upper cladding layer in the ridge waveguide portion.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: January 14, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuaki Kiyota, Tatsuya Kimoto, Yusuke Saito
  • Patent number: 10527787
    Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: January 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: Yves Martin, Jason S. Orcutt, Tymon Barwicz, William Green
  • Patent number: 10509173
    Abstract: In the examples provided herein, a system has a first racetrack resonant waveguide structure, positioned to enable an input light signal to couple from a first waveguide; and a second racetrack resonant waveguide structure, positioned to enable the input light signal to couple between the first racetrack resonant waveguide structure and the second racetrack resonant waveguide structure, and further positioned to enable an output light signal to couple from the second racetrack resonant waveguide structure to a second waveguide. The system also has a primary heating unit, positioned to heat a primary region including a first portion of the first racetrack resonant waveguide structure and a first portion of the second racetrack resonant waveguide structure, to change a central frequency and a passband width for the system.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: December 17, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Mir Ashkan Seyedi, Chin-Hui Chen
  • Patent number: 10509260
    Abstract: A data center includes a wavelength source, a first optical component, a first communications device, and a second communications device. The wavelength source is configured to generate an N-wavelength laser beam. The first port of the first optical component is configured to receive an M-wavelength laser beam from the wavelength source. The second port of the first optical component is configured to send the M-wavelength laser beam to the first communications device. The M-wavelength laser beam includes at least a first-wavelength laser beam. The second port of the first optical component is further configured to receive a modulated first optical signal from the first communications device, the modulated first optical signal is obtained after the first communications device modulates a service signal onto the first-wavelength laser beam. The third port of the first optical component is configured to send the modulated first optical signal to the second communications device.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: December 17, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xinhua Xiao, Xiao Andy Shen, Yan Wang
  • Patent number: 10509167
    Abstract: Systems and methods are provided for processing an optical signal. An example system may include a source disposed on a substrate and capable of emitting the optical signal. A first waveguide is formed in the substrate to receive the optical signal. A first coupler is disposed on the substrate to receive a reflected portion of the optical signal. A second waveguide is formed in the substrate to receive the reflected portion from the first coupler. A second coupler is formed in the substrate to mix the optical signal and the reflected portion to form a mixed signal. Photodetectors are formed in the substrate to convert the mixed signal to an electrical signal. A processor is electrically coupled to the substrate and programmed to convert the electrical signal from a time domain to a frequency domain to determine a phase difference between the optical signal and the reflected portion.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: December 17, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Amit S. Sharma, John Paul Strachan, Marco Fiorentino
  • Patent number: 10495832
    Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: December 3, 2019
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Yuzhou Sun, Long Chen, Dengqun Yu, Weilong Lee
  • Patent number: 10495524
    Abstract: A fiber optic distributed sensing system for installation within a wellbore is provided. The system includes a first set of downhole sensors having one or more nuclear sensors with nuclear field sensitivity. The system additionally includes, a second set of downhole sensors having one or more ElectroMagnetic (EM) sensors with electromagnetic field sensitivity. The fiber optic distributed sensing system also includes a processor system configured to receive data measurements from the first and second sets of sensors and configured to conjointly process the data measurements into representations of physical attributes of the wellbore.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: December 3, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Burkay Donderici, Aixa Maria Rivera-Rios, Weijun Guo
  • Patent number: 10495836
    Abstract: A fiber optic enclosure assembly includes a housing having an interior region and a bearing mount disposed in the interior region of the housing. A cable spool is connectedly engaged with the bearing mount such that the cable spool selectively rotates within the housing. A termination module disposed on the cable spool so that the termination module rotates in unison with the cable spool. A method of paying out a fiber optic cable from a fiber optic enclosure includes rotating a cable spool, which has a subscriber cable coiled around a spooling portion of the cable spool, about an axis of a housing of the fiber optic enclosure until a desired length of subscriber cable is paid out. A termination module is disposed on the cable spool.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: December 3, 2019
    Assignee: CommScope Technologies LLC
    Inventors: Scott C. Kowalczyk, Jonathan Walter Coan, Jonathan R. Kaml
  • Patent number: 10495838
    Abstract: A telecommunications cable fixation and sealing system (14) includes a telecommunications cable (18) including a jacket defining a jacket perimeter having a generally non-circular transverse cross-section and an adapter tube (26) slidably placed over the jacket of the telecommunications cable (18), the adapter tube (26) defining a tube perimeter (28) having a generally circular transverse cross-section and defining a throughhole (30) having a generally non-circular transverse cross-section that is configured to receive the telecommunications cable (18).
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: December 3, 2019
    Assignee: CommScope Connectivity Belgium BVBA
    Inventors: Philippe Coenegracht, Mohamed Aznag
  • Patent number: 10488598
    Abstract: The present disclosure relates to a fiber optic component including a ferrule having a distal end and a proximal end. The ferrule defines a fiber passage extending though the ferrule along a fiber passage axis in a proximal-to-distal orientation. The fiber optic component also includes an optical fiber structure affixed within the fiber passage. The optical fiber structure includes a beam expansion section optically coupled to a sacrificial section. The beam expansion section has a construction adapted to expand an optical beam from a first beam diameter to an enlarged second beam diameter. The sacrificial section is configured to receive the optical beam having the second beam diameter from the beam expansion section. The sacrificial section is positioned at the distal end of the ferrule and has a polished end face at the distal end of the ferrule. The sacrificial section has a core-less construction or has a core with a core diameter that is larger than the enlarged second beam diameter.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: November 26, 2019
    Assignees: CommScope Technologies LLC, CommScope Asia Holdings B.V.
    Inventors: Jeroen Antonius Maria Duis, Sander Johannes Floris, Michael Aaron Kadar-Kallen, Dwight Andrew Bretz, Rutger Wilhelmus Smink
  • Patent number: 10488599
    Abstract: The present invention provides a circuit board-mounted optical interconnection system comprising a mounting bracket for holding a board-based first optical connector ferrule; a ferrule alignment housing for mating the first optical connector ferrule with a second optical connector ferrule to form a mated ferrule sub-assembly; wherein the mounting bracket comprises a pair of curved portions; the mated ferrule sub-assembly comprises one or more pivoting features for engaging with the curved portions such that the mated ferrule sub-assembly is rotatable with respect to the mounting bracket. The present invention makes mating and un-mating of the connector ferrules easier, particularly in confined working spaces as with racks in telecommunication cabinets.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: November 26, 2019
    Assignee: Senko Advanced Components, Inc.
    Inventor: Jeffrey Gniadek