Abstract: A display device and a manufacturing method thereof are provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

Abstract: Disclosed are a display panel, a display device, and a terminal apparatus. The display panel comprises a display substrate having a backlight surface and a main flexible circuit board. The main flexible circuit board comprises a connection section, a fixed section and a test section. The connection section is arranged on the backlight surface, and has an outer peripheral surface comprising a first side and a second side opposite to each other. The fixed section is attached and fixed onto the backlight surface, and having one end connected to the first side and another end extending towards an end of the first side away from the second side. The test section has one end connected to the first side, and another end comprising a connection port.

Abstract: A flexible electronic device is provided in this disclosure. The flexible electronic device includes a base layer, an electronic unit, and a cover layer. The electronic unit is disposed on the base layer, and the cover layer is disposed on the electronic unit. The base layer has a thickness T1 and a Young's modulus E1, and the cover layer has a thickness T2 and a Young's modulus E2, wherein the thickness T1, the thickness T2, the Young's modulus E1, and the Young's modulus E2 comply with following expression: E2/E1?156.21×(T2/T1)?4.28.

Abstract: A power connector assembly transferring power between a supply connector assembly and a tap connector assembly includes a front interface module mated with the supply connector assembly and a rear interface module mounted to a host circuit board. The power connector assembly includes a power tap module between the front interface module and the rear interface module having power tap contacts each electrically connected to corresponding front and rear power contacts. Each power tap contact includes a tap interface exterior of the front housing and exterior of the rear housing configured to be terminated to the tap connector assembly. The power tap contact electrically connecting the front power contact and the tap connector assembly to transfer power from the supply connector assembly to the tap connector assembly.

Abstract: A wearable product includes a display system, a rear housing, a middle frame, a printed circuit board, and a conductive component. The rear housing is located on a non-light-emitting side of the display system. The middle frame is located between the display system and the rear housing, and is a hollow frame structure. The middle frame includes a metal frame and a plastic frame nested in the metal frame and connected to the metal frame. The plastic frame is connected to the display system and the rear housing in a sealing manner to form an accommodation cavity. The printed circuit board is located in the accommodation cavity. A part of the conductive component is located in the accommodation cavity and electrically connected to the printed circuit board, and the other part of the conductive component passes through the plastic frame to be electrically connected to the metal frame.

Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.

Abstract: A power semiconductor system includes: a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board; and an inductor module attached to the power stage module and having an inductor electrically connected to an output node of the power stage module. The inductor includes windings patterned into a second printed circuit board of the inductor module.

Abstract: Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

Abstract: Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

Abstract: A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.

Abstract: An electronic device includes a flexible substrate, an anisotropic conductive film, and an electronic element. The flexible substrate includes an active area, a bonding pad, and a plurality of protrusions located on the bonding pad. The anisotropic conductive film includes a plurality of conductive particles. The conductive particles are in contact with the protrusions. The anisotropic conductive film is located between the bonding pad of the flexible substrate and the electronic element.

Abstract: A splicing display screen is provided. The splicing display screen includes a circuit board, a plurality of display panels, and a plurality of first metal lines. The circuit board includes a plurality of circuit areas, and each of the circuit areas includes one of mounting areas and one of electrical connection areas. A plurality of first metal parts are disposed in the electrical connection areas. The display panels are disposed on the circuit board and positioned in the mounting areas, and metal connection pads on the display panels are electrically connected to the first metal parts by the first metal lines.

Abstract: A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the surface mounting technology; and a wire connection connected to the wireless communication part and power supply and connected to the main board by means of a wire, wherein the main board comprises a main processor for controlling the operation of an electronic device.

Abstract: Capacitor assembly, comprising a printed circuit board comprising a first conductive trace and a second conductive trace, and a first row of capacitors comprising a plurality of surface mounted capacitor elements. Each of the plurality of surface mounted capacitor elements comprises a pair of outer electrodes, one of the pair being mounted to the first conductive trace and defining a first junction, and the other one being mounted to the second conductive trace defining a second junction. The first junction and the second junction define a first capacitor longitudinal axis. The first conductive trace has a first current flow direction with a first oblique angle relative to the first capacitor longitudinal axis.

Abstract: A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.

Abstract: According to various embodiments, an electronic device may include: a housing including a first space; a slide structure including a first surface directed in a first direction and a second surface directed in a second direction opposite the first direction, and slidably combined with the housing; a bendable member connected to the slide structure, and at least partly accommodated in the first space in a slide-in state and forming a same plane as the slide structure in a slide-out state; a flexible display supported by the bendable member and the slide structure; a first substrate disposed in the first space; at least one electronic component disposed in a second space between the first surface of the slide structure and the flexible display; and at least one electrical connection member electrically connecting the flexible display to the first substrate.

Abstract: According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

Abstract: A transmission line includes a first structure including a first flexible resin base material, and a first ground conductor thereon, a second structure including a second flexible resin base material, and a first signal line and an interlayer connection conductor in or on the second resin base material, a first spacer between the first and second structures, and a first metal joining material joining the first and second structures with the first spacer interposed therebetween. A first hollow portion is between the first and second structures with the first spacer interposed therebetween. The first signal line and the first ground conductor face each other in a joining direction with the first hollow portion interposed therebetween. The first resin base material and the second resin base material are not in contact with each other. The first metal joining material has a melting point lower than that of the interlayer connection conductor.

Abstract: Provided is an array substrate. The array substrate includes at least one pad group disposed in a peripheral region of a base substrate, wherein the at least one pad group includes a sector pad group in which the pads are distributed in a sector shape. Therefore, the bonding yield between the array substrate and the circuit board is increased.