Abstract: An acoustic wave component is disclosed. The acoustic wave component can include a bulk acoustic wave resonator and a surface acoustic wave device. The bulk acoustic wave resonator can include a first portion of a ceramic substrate, a first piezoelectric layer positioned on the ceramic substrate, and electrodes positioned on opposing sides of the first piezoelectric layer. The surface acoustic wave device can include a second portion of the ceramic substrate, a second piezoelectric layer positioned on the ceramic substrate, and an interdigital transducer electrode on the second piezoelectric layer.

Abstract: An example integrated circuit package includes an acoustic wave resonator, the acoustic wave resonator including a Fresnel surface. In some examples, the Fresnel surface includes a plurality of recessed features and/or protruding features at different locations on the Fresnel surface, each of the plurality of features to confine main mode acoustic energy from a respective portion of the Fresnel surface in a central portion of the acoustic wave resonator.

Abstract: There are disclosed acoustic resonators and methods of fabricating acoustic resonators. An acoustic resonator includes a piezoelectric plate having front and back surfaces, the back surface facing a substrate. A portion of the piezoelectric plate forms a diaphragm spanning a cavity in the substrate. A conductor pattern on the front surface includes a multi-pitch interdigital transducer (IDT) with interleaved fingers of the IDT on the diaphragm.

Abstract: A filter device includes a filter circuit that is connected to terminals, is defined by a first acoustic wave resonator that has a first frequency band as a pass band, and an additional circuit that is connected in parallel to at least one first acoustic wave resonator between the terminal and the terminal. The additional circuit is defined by a second acoustic wave resonator in which an electromechanical coupling coefficient of the additional circuit is different from an electromechanical coupling coefficient of the filter circuit.

Abstract: Embodiments of this disclosure relate to acoustic wave filters configured to filter radio frequency signals. An acoustic wave filter includes a first bulk acoustic wave resonator on a substrate, a second bulk acoustic wave resonator on the substrate, a conductor electrically connecting the first bulk acoustic wave resonator in anti-series with the second bulk acoustic wave resonator, and an air gap positioned between the conductor and a surface of the substrate. The air gap can reduce parasitic capacitance associated with the conductor. Acoustic wave filters disclosed herein can suppress a second harmonic.

Abstract: Acoustic resonators, acoustic filter devices and methods of making the same. An acoustic resonator device includes a piezoelectric plate having front and back surfaces, and an interdigital transducer (IDT) on the front surface including interleaved fingers. An overlapping distance of the interleaved fingers defines an aperture of the acoustic resonator device. The device further includes a fast region between the aperture and a busbar of the IDT. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode having a first frequency in the piezoelectric plate within a central portion of the aperture and a primary shear acoustic mode having a second frequency in the fast region. The second frequency is higher than the first frequency.

Abstract: A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.

Abstract: A high-frequency module includes a high-frequency switch, filters (21 to 23), (31 to 33), and connection circuits (41 to 46). The high-frequency switch has filter-side terminals (Ps1 to Ps 6). The filters (21, 22, 23) each include a plurality of filters having characteristics different from each other. The filters (31, 32, 33) each include one type of filter. The connection circuits (41, 42, 43) connect the terminals (Ps1, Ps2, Ps3) of the high-frequency switch to the common terminals (Pc21, Pc22, Pc23) of the filters (21, 22, 23), respectively. The connection circuits (44, 45, 46) connect the terminals (Ps4, Ps5, Ps6) of the high-frequency switch to the filters (31, 32, 33), respectively. The connection circuits (41, 42, 43) are shorter than the connection circuits (44, 45, 46).

Abstract: A directional coupler according to various embodiment and an electronic device having the same are provided. The directional coupler includes a first layer having at least one conductive portion, a second layer disposed adjacent to the first layer in a first direction and having at least one conductive plate corresponding to the conductive portion of the first layer, a third layer disposed adjacent to the second layer in the first direction and including an RF signal transmission line, a fourth layer disposed adjacent to the third layer in the first direction and having a conductive line wound with at least one turn, and at least one conductive via electrically connecting the at least one conductive plate of the second layer and the conductive line of the fourth layer which is wound with at least one turn.

Abstract: An acoustic wave filter device includes a longitudinally coupled resonator acoustic wave filter on a series arm that connects an input terminal and an output terminal, first and second parallel arm resonators on first and second parallel arms that connect the series arm and a ground potential, an input-side ground port of the longitudinally coupled resonator acoustic wave filter and a ground port of at least one of the first and second parallel arm resonators are connected in common, an output-side ground port of the longitudinally coupled resonator acoustic wave filter and a ground port of at least another of the first and second parallel arm resonators are connected in common, and an electrostatic capacitance of the first parallel arm resonator is different from an electrostatic capacitance of the second parallel arm resonator.

Abstract: A multiplexer includes first and second filters and additional circuits. The first filter is coupled to transmit and antenna terminals, the second filter is coupled to receive and antenna terminals, one additional circuit is coupled to transmit and receive terminals, and another additional circuit is coupled to transmit and antenna terminals. Pass bands of the first and second filters are respectively first and second frequency bands, and the second frequency band including a center frequency higher than a center frequency of the first frequency band. The one additional circuit includes a first resonator group including first IDT electrodes aligned in a propagation direction of an acoustic wave. The other additional circuit includes a second resonator group including second IDT electrodes aligned in the propagation direction. An average pitch of electrode fingers is greater among the first IDT electrodes than the second IDT electrodes.

Abstract: A directional coupler may include a first coupled section comprising a first and a second coupled transmission lines, the first coupled transmission line having a first end coupled to an input port. The directional coupler may also include a second coupled section comprising a first and a second coupled transmission lines. The directional coupler may also include a third coupled section comprising a first and a second coupled transmission lines. The first coupled transmission line of the third coupled section has a first end coupled to a second end of the second coupled transmission line of the second coupled section and a second end coupled to an output port. The directional coupler may further include a delay section. A total electrical length of the first coupled section, the second coupled section, the third coupled section, and the delay section is about 90 degrees.

Abstract: An acoustic wave component is disclosed. The acoustic wave component can include a bulk acoustic wave resonator and a surface acoustic wave device. The bulk acoustic wave resonator can include a first portion of a glass substrate, a first piezoelectric layer positioned on the glass substrate, and electrodes positioned on opposing sides of the first piezoelectric layer. The surface acoustic wave device can include a second portion of the glass substrate, a second piezoelectric layer positioned on the glass substrate, and an interdigital transducer electrode on the second piezoelectric layer.

Abstract: Networks and filters are disclosed. A network includes a resonator that exhibits both a resonance and an anti-resonance and an inverter circuit connected in parallel with the resonator to form a composite resonator. An anti-resonant frequency of the composite resonator is different from the resonator's anti-resonant frequency.

Abstract: A filter device includes: a common terminal; a first input/output terminal; a second input/output terminal; a first filter connected to a first path that connects the common terminal and the first input/output terminal, and having a passband that is a first band; a second filter connected to a second path that connects the common terminal and the second input/output terminal, and having a passband that is a second band having a frequency range that is different from and does not overlap a frequency range of the first band; a first switch element connected between a first node on the first path between the first filter and the first input/output terminal and a second node on the second path between the second filter and the second input/output terminal; and a second switch element on the second path, which is connected between the second node and the second input/output terminal.

Abstract: A surface acoustic wave device includes a quartz layer, an amorphous silicon oxide layer, a piezoelectric layer, and an Inter Digital Transducer. The amorphous silicon oxide layer is laminated on the quartz layer. The piezoelectric layer is laminated on the amorphous silicon oxide layer. The Inter Digital Transducer is formed on the piezoelectric layer. The Inter Digital Transducer excites a surface acoustic wave on the piezoelectric layer. Assuming that the surface acoustic wave has a wavelength ?, 0.1?a thickness of the amorphous silicon oxide layer/??1, and 0.08<a thickness of the piezoelectric layer/??1.

Abstract: A radio frequency (RF) filter having a first passband and including a first circuit connected to a first node and a second node disposed on a path that connects a first terminal and a second terminal, and a second circuit connected to the first node and the second node. The first circuit includes a first filter having a second passband that includes a portion of a frequency range of the first passband and a bandwidth narrower than a bandwidth of the first passband. The second circuit includes a second filter having a third passband that includes a portion of a frequency range of the first passband and has a bandwidth narrower than the bandwidth of the first passband. The RF filter also includes a first phase shifter connected to a first terminal of the second filter; and a second phase shifter connected to a second terminal of the second filter.

Abstract: A directional coupler having coupling variability at separate portions of an operational frequency band. A frequency selective coupler comprises an input port, an output port, a coupled port, a termination port, a first RF filter coupled to the coupled port, and a second RF filter coupled to the termination port. The first and second RF filters yield a first coupling value at a first portion of the operational frequency band of the coupler and a second coupling value at a second portion of the operational frequency band. The first portion of the band corresponds to a range of frequencies at which higher coupling for the coupler is desired and greater loss in the signal is tolerable. The second portion of the band corresponds to a range of frequencies at which lower coupling for the coupler is tolerable and lower loss in the signal is desirable.

Abstract: A filter circuit has a first frequency band as a pass band and a second frequency band as an attenuation band. The filter circuit includes a 90-degree hybrid coupler, a first filter that is connected to the 90-degree hybrid coupler and has the first frequency band as a pass band, and a second filter that is connected to the 90-degree hybrid coupler and has the second frequency band as a pass band. The second filter includes a first inductor, a resonant circuit, and a second inductor connected in series in this order, a first capacitive element connected between a node on a signal path connecting the first inductor and the resonant circuit and a ground electrode, and a second capacitive element connected between a node on a signal path connecting the second inductor and the resonant circuit and a ground electrode.

Abstract: A high-frequency device includes: a circuit substrate including dielectric layers that are stacked, wiring patterns located on at least one of the dielectric layers, and a passive element formed of at least one of the wiring patterns, the circuit substrate having a first surface that is a surface of an outermost dielectric layer in a stacking direction of the dielectric layers; a terminal for connecting the high-frequency device to an external circuit, the terminal being located on the first surface and electrically connected to the passive element through a first path in the circuit substrate; and an acoustic wave element located on the first surface and electrically connected to the passive element through a second path in the circuit substrate.