Abstract: A temperature-dependent switch having a housing with an upper part and a lower part, wherein a first and a second stationary contact are arranged on the housing, and a temperature-dependent switching mechanism having a movable contact member. In its first switching position, the switching mechanism presses the movable contact member against the first contact and thereby produces an electrically conductive connection between the two contacts via the contact member, and, in its second switching position, keeps the movable contact member spaced apart from the first contact. A closing lock prevents the switch, once having opened, from closing again by locking the switching mechanism permanently in its second switching position in a mechanical manner.

Abstract: A flash double-temperature linkage temperature controller has an arrangement that enables contacts of two movable contact sheet sets and two static contact sheet sets to sequentially operate at different temperatures, and a desired fixed temperature difference is obtained. The two movable contact sheet sets are respectively connected to the two static contact sheet sets to control two electric heating tubes, so that the effect whereby two electric heating tubes (high power) work during water heating and a single electric heating tube (low power) works during heat preservation heating is achieved, and the working frequency of the high-power contact sets is greatly reduced.

Abstract: An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.

Abstract: A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.

Abstract: A case for use with a portable computing device is provided. The case comprises a housing for protecting the portable computing device. The housing is configured to attach to the portable computing device. The case further comprises a multiport hub and/or a data storage device contained within the housing. The multiport hub is configured to be electrically connected to the portable computing device.

Abstract: A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.

Abstract: A varistor component and a method for securing a varistor component are disclosed. In an embodiment a varistor component includes a first external contact, a second external contact, a varistor electrically connected to the first external contact, a path between the varistor and the second external contact and an active releasing device having a shutter and a heat sensitive element, wherein, under abnormal operation conditions, the heat sensitive element releases the shutter, and the shutter moves along a straight line and closes the path between the varistor and the second external contact.

Abstract: A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.

Abstract: A cooling apparatus is disclosed for cooling an electronic device, the apparatus including a conductive mounting bracket to couple with an electronic device housing and a heat sink integrated with the conductive mounting bracket. The cooling apparatus further includes a heat pipe coupled with the conductive mounting bracket on a first side of the heat pipe, the heat pipe to be directly coupled with a targeted electronic component within the electronic device, on a second side of the heat pipe. The apparatus may further include a conductive mounting interface attached to the electronic device housing to attach to the conductive mounting bracket. A mounting receptacle deployed within the conductive mounting interface may be used to expose the targeted electronic component.

Abstract: A switchgear assembly includes a plurality of switches arranged in a row and a plurality of gas insulated bus assemblies arranged in a row parallel to the row of switches. The bus assemblies have gas containment enclosures with respective bus sections therein electrically connected to one another by first connectors outside of the gas containment enclosures and electrically connected to respective ones of the switches by second connectors outside of the gas containment enclosures.

Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

Abstract: To provide a vacuum pump capable of efficiently cooling electrical equipment. The vacuum pump includes a pump main body and an electrical equipment case disposed outside the pump main body, wherein the electrical equipment case includes a cooling jacket which has an inner surface and an outer surface in a vertical portion and in which a cooling medium flow passage is formed, and a plurality of electrical equipment that have circuit components and can be cooled by the cooling jacket. The inner surface and the outer surface are formed facing different directions, and the electrical equipment portions are attached respectively to the inner surface and the outer surface so that heat can be transferred.

Abstract: A fusible switch disconnect device includes a housing adapted to receive at least one fuse therein, and a switchable contact for connecting the fuse to circuitry. A tripping mechanism and control circuitry are provided to move the switchable contact to an open position in response to a predetermined electrical condition.

Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

Abstract: An electrical fuse includes a housing, first and second terminal assemblies coupled to the housing, and at least one fuse element assembly extending internally in the housing and coupled between the first and second terminal assemblies. A filler surrounds the at least one fuse element assembly, and the filler includes sodium silicate sand and at least one reinforcing structure suspended within the filler.

Abstract: An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.

Abstract: An electronic device includes a printed board, a frame for fixing the printed board, a connector fixed at a position along one side of a front surface of the printed board, and an electrically conductive member. An indented portion is formed at a position of the one side facing the connector. The electrically conductive member has a portion arranged in the indented portion, and is expanded and contracted in a direction along the one side and a thickness direction of the printed board by an external force. The electrically conductive member has an upper surface, a lower surface, and a side surface in contact, respectively, with a shell of the connector, one surface of the frame, at least one side-surface portion which is part of a portion forming the indented portion and extends along a direction crossing the one side. The electrically conductive member is electrically connected with a ground of the printed board via the side-surface portion.

Abstract: The disclosure relates to an immersion cooling apparatus configured to accommodate and cool at least one heat source. The immersion cooling includes a tank, a coolant, and at least one condenser. The coolant is accommodated in the tank and configured to direct thermal contact the at least one heat source. At least part of the at least one condenser is immersed in the coolant.