Abstract: A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.

Abstract: A developing apparatus, a developing processing method, a developing processing program, and a computer readable recording medium recording the program, which can reduce the consumption amount of the developing solution and the developing processing time irrespective of the type of resist materials or the shape of resist patterns, are provided. A step of horizontally holding a substrate and rotating the substrate around a vertical axis at a prescribed rotation rate, and a step of intermittently supplying a developing solution to a center of the substrate from a discharge port of a developing solution nozzle arranged opposing to the surface of the substrate are executed. In the step of intermittently supplying the developing solution to the center of the substrate, an intermittence time and a substrate rotation rate in the intermittence time are set to prevent the developing solution supplied to the substrate from drying.

Abstract: A device container assembly (30) for storing a reticle (26) includes a device container (246) and a shield assembly (250). The device container (246) encircles the reticle (26). Further, the device container (246) includes a fluid port (254) that allows for the flow of fluid (276) into and out of the device container (246). The shield assembly (250) is encircled by the device container (246). Further, the shield assembly (250) is positioned between the fluid port (254) and the reticle (26) when the reticle (26) is positioned within the device container (246). The shield assembly (250) can inhibit contaminants (278) near the fluid port (254) from being deposited on the reticle (26) and can maintain the integrity of the reticle (26).

Abstract: Projection-optical systems are disclosed that reduce OoB radiation doses on the wafer while reducing deterioration of optical properties of the systems. An exemplary system includes a first reflector having a reflectance for light of a second predetermined wavelength, different from light of a first predetermined wavelength, that is less than a predetermined reflectance. The system also includes a second reflector having a reflectance for light of the second wavelength which is greater than the predetermined reflectance. When the reflectors in the system are classified as reflectors having a high percentage of overlap for the reflecting regions corresponding to two different points on the wafer, and reflectors having a low percentage of overlap for the reflecting regions, then, among the reflectors having a lower percentage of overlap for the reflecting regions, the most upstream reflector in the light path of the system is the second reflector.

Abstract: An immersion lithographic apparatus is disclosed having comprising a pump and buffer volume configured to remove remaining liquid from a substrate, the pump and the buffer volume configured to generate a vacuum cleaning gas flow near the substrate by gas suction into the buffer volume. In an embodiment, since gas flow is needed only a limited amount of time (ordinarily less than 5%), evacuation may be performed using only a moderately powered vacuum pump. In addition or alternatively, the buffer volume may be used as a backup volume buffer configured to provide gas vacuum suction, e.g., in case of a vacuum supply outage.

Abstract: There is provided an optical element comprising an optical element body, a reflecting area and an optical passageway. The optical element body defines an axis of rotational symmetry. The reflecting area is disposed on the optical element body and adapted to be optically used in an exposure process. The optical passageway is arranged within the optical element body and allows light to pass the optical element body, the optical passageway being arranged eccentrically with respect to the axis of rotational symmetry.

Abstract: An illumination optical system that is used for an exposure apparatus that includes a mirror and exposes an object, illuminates a surface to be illuminated using light from a light source, and includes a filter member arranged at a position that substantially has a Fourier transform relationship with the surface to be illuminated, the filter member including a transmittance distribution preset to correct a non-uniformity of a transmittance distribution of the illumination optical system caused by the mirror.

Abstract: A split axis stage architecture is implemented as a multiple stage positioning system that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. The substrate is precisely cut (“lapped”) such that its upper and lower stage surface portions are flat and parallel to each other.

Abstract: An exposure method includes the steps of introducing fluid to a space between a surface of an object to be exposed, and a final surface of a projection optical system, projecting a pattern on a mask onto the object via the projection optical system and the fluid, wherein the introducing step includes the steps of filling the fluid in the space between the surface of the object and the final surface of the projection optical system, and wherein the filling step changes a capillary attraction of the fluid different from the capillary attraction that operates during the projection step.

Abstract: A method of determining temperatures at localized regions of a substrate during processing of the substrate in a photolithography process includes the following steps: independently illuminating a photoresist layer including a photoresist pattern at a plurality of locations on the substrate with a light source, so that light is diffracted off the plurality of locations of the photoresist pattern; measuring the diffracted light from the plurality of locations to determine measured diffracted values associated with respective locations from the plurality of locations; and comparing the measured diffracted values against a library to determine a pre-illumination process temperature of the photoresist layer at the plurality of locations.

Abstract: Methods and apparatus for maintaining the thermal equilibrium of a substrate and an immersion lithographic apparatus are disclosed using or having a timetable comprising information regarding the position, speed and/or acceleration of the substrate; and an evaporation controller and/or condensation controller acting to decrease localized evaporation and/or increase localized condensation in response to the information in the timetable. Evaporation of liquid from the surface of the substrate cools it down, while condensing liquid on its bottom surface heats the substrate locally.

Abstract: A resist film formed on a substrate is coated with a water-repellent protective film and the substrate is subjected to a developing process after the substrate has been processed by an immersion exposure process. The protective film is removed from the substrate after the resist film has been processed by the immersion exposure process, the substrate is processed by a heating process, and then the substrate is subjected to a developing process. The surface of the substrate is cleaned with a cleaning liquid before the protective film is removed and after the substrate has been processed by the immersion exposure process or the surface of the substrate is cleaned with a cleaning liquid after removing the protective film and before the substrate is subjected to the heating process.

Abstract: A stage system for a lithographic apparatus includes a stage, an over-determined number of actuators arranged to act on the stage, and an electric power supply configured to provide a current to the actuators, wherein the current is supplied to a coil associated with a first actuator of the actuators and to a coil associated with a second actuator of the actuators.

Abstract: A system and method are used to independently control multiple parameters of a patterned beam. This can be performed using a patterning device configured to pattern a beam of radiation comprising a controller and an array of stepped mirrors. The array comprises a plurality of sets of four of the stepped mirrors that are controlled with respect to each other. Adjacent ones of the stepped mirrors in each of the sets have perpendicular axes of rotation and perpendicular steps. In one example, the patterning device is used to patterned the beam of radiation, which patterned beam is projected onto an object. For example, the object can be a substrate (e.g., semiconductor substrate or flat panel display substrate) or a display device.

Abstract: A system is used to perform fast and slow applications, for example fast application can be pulse trimming. The system includes a radiation source, an electro-optical modulator, and a beam splitter. The radiation source is configured to generate a polarized beam of radiation. The electro-optical modulator, formed of crystalline quartz, is configured to modulate the beam of radiation. The beam splitter is configured to direct a first portion of the beam to a beam dump and to form an output beam from a second portion of the beam.

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.

Abstract: Aspects of the present disclosure provide a method and a system for closing plate take-over in immersion lithography. A plate holder is provided for a closing plate in a wafer holder of an immersion lithography system. An optical detector is provided below the plate holder for determining whether a light signal passing through the closing plate is aligned with the plate holder using the optical detector. If the light signal is aligned, a fluid containment mechanism is lowered, and the closing plate is placed into the plate holder. Alternatively, the fluid containment mechanism is lowered to surface of the closing plate, the closing plate is affixed to the mechanism, and the mechanism is raised with the closing plate. If the light signal is not aligned, an error is triggered and the scanner is stopped.

Abstract: An exposure apparatus includes a projection optical system for projecting a pattern of a mask onto a substrate, a holder for holding the substrate and having a first channel for the fluid to flow, and a fluid supply unit for supplying the fluid from the first channel of the holder to at least part of a space between the projection optical system and the substrate, the exposure apparatus exposing the substrate via the projection optical system and the fluid.

Abstract: Imaging system of a microlithographic projection exposure apparatus, with a projection objective (200, 300, 500, 600) that serves to project an image of a mask which can be set into position in an object plane onto a light-sensitive coating layer which can be set into position in an image plane, and with a liquid-delivery device (205) serving to fill immersion liquid (202, 310, 507) into an interstitial space between the image plane and a last optical element (201, 309, 506) on the image-plane side of the projection objective; wherein the last optical element on the image-plane side of the projection objective is arranged so that, seen in the direction of gravity, it follows the image plane; and wherein the projection objective is configured in such a way that when the system is operating with immersion, the immersion liquid has at least in some areas a convex-curved surface facing in the direction away from the image plane.

Abstract: In a lithographic apparatus, a slip of a patterning device relative to a support, the support being constructed to support the patterning device, may be provided by: measuring a position of the support relative to a structure of the lithographic apparatus; measuring a position of the patterning device relative to the structure of the lithographic apparatus; determining a correlation between the position of the patterning device and the position of the support; and deriving from the correlation a slip of the patterning device relative to the support. The structure may include a projection system to project a radiation beam patterned by the patterning device onto a target portion of the substrate. The projection system may be connected to a frame, such as a metrology frame of the lithographic apparatus.