Abstract: Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.
Abstract: Disclosed is a semi-aromatic polyamide film including 98 to 90% by mass of a semi-aromatic polyamide (A) and 2 to 10% by mass of a thermoplastic elastomer (B). The semi-aromatic polyamide (A) includes a dicarboxylic acid mainly composed of terephthalic acid and a diamine mainly composed of an aliphatic diamine having 9 carbon atoms. The thermoplastic elastomer (B) has functional groups. The film is a stretched film.
Abstract: The present invention relates to aqueous secondary copolymer dispersion comprising a copolymer (P) synthesized from a mixture of free-radically polymerizable monomers (M) comprising: (M1) cycloaliphatic esters of acrylic and/or methylacrylic acid; (M3) hydroxy-functional, free-radically polymerizable monomers; (M4) carboxyl-functional, free-radically polymerizable monomers and (M5) hydroxyl- and carboxyl-free (meth)acrylic esters having C1 to C12 hydrocarbon radicals in the alcohol moiety and/or vinylaromatics, wherein the mixture further comprises polyols (PO) selected from the group of polyester polyols and/or polycarbonate polyols, the polyols having an average hydroxyl group functionality of at least 2. The invention also relates to a method for the production of such a dispersion, to the use of the dispersion as a coating and as a binder in 2K polyurethane coatings.
Type:
Grant
Filed:
December 20, 2012
Date of Patent:
February 21, 2017
Assignee:
Covestro Deutschland AG
Inventors:
Marc Claudius Schrinner, Heinz-Dietmar Gewiss, Thomas Stingl, Martin Melchiors
Abstract: The invention relates to a process for preparing an amine adduct, in which a polyamine component (A), a polyester component (B) and a hydrocarbon component (C) are reacted. The amine adduct is of particularly good suitability as a wetting agent and dispersant, especially for coatings and plastics applications.
Type:
Grant
Filed:
November 15, 2012
Date of Patent:
February 21, 2017
Assignee:
BYK-Chemie GmbH
Inventors:
Jürgen Omeis, Stefan Mössmer, Andrea Esser, Monika Roch, Wolfgang Pritschins
Abstract: A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a domain having a diameter of from 5 ?m to 10 ?m in a matrix of the thermoplastic resin.
Abstract: A transparent polyamide resin composition includes a transparent polyamide resin which is a copolymer of an alicyclic diamine and a dicarboxylic acid and which has a refractive index of 1.500 to 1.550, and a transparent crosslinking auxiliary having a refractive index of 1.500 to 1.550, in which the amount of the crosslinking auxiliary added is 13 to 26 parts by mass relative to 100 parts by mass of the transparent polyamide resin, and the crosslinking auxiliary is dispersed, as phases with a diameter of 350 nm or less, in the transparent polyamide resin. A crosslinked transparent polyamide resin molded body is obtained by molding the transparent polyamide resin composition and crosslinking the transparent polyamide resin.
Type:
Grant
Filed:
October 28, 2014
Date of Patent:
February 7, 2017
Assignees:
SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.
Abstract: Disclosed are a polyimide precursor composition that includes a polyamic acid selected from compounds represented by Chemical Formulae 1 to 3, and a combination thereof; and a cross-linking agent selected from a compound represented by Chemical Formula 4, a compound represented by Chemical Formula 5, and a combination thereof; an article including a cross-linked polyimide using the same; and a display device including the article.
Type:
Grant
Filed:
July 17, 2013
Date of Patent:
January 31, 2017
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
Inventors:
Byung Hee Sohn, Sang Soo Lee, Jae Jun Lee, Hyun Jeong Jeon
Abstract: A polyimide precursor composition includes a polyimide precursor including a condensation polymer of a tetracarboxylic dianhydride composed of a first tetracarboxylic dianhydride having a benzene ring to which two carboxylic anhydride groups are bonded and a second tetracarboxylic dianhydride other than the first tetracarboxylic dianhydride, and a diamine compound; a tertiary amine compound; and a water-soluble solvent containing at least one kind selected from the group consisting of water and aqueous alcohol, wherein the polyimide precursor and the tertiary amine compound are dissolved in the water-soluble solvent.
Type:
Grant
Filed:
January 29, 2015
Date of Patent:
January 24, 2017
Assignee:
FUJI XEROX CO., LTD.
Inventors:
Tsuyoshi Miyamoto, Kana Miyazaki, Tomoya Sasaki, Katsumi Nukada
Abstract: The present invention relates to a coating composition in the form of a loose powder including the following by weight: 50% to 99.99% of polyamide powder, and 0.01% to 0.5% of polypropylene glycol, out of the total weight of the composition. The present invention relates in particular to a coating composition in the form of a powder including the following by weight: 50% to 99.9% of polyamide powder, 0.01% to 10% of at least one pigment and 0.01% to 0.5% of polypropylene glycol, out of the total weight of the composition. The present invention relates in particular to the use of said composition in methods for coating objects, in particular metal, by means of stuccoing.
Abstract: This invention relates to the preparation of a dynamically vulcanized alloy comprising at least one elastomer and at least one thermoplastic resin, having a G? at 1% strain and 100° C. as determined according to ASTM D7605 of about 4,500 to about 7,500 kPa. More specifically, the process produces dynamically vulcanized alloys with unique morphological features which have good impermeability and low temperature flexibility. In the process, the thermoplastic resin is added into the extruder in two stages with an intermediate addition of a compatibilizer. Also during the final addition of thermoplastic resin, the elastomeric curatives are added to the extruder.
Type:
Grant
Filed:
April 9, 2015
Date of Patent:
January 17, 2017
Assignee:
ExxonMobil Chemical Patents Inc.
Inventors:
Hari P. Nadella, Maria D. Ellul, Ronald DeYoung
Abstract: This invention relates to the preparation of a dynamically vulcanized alloy comprising at least one elastomer and at least one thermoplastic resin. More specifically, the process produces dynamically vulcanized alloys with unique morphological features which have good impermeability and low temperature flexibility. In the process, the thermoplastic resin is added into the extruder in two stages with an intermediate addition of a compatibilizer. Also during the final addition of thermoplastic resin, the elastomeric curatives are added to the extruder.
Type:
Grant
Filed:
October 15, 2013
Date of Patent:
January 17, 2017
Assignee:
ExxonMobil Chemical Patents Inc.
Inventors:
Ronald DeYoung, Maria D. Ellul, Dennis Kumor, Ronald Keith Waters
Abstract: A nonskid/nonslip composition having: a mixture or a reaction product of an amino-functional polysiloxane and a non-aromatic epoxy, a polyamide polymer, and an abrasive aggregate.
Type:
Grant
Filed:
April 21, 2015
Date of Patent:
January 10, 2017
Assignee:
The United States of America, as represented by the Secretary of the Navy
Abstract: A pet chew toy comprising a blend containing a polyamide terpolymer and a diene elastomer, wherein the diene elastomer is crosslinked and the polyamide terpolymer has a Tm in the range of 120° C. to 250° C.
Abstract: Provided is a polyether polyamide composition including 100 parts by mass of a polyether polyamide in which a diamine constituent unit thereof is derived from a specified polyether diamine compound and a xylylenediamine, and a dicarboxylic acid constituent unit thereof is derived from an ?,?-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms, having blended therein from 0.01 to 15 parts by mass of at least one molecular chain extender selected from a carbodiimide compound and a compound containing two or more epoxy groups in a molecule thereof.
Abstract: A polyimide precursor composition includes a polyimide precursor including a condensation polymer of a tetracarboxylic dianhydride containing a first tetracarboxylic dianhydride having a benzene ring to which two carboxylic anhydride groups are bonded, and a second tetracarboxylic dianhydride other than the first tetracarboxylic dianhydride, and a diamine compound; and a first aqueous solvent containing water and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent, a water-soluble ketone solvent, and a water-soluble alcohol solvent, or a second aqueous solvent containing a water-soluble alcohol solvent and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent and a water-soluble ketone solvent, wherein the polyimide precursor is dissolved in the first aqueous solvent or the second aqueous solvent.
Type:
Grant
Filed:
January 28, 2015
Date of Patent:
November 29, 2016
Assignee:
FUJI XEROX CO., LTD.
Inventors:
Tsuyoshi Miyamoto, Kana Miyazaki, Tomoya Sasaki, Katsumi Nukada
Abstract: A thermoplastic resin composition contains a polyamide resin that is dispersed therein, is characterized in that the thermoplastic resin composition is obtained by melting and kneading a polyolefin resin and a mixed resin obtained by melting and kneading a polyamide resin and a compatibilizer; and the compatibilizer is a modified elastomer that is obtained by providing an elastomer (such as an olefin-based thermoplastic elastomer or a styrene-based thermoplastic elastomer) with a reactive group that is reactive with the polyamide resin. Also, a thermoplastic resin composition is obtained by melting and kneading from 1% by mass to 80% by mass (inclusive) of a plant-derived polyamide resin such as polyamide 11, from 5% by mass to 75% by mass (inclusive) of a polyolefin resin and from 1% by mass to 30% by mass (inclusive) of a compatibilizer that is an olefin-based thermoplastic elastomer that is modified with an acid.
Type:
Grant
Filed:
December 21, 2012
Date of Patent:
November 15, 2016
Assignees:
TOYOTA BOSHOKU KABUSHIKI KAISHA, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
Abstract: Methods of making fiber-resin compositions are described. The methods may include the providing of a thermoplastic resin to an extruder, where the thermoplastic resin may include at least one reactive moiety capable of forming a covalent bond with a coupling agent on a plurality of reactive fibers. The methods may further include combining the thermoplastic resin with the plurality of reactive fibers also supplied to the extruder. The reactive fibers are sized with the coupling agent that reacts with the thermoplastic resin to form the fiber-resin composition, which may be extruded from the extruder. Methods of making fiber-reinforced composite articles from the fiber-resin composition are also described.
Type:
Grant
Filed:
November 22, 2013
Date of Patent:
November 15, 2016
Assignee:
Johns Manville
Inventors:
Michael J Block, Mingfu Zhang, Asheber Yohannes, Klaus Friedrich Gleich, Jawed Asrar
Abstract: Piezoelectric compositions are provided wherein mechanical and piezoelectric properties can be separately modulated. Preferred compositions include resin blends that comprise: (a) a piezoelectrically active polymer and (b) a matrix polymer, methods of making, and use of such resin blends. Advantages of preferred resin blends of the invention can include high piezoelectricity, mechanical strength and flexibility, convenient fabrication process, and high sensitivity at high temperatures.
Type:
Grant
Filed:
January 2, 2014
Date of Patent:
November 1, 2016
Assignee:
The Johns Hopkins University
Inventors:
Michael Yu, James E. West, Ilene J. Busch-Vishniac, Dawnielle Farrar
Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts).
Abstract: In a method of preparing polyalkyleneimines from alkyleneimines in the presence of a liquid solvent, and a catalyst, the preparing is effected semi-discontinuously in one reaction container. The preparing is optionally effected in the presence of further additives. Polyalkyleneimines obtained by such methods and formulations thereof likewise form part of the subject matter of the invention, especially those having a low proportion of chloride-containing compounds. Such polyalkyleneimines have uses in the field of medical technology, printing media, wastewater treatment, surface treatment, cosmetics, laundry detergents, biotechnology, packaging, electronics, paper, building construction chemistry, textiles, chromatography, ion exchangers, oil industry, ceramics, glass, membrane technology, catalysts, electroplating, biocides or wood protection.
Type:
Grant
Filed:
December 9, 2013
Date of Patent:
November 1, 2016
Assignee:
BASF SE
Inventors:
Stephan Hueffer, Andreas Kramer, Frank Dietsche