Abstract: The present disclosure relates to a printed circuit board assembly, which includes: a first printed circuit board, printed with a first transmission trace; a second printed circuit board, printed with a second transmission trace; a substrate, in which, the provides a through aperture for a radio frequency connector; and a radio frequency connector, which includes an inner contact portion, an housing and an insulating part provided between the inner contact portion and housing, where the radio frequency connector is configured to be received in and pass through the through aperture, such that a first end of the inner contact portion of the radio frequency connector is electrically connected to the first transmission trace and a second end thereof is electrically connected to the second transmission trace, so that a first end of the housing of the radio frequency connector is electrically connected to a ground layer of the first printed circuit board and a second end thereof is electrically connected to the gro

Abstract: There is provided a radio-frequency module and a communication device with which miniaturization can be achieved and quality deterioration can be suppressed. A radio-frequency module includes a mount board on which a ground terminal is disposed, a first chip, a second chip, and a cover (a shield cover). The first chip is disposed on the mount board. The second chip is disposed on the first chip. The cover covers at least a part of the first chip and at least a part of the second chip. The second chip has a first connection terminal (a ground terminal) on an opposite side from the first chip in a thickness direction of the mount board. The cover includes a shield layer connected to the ground terminal disposed on the mount board. The first connection terminal is connected to the shield layer.

Abstract: An electronic device with parallel backplanes and a storage device with parallel backplanes. The electronic device includes a front inserting assembly, a rear inserting assembly, and a backplane assembly. The backplane assembly is connected to the front inserting assembly and the rear inserting assembly. The backplane assembly includes a plurality of backplanes arranged in parallel at intervals, the front inserting assembly includes a plurality of first units whose arrangement direction is the same as an arrangement direction of the backplanes, and the rear inserting assembly includes a plurality of second units whose arrangement direction intersects the arrangement direction of the backplanes. The backplane assembly is provided with the structure including the plurality of backplanes arranged in parallel at intervals and the channel between adjacent backplanes. In addition, the first units and the second units are connected to two opposite sides of the backplanes, respectively.

Abstract: An FPC connection structure including: several strands of FPC conductor patterns coated with an insulating film; and FPC terminals each extending from one end portion of each of the FPC conductor patterns and provided in a flat type to enable spot welding on a substrate terminal unit provided on the printed circuit board.

Abstract: A power electronics converter includes a carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes a power semiconductor switching element included in a power semiconductor prepackage. The power semiconductor prepackage includes a power semiconductor switching element and an electrical connection extending from a terminal of the power semiconductor switching element to an electrical connection side of the power semiconductor prepackage. The power electronics converter includes a heat sink arranged to remove heat from the power semiconductor prepackage, a thermal interface layer arranged between the heat removal side of the power semiconductor prepackage and the heat sink, and an electrical isolation layer arranged between the power semiconductor switching element and the heat sink. A product of a thermal conductivity of the thermal interface layer and a breakdown electric field strength of the electrical isolation layer is greater than or equal to 5 MVW/m2K.

Abstract: A printed circuit board includes: a first insulating layer including a first cavity and a second cavity; a first electronic component disposed in the first cavity and including a first pad disposed in a first surface direction of the first insulating layer; a second electronic component disposed in the second cavity and including a second pad disposed in a second surface direction, facing the first surface direction, of the first insulating layer; a second insulating layer disposed on each of first and second surfaces of the first insulating layer and in the first cavity to cover the first electronic component; and a third insulating layer disposed on the first surface of the first insulating layer and in the second cavity to cover the second electronic component.

Abstract: To reduce crosstalk between bond wires, one illustrative integrated circuit includes an array of photoemitters arranged along a centerline, with adjacent photoemitters having contact pads on opposite sides of the centerline. An illustrative assembly includes an integrated circuit chip having an array of photoemitter contact pads; a printed circuit board having a recess in which the integrated circuit chip is mounted; and bond wires connecting the contact pads with respective contact pads on the printed circuit board. An illustrative cable connector includes a module that optically couples optical fibers to an array of photoemitters on an integrated circuit chip mounted to a printed circuit board. Each photoemitter has contact pads connected to the printed circuit board contact pads by bond wires, the bond wires for each photoemitter being routed in an opposite direction relative to the bond wires for any adjacent photoemitters in the array.

Abstract: A printed circuit board which improves the peel strength of a wiring pattern formed at a cavity bottom portion while enabling connection between an electronic component inside a cavity and a circuit outside the cavity to be performed at the cavity bottom portion, includes a cavity in a partial region of a multilayer substrate laminated with an insulating resin layer and an electrical conductor layer on a bottom layer of an insulating resin substrate. The cavity opens on a side of the insulating resin substrate, penetrates the insulating resin substrate, and includes a surface of the insulating resin layer as a bottom surface. The electrical conductor layer has a surface, the surface having a height equivalent to a height of the surface of the insulating resin layer and being embedded in the insulating resin layer in a manner to form a portion of the bottom surface.

Abstract: A printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. The pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. The dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.

Abstract: One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.

Abstract: A communication module includes a first wiring board including a plurality of first signal lines and a first ground line, and a second wiring board including a first layer and a second layer. The first layer includes a plurality of second signal lines. The second layer includes a shielding member. The communication module includes a plurality of first connection members via which the plurality of first signal lines are electrically connected to the plurality of second signal lines, and at least one conductive member provided between the first ground line and the shielding member. The at least one conductive member is provided so as to overlap with at least one second signal line among the plurality of second signal lines as viewed in a direction perpendicular to a main surface of the first wiring board.

Abstract: An interconnecting device for a signal plate and an interconnecting method therefor, relating to the technical field of server signal plate interconnection. The interconnecting device includes a back plate and a fine-adjustment device. The back plate includes a transverse plate and a vertical plate. Multiple sliding grooves are provided on the transverse plate and the vertical plate. A fine-adjustment device is provided on two sides of each of the sliding grooves. The interconnecting method for the signal plate comprises the following steps: (I) an IO plate is inserted into a vertical plate, (II) a CPU plate is inserted into a transverse plate; and (III) the IO plate and the CPU plate are finely adjusted and inserted.

Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first portion arranged around the electrical connection pin and a second portion located radially outward of the first portion.

Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.

Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.

Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

Abstract: A method electrically insulates an electronic device including a housing having a first face provided with a first opening closed by a PCB and a second face provided with a second opening extending facing at least a portion of at least one connection interface in which at least one first connector is connected. The method includes the steps of forming a mold around the connection interface, and while the device is placed in a vacuum enclosure, pouring a liquid resin into the mold in order to form a layer of electrically insulating material between the connector and the connection interface. A device is obtained by performing the method.

Abstract: A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

Abstract: A flexible circuit board for a continuous analyte monitoring (CAM) device includes a plurality of physically separate circuit board cells each having circuitry thereon. The flexible circuit board also includes a plurality of flexible interconnections each connecting one of the physically separate circuit board cells to another of the physically separate circuit board cells. Each one of the flexible interconnections is operable to couple power, electrical signals, or both to the physically separate circuit board cells connected thereto. The flexible circuit board is bendable in multiple directions in three dimensions. Methods of constructing flexible circuit boards for CAM devices are also provided, as are other aspects.