Abstract: [Problem] To provide: a fiber-reinforced composite material having both Mode I interlaminar fracture toughness and compressive strength under wet heat conditions; an epoxy resin composition for producing the fiber-reinforced composite material; and a prepreg produced using the epoxy resin composition. [Solution] An epoxy resin composition comprising at least the following constituents [A], [B] and [C]: [A] an epoxy resin; [B] composite polyamide microparticles which satisfy such a requirement (b1) the materials constituting the particles are a polyamide (B1) and a thermoplastic elastomer resin (B2), such a requirement (b2) that the melting point or the glass transition temperature of the polyamide (B1) is higher than 100° C. and such a requirement (b3) the number average particle diameter is 0.1 to 100 ?m; and [C] a curing agent.

Abstract: A process of formulating a curable thermoset resin formulation is provided that includes reacting a natural cellulosic filler with at least one of: a silsesquioxane, a isocyanate, a base, or an organic acid to form a reduced hydrophilicity filler. By intermixing the resulting reduced hydrophilicity filler with a thermoset cross linkable polymeric resin, a curable thermoset resin formulation is formed that has superior properties to conventional formulations in terms of density and environmental impact. The formulation properties in terms of strength of the cured article are improved relative to untreated natural fillers. The treatment is advantageous relative to plasma treatment. An article is also provided produced upon cure of the formulation.

Abstract: The present invention relates to a process for the preparation of porous particles comprising at least one polyimide by reacting (A) at least one polyisocyanate having on average at least two isocyanate groups per molecule and (B) at least one polycarboxylic acid having at least two COOH groups per molecule or anhydride thereof, in the presence of at least one solvent, optionally at least one catalyst and optionally at least one further additive, to cause precipitation of a polyimide in the solvent to form the porous particles, to porous particles, obtained with this process, to parts, bodies, foams and/or material comprising these porous particles, and to the use of the porous particles or of the parts, bodies, foams and/or material as insulation material and in vacuum insulation.

Abstract: The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

Abstract: A dynamically vulcanized alloy contains at least one isobutylene-containing elastomer, at least one thermoplastic resin, and an anhydride functionalized oligomer grafted to the thermoplastic resin. In the alloy, the elastomer is present as a dispersed phase of small vulcanized or partially vulcanized particles in a continuous phase of the thermoplastic resin and the alloy is substantially absent of any sulfonamides.

Abstract: Embodiments of the disclosure generally provide flame retardant compositions and methods comprising organic polymers, mineral fillers, high surface area mineral fillers and process aids. Compositions of the disclosure additionally are comprised of high surface area hydrated metal carbonate fillers, including the mesoporous amorphous magnesium carbonate filler Upsalite. The filler's porous structure and high surface area provides high water capacity, enhanced physical and chemical interaction with a polymer in composite, lower by weight loadings of filler in a composite, as well as effective flame retardancy.

Abstract: The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

Abstract: The present invention relates to an improved modified polyamide having increased molecular weight and substantially the same or marginally increased viscosity versus shear weight as the unmodified polyamide. A method for modifying polyamides to provide these improved properties also is disclosed wherein a polyamide having an initial molecular weight is contacted with at least one organic peroxide, at least one coagent and/or one free-radical trap to form an improved polyamide having an increased molecular weight and substantially the same viscosity versus shear rate. The present disclosure also relates to polyamide compositions comprising organic peroxides and articles made from the modified polyamide.

Abstract: A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a coating layer around the glass fiber, and wherein the thickness of the coating layer is from 50 nm to 700 nm.

Abstract: Heat resistant ethylene vinyl acetate copolymer compositions comprising a blend of ethylene vinyl acetate copolymer, peroxide curable polyacrylate elastomer, and polyamide are described. When crosslinked with a peroxide curative, the ethylene vinyl acetate copolymer compositions exhibit enhanced resistance to heat aging compared to conventional ethylene vinyl acetate elastomer compositions.

Abstract: A polyimide precursor composition includes a resin having a repeating unit represented by the following Formula (I) and having an imidization ratio equal to or less than 0.2, a cyclic amine compound, and an acyclic aliphatic amine compound, wherein the resin, the cyclic amine compound, and the acyclic aliphatic amine compound are dissolved in an aqueous solvent: wherein in Formula (I), A represents a tetravalent organic group and B represents a divalent organic group.

Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

Abstract: A CDDP complex is formed by complexation of CDDP and a polymer having a structure of Formula (I). The CDDP complex has good biocompatibility and is degradable. A side chain of the polymer is grafted with polyethylene glycol, which gives the CDDP complex good dissolvability. When dissolved in an aqueous medium, the CDDP is protected by a hydrophilic polyethylene glycol chain segment and a hydrophobic amino acid chain segment, which can effectively avoid a sudden release of the CDDP due to the influence of the blood circulation system after intravenous injection, thus improving the stability of the CDDP complex. A carboxyl group contained in the CDDP complex has pH value sensitivity and tends to be deprotonated in a low pH environment, which is advantageous for promoting the release of a drug, and improving the efficiency of the drug.

Abstract: This disclosure relates to a process of purifying a polymer. The process includes (a) providing an organic solution containing a polyimide or polyamic ester in at least one polar, aprotic polymerization solvent; (b) adding at least one purification solvent to the organic solution to form a diluted organic solution, the at least one purification solvent is less polar than the at least one polymerization solvent and has a lower water solubility than the at least one polymerization solvent at 25° C.; (c) washing the diluted organic solution with water or an aqueous solution to obtain a washed organic solution; and (d) removing at least a portion of the at least one purification solvent in the washed organic solution to obtain a solution containing a purified polyimide or polyamic ester. This disclosure also relates to a process of preparing a film on a semiconductor substrate, as well as related purified polymer solutions, films, and articles.

Abstract: New polymeric dielectric materials are provided for high power capacitors, especially for mobile and weapons applications. These materials utilize aminoplast crosslinking in their polymeric structure. The aminoplast crosslinking ability of these materials allows them to be customized for a number of applications, but also allows the materials to have a higher crosslinking density, leading to higher dielectric constants, higher breakdown voltage, and higher thermal stability. These materials can be incorporated into current capacitor manufacturing schemes with little to no processing changes.

Abstract: The invention relates to a process for preparing an amine adduct, in which a polyamine component (A), a polyester component (B) and a hydrocarbon component (C) are reacted. The amine adduct is of particularly good suitability as a wetting agent and dispersant, especially for coatings and plastics applications.

Abstract: A consumable material for use in an additive manufacturing system, the consumable filament comprising a polyamide blend of at least one semi-crystalline polyamide, and at least one amorphous polyamide that is substantially miscible with the at least one semi-crystalline polyamide, and a physical geometry configured to be received by the additive manufacturing system for printing a three-dimensional part from the consumable material in a layer-by-layer manner using an additive manufacturing technique. The consumable material is preferably capable of printing three-dimensional parts having good part strengths and ductilities, and low curl.

Abstract: Provided is a rubber laminated resin composite comprising a polyamide-based resin molded product and rubber that is vulcanization bonded to the polyamide-based resin molded product; the polyamide-based resin molded product being molded from a polyamide-based resin that is blended with 0 to 70 wt. % of a filler based on the total amount of the filler and the polyamide-based resin, and that comprises an aliphatic amine compound having an amine equivalent of 950 or less in an amount of 0.045 mmol or more, preferably 0.050 to 2.0 mmol, more preferably 0.065 to 1.5 mmol, per g of the polyamide-based resin. The rubber laminated resin composite is produced by molding a polyamide-based resin that is blended or not blended with a filler, after the addition of an aliphatic amine compound thereto, and then vulcanization bonding of fluororubber or acrylic rubber to the obtained polyamide-based resin molded product.

Abstract: Disclosed is a semi-aromatic polyamide film including 98 to 90% by mass of a semi-aromatic polyamide (A) and 2 to 10% by mass of a thermoplastic elastomer (B). The semi-aromatic polyamide (A) includes a dicarboxylic acid mainly composed of terephthalic acid and a diamine mainly composed of an aliphatic diamine having 9 carbon atoms. The thermoplastic elastomer (B) has functional groups. The film is a stretched film.

Abstract: Disclosed is a method for manufacturing a polylactic acid film. More specifically, the present invention relates to a method for stably and effectively obtaining optimized stereocomplex crystals through specified boiling point and evaporation time of a solvent allowing the content of stereocomplex crystals to be 100%.