Abstract: A poly(p-phenylene terephthalamide) composition is disclosed comprising 50 to 95 weight percent PPD-T and 5 to 50 weight percent PVP along with a process for making the composition and articles made from the composition.

Abstract: Disclosed are compositions and process for the improving the rate or crystallization of polyamide containing compositions which comprise two polyamides having dissimilar melting temperatures, said process comprising the steps of heating the two polyamides to a temperature which is above the melting point of the polyamide having the lower melting temperature but below the melting temperature of the polyamide having the higher melting temperature, as well compositions made in accordance with the process. Preferred polyamides include polycaprolactam and polyhexamethylene adipamide, poly(tetramethylenediamine-co-adipic acid) and further, the inventive compositions may optionally include optional additional constituents. The process provided for improved nucleation without the necessity of inorganic nucleation promoters or agents, and articles made in accordance to the process exhibit good physical properties.

Abstract: The propylene polymer composition of the invention comprises, as its essential components, a specific propylene polymer [A] described below and a propylene block copolymer [B]. In addition to the propylene polymer [A] and the propylene block copolymer [A], the propylene polymer composition may contain a thermoplastic elastomer [C] selected from polystyrene.polyethylene/poybutylene.polystyrene block copolymers and ethylene/.alpha.-olefin random copolymers, or may further contain an inorganic filler [D]. The propylene polymer [A] used in the invention has the following characteristic properties:(1) a boiling heptane-insoluble component is contained in said polymer in an amount of not less than 96% by weight,(2) a pentad isotacticity [M.sub.5 ] of the boiling heptane-insoluble component obtained from the following formula (1) using a .sup.13 C-NMR spectrum is in the range of 0.970 to 0.995: ##EQU1## (3) a pentad tacticity [M.sub.

Abstract: Thermoplastic powder coating compositions including a polyamide and/or polyetheresteramide constituent and an epoxy/sulfonamide resin constituent are well adapted for coating a wide variety of metal substrates, e.g., by electrostatic spraying, without the requirement for first treating such substrates with an adhesion primer.

Abstract: A flexible, thermoplastic, blow moldable composition which comprises a substantially homogeneous blend of A) about 40-60 wt. % polyamide, B) about 20-58 wt. % of a first ethylene copolymer selected from the group consisting of copolymers of ethylene and at least one alpha, beta ethylenically-unsaturated carboxylic acid having 3-8 carbon atoms, and ionomers of said ethylene copolymers, C) about 1-20 wt. % of a second ethylene copolymer having interpolymerized units of ethylene and 1-10 wt. % of an alpha, beta ethylenically-unsaturated aliphatic epoxide, and D) 0.1-0.6 wt. % fibrillatable polytetrafluoroethylene or fibrillatable modified polytetrafluoroethylene.

Abstract: An adhesive composite including a layer consisting of a compatibilized composition including at least one polyamide, and at least one propylene polymer which is at least partially modified by a polar monomer and which has a melt flow index (MFI) measured according to ASTM standard D 1238-86 (230/2.16 conditions) higher than 20 g/10 min., preferably, higher than 50 g/10 min., most preferably such that 70 g/10 min..ltoreq.MFI of the propylene polymer .ltoreq.80 g/10 min.; and a layer consisting of at least one other material which is comprised of at least one cellulosic product and which is bonded to the layer consisting of a compatibilized composition.

Abstract: A resin composition comprises the following components (A) and (B):Component (A): 90 to 10% by weight of modified polyolefin resin obtained by introducing a group selected from a) hydroxyl group, b) epoxy group and c) carboxyl group into a crystalline olefin copolymer consisting of at least one of ethylene and .alpha.-olefins each having 3 to 8 carbon atoms and at least one chain non-conjugated diene;Component (B): 10 to 90% by weight of polyamide resin or saturated polyester resin.This resin composition is suitable for use as a molding material for automotive, electrical parts and the like.

Abstract: Elastomeric compositions having improved heat aging properties are provided by blends of thermoplastic polyester resin and hydrogenated nitrile rubber. The rubber component of the composition is at least partially cured.

Abstract: Novel thermoplastic elastomer compositions, made by dispersing a polyolefin elastomer phase containing functionalized EPM or EPDM in a polyamide resin followed by cross-linking of the elastomer phase, are described. The cross-linked phase exists as discreet particles, providing an overall blend which remains thermoplastic. The resulting blend may be used in the fabrication of elastomeric goods without the need for a separate vulcanization step after the desired object is formed.

Abstract: The present inventions provides polyphenylene ether (PPE)/polyamide (PA) resin compositions having excellent dimensional stability when they absorb moisture, and good mechanical and other properties. Resin compositions of (A) 10-80 wt. parts PPE resins and (B) 90-20 wt. parts PA resins, in which the PA resins (a) are polymers formed by condensation of linear aliphatic diamines with linear aliphatic dicarboxylic acids and aromatic dicarboxylic acids, and (b) have terminal amino group contents of at least 0.4 mequiv/g.

Abstract: A substantially linear poly-vinylarene/polyurethane block copolymer prepared by reacting (1) a difunctional poly-vinylarene which is produced by anionic polymerization and which contains isocyanate-reactive groups, (2) a diisocyanate or an isocyanate prepolymer, and (3) a diol having a high molecular weight or a chain extender having a lower molecular weight, is disclosed to be suitable for the preparation of shaped articles, coatings, coupling agents and compatibilizers.

Abstract: A method for cross-linking chlorinated (co)polymers involves reacting such (co)polymers at between 50.degree. and 230.degree. C. in the absence of solvent with an organometallic amino-type derivative of tin, lead, antimony or bismuth to provide cross-linked compositions and shaped objects.

Abstract: The invention relates to segmented N-alkyl polyurethane amides having an average molecular weight of 5,000 to 250,000, to a process for their production and to their use for the production of materials which may be used in the medical field.

Abstract: A resin composition comprising a melt-kneaded product of (A) an aromatic polyamideimide resin (Component A) which is obtained by polymerizing an aromatic tricarboxylic acid anhydride and a diisocyanate in a solvent under conditions where an amide group is substantially formed first and then an imide group is formed, and which has at least one recurring unit of the formula (1), ##STR1## wherein Ar is a trivalent aromatic hydrocarbon group having at least one 6-membered carbon ring, and R is a divalent aromatic hydrocarbon group or an aliphatic hydrocarbon group, and (B) a polyphenylene sulfide resin (Component B); and the molded article obtained by molding said resin composition.

Abstract: Disclosed is a novel polyethylene composition that is a blend of a polyethylene component having defined properties, a specific quantity of a defined tackifying resin and a very specific minute quantity of a unique amide of a fatty acid. The novel composition can be used in a process for extrusion coating at high speeds and relatively low extrusion coating temperatures with good adhesion to the substrate and dramatically improved chill roll release.

Abstract: Thermoplastic powders well adapted for the direct adherent coating of metal substrates, i.e., without requiring an intermediate adherence primer layer, are based on a polyamide and/or a polyetheresteramide, and contain an effective amount of a polycondensate of an aromatic sulfonamide with an aldehyde or dicarboxylic acid.

Abstract: Filled and unfilled polyamide compositions of improved toughness comprise a blend of a polyamide comprising recurring aliphatic terephthalamide units, a functionalized polyolefin and a functionalized block copolymer comprising styrene polymer blocks and rubber blocks comprising ethylene/propylene ethylene/butylene or ethylene/pentylene polymer blocks or a combination thereof.

Abstract: The invention relates to thermoplastic molding compounds of 70 to 99.5% by weight thermoplastic polyamides and 30 to 0.5% by weight hydrogenated nitrile rubber and 0 to 29.5% by weight thermoplastic resin components and, optionally, standard additives in typical quantities. These thermoplastic molding compounds show high strength values, very good moldability and, above all, high weathering resistance.

Abstract: A solid state chain extension method provides for the formation of a solid state film comprised of a high molecular weight polymer by chain extending a deblocked Lewis base with Lewis acid oligomers while the reactants are in a solid state form. In one embodiment, a negative resist is prepared by selectively exposing regions of the solid state film. The Lewis base is deblocked at the exposed regions by a suitable deblocking means. The Lewis acid oligomers and the deblocked Lewis base chain extend at the exposed regions. Development of the film removes the non-polymerized reactants. Optionally, the Lewis acid oligomers, when radiation-cross-linking, are cross-linked with one another prior to deblocking the Lewis base to form a negative resist. The cross-linked oligomers polymerize with the subsequently deblocked base to provide a high molecular weight polymer film.

Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.